Patents by Inventor Manwoo HEO

Manwoo HEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor light emitting device packages
    Patent number: 10461226
    Abstract: Provided is a semiconductor light emitting device package. The semiconductor light emitting device package includes a substrate, a semiconductor light emitting device on the substrate, and an encapsulation layer which covers the semiconductor light emitting device. The encapsulation layer includes a plurality of ring portions which are disposed sequentially from an edge toward a center of the substrate in plan view, and a center portion which is surrounded by an innermost one of the plurality of ring portions.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: October 29, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Manwoo Heo
  • SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGES
    Publication number: 20170236984
    Abstract: Provided is a semiconductor light emitting device package. The semiconductor light emitting device package includes a substrate, a semiconductor light emitting device on the substrate, and an encapsulation layer which covers the semiconductor light emitting device. The encapsulation layer includes a plurality of ring portions which are disposed sequentially from an edge toward a center of the substrate in plan view, and a center portion which is surrounded by an innermost one of the plurality of ring portions.
    Type: Application
    Filed: January 24, 2017
    Publication date: August 17, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Manwoo HEO