Abstract: A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

Abstract: An inorganