Abstract: A double-frequency antenna structure with a high degree of electrical isolation between long distance and short distance antennas includes a dielectric substrate having at least two corners and a center area. A first set of antenna arrays is positioned at the corners. A second set of antenna arrays is positioned at the center area. At least one first folded isolation plate is mounted on the dielectric substrate, and positioned between the first set of antenna arrays and the second set of antenna arrays. At least one second folded isolation plate each is mounted on one first folded isolation plate.

Abstract: A double-frequency antenna structure with a high degree of electrical isolation between long distance and short distance antennas includes a dielectric substrate having at least two corners and a center area. A first set of antenna arrays is positioned at the corners. A second set of antenna arrays is positioned at the center area. At least one first folded isolation plate is mounted on the dielectric substrate, and positioned between the first set of antenna arrays and the second set of antenna arrays. At least one second folded isolation plate each is mounted on one first folded isolation plate.

Abstract: A double-frequency antenna structure with a high degree of electrical isolation between long distance and short distance antennas includes a dielectric substrate having at least two corners and a center area. A first set of antenna arrays is positioned at the corners. A second set of antenna arrays is positioned at the center area. At least one first folded isolation plate is mounted on the dielectric substrate, and positioned between the first set of antenna arrays and the second set of antenna arrays. At least one second folded isolation plate each is mounted on one first folded isolation plate.

Abstract: A double-frequency antenna structure with a high degree of electrical isolation between long distance and short distance antennas includes a dielectric substrate having at least two corners and a center area. A first set of antenna arrays is positioned at the corners. A second set of antenna arrays is positioned at the center area. At least one first folded isolation plate is mounted on the dielectric substrate, and positioned between the first set of antenna arrays and the second set of antenna arrays. At least one second folded isolation plate each is mounted on one first folded isolation plate.

Abstract: A powered device is electronically connected to power sourcing equipment (PSE), to receive voltage signals from the PSE. The powered device comprises a rectifier unit, a recognition unit, a control unit, a converter and a powered circuit. The recognition unit identifies that the PSE is an Ethernet PSE or a DC PSE. The control unit controls whether the control unit output a negative voltage signal output by the rectifier unit, according to a positive voltage signal output by the rectifier unit and a identified result output by the recognition unit. The converter converts the negative voltage signal and the positive voltage signal to a working voltage of the powered circuit, to drive the powered circuit. To feed power by a single interface and identify that the PSE is the Ethernet PSE or the DC PSE, according to a simple circuit architecture.

Abstract: An electronic device includes a washer, a printed circuit board, and a screw. The printed circuit board includes a copper foil, a detecting unit and a processing unit. The copper foil comprises a plurality of electrical signal interfaces surrounding a first via defined in the copper foil. The washer defines a second via and includes a transmission metal. The screw combines the printed circuit board and the washer through the second via and the first via. The detecting unit stores an original logic level signal, and detects logic level signals of the electrical signal interfaces in real-time. The processing unit compares the original logic level signal and the detected logic level signal, to determine whether the electronic device is disassembled. If the electronic device is disassembled, the electronic device stops working.

Abstract: A powered device is electronically connected to power sourcing equipment (PSE), to receive voltage signals from the PSE. The powered device comprises a rectifier unit, a recognition unit, a control unit, a converter and a powered circuit. The recognition unit identifies that the PSE is an Ethernet PSE or a DC PSE. The control unit controls whether the control unit output a negative voltage signal output by the rectifier unit, according to a positive voltage signal output by the rectifier unit and a identified result output by the recognition unit. The converter converts the negative voltage signal and the positive voltage signal to a working voltage of the powered circuit, to drive the powered circuit. To feed power by a single interface and identify that the PSE is the Ethernet PSE or the DC PSE, according to a simple circuit architecture.

Abstract: An electronic device includes a washer, a printed circuit board, and a screw. The printed circuit board includes a copper foil, a detecting unit and a processing unit. The copper foil comprises a plurality of electrical signal interfaces surrounding a first via defined in the copper foil. The washer defines a second via and includes a transmission metal. The screw combines the printed circuit board and the washer through the second via and the first via. The detecting unit stores an original logic level signal, and detects logic level signals of the electrical signal interfaces in real-time. The processing unit compares the original logic level signal and the detected logic level signal, to determine whether the electronic device is disassembled. If the electronic device is disassembled, the electronic device stops working.

Abstract: A method of fabricating a multi-trace via substrate is disclosed. A substrate at least having a first surface and a hole is provided, wherein the hole has a hole wall. A first conductive layer is formed on the entire surface of the substrate and the hole wall. A photoresist layer applied over the entire surface of the first conductive layer is selectively patterned to define a plurality of laterally separated regions on the first conductive layer. A patterned photoresist layer is used as a mask and a second conductive layer substantially thicker than the first conductive layer is electroplated on the laterally separated regions. The patterned photoresist layer is removed. The portion of the first conductive layer not covered by the second conductive layer is substantially removed to form a plurality of laterally separated traces extended on the first surface and through the hole.

Abstract: A RF front end circuit includes a processor, a main receiving (Rx) path and an adjustment path connected between the processor and an external antenna array in parallel, and a coupling module coupled with the main Rx path. The adjustment path includes an adjustment transmitting (Tx) path, an adjustment Rx path, and a DSP. The adjustment Tx path includes a coupling switch. When the circuit operates in an adjustment mode, the switch is connected to the coupling module, the adjustment Rx path receives and demodulates a first analog signal, the DSP converts the first analog signal to a digital signal, clipping a peak of the digital signal, and converts the digital signal to a second analog signal, the adjustment Tx path modulates and reverses the phase of the second analog signal, and the coupling module couples the second analog signal to the main Rx path to counteract noise received thereby.

Abstract: A RF front end circuit includes a processor, a main receiving (Rx) path and an adjustment path connected between the processor and an external antenna array in parallel, and a coupling module coupled with the main Rx path. The adjustment path includes an adjustment transmitting (Tx) path, an adjustment Rx path, and a DSP. The adjustment Tx path includes a coupling switch. When the circuit operates in an adjustment mode, the switch is connected to the coupling module, the adjustment Rx path receives and demodulates a first analog signal, the DSP converts the first analog signal to a digital signal, clipping a peak of the digital signal, and converts the digital signal to a second analog signal, the adjustment Tx path modulates and reverses the phase of the second analog signal, and the coupling module couples the second analog signal to the main Rx path to counteract noise received thereby.

Abstract: A wireless transceiver includes an antenna, a filter, a radio frequency (RF) signal processing circuit, a shared amplifying circuit, a first switch circuit, a second switch circuit, a sending power amplifier, and a single-pole double-throw (SPDT) switch. The filter is connected between the antenna and the SPDT switch. The RF signal processing circuit outputs a first control signal when the antenna is utilized to send RF signals, and outputs a second control signal when the antenna is utilized to receive RF signals. The first switch circuit is connected between the shared amplifying circuit and the sending power amplifier, and switches on according to the first control signal. The second switch circuit is connected between the shared amplifying circuit and the SPDT switch, and switches on according to the second control signal. The SPDT switch selectively connects the filter to the sending power amplifier or the second switch circuit.

Abstract: A method of fabricating a multi-trace via substrate is disclosed. A substrate at least having a first surface and a hole is provided, wherein the hole has a hole wall. A first conductive layer is formed on the entire surface of the substrate and the hole wall. A photoresist layer applied over the entire surface of the first conductive layer is selectively patterned to define a plurality of laterally separated regions on the first conductive layer. A patterned photoresist layer is used as a mask and a second conductive layer substantially thicker than the first conductive layer is electroplated on the laterally separated regions. The patterned photoresist layer is removed. The portion of the first conductive layer not covered by the second conductive layer is substantially removed to form a plurality of laterally separated traces extended on the first surface and through the hole.

Abstract: A wireless transceiver includes an antenna, a filter, a radio frequency (RF) signal processing circuit, a shared amplifying circuit, a first switch circuit, a second switch circuit, a sending power amplifier, and a single-pole double-throw (SPDT) switch. The filter is connected between the antenna and the SPDT switch. The RF signal processing circuit outputs a first control signal when the antenna is utilized to send RF signals, and outputs a second control signal when the antenna is utilized to receive RF signals. The first switch circuit is connected between the shared amplifying circuit and the sending power amplifier, and switches on according to the first control signal. The second switch circuit is connected between the shared amplifying circuit and the SPDT switch, and switches on according to the second control signal. The SPDT switch selectively connects the filter to the sending power amplifier or the second switch circuit.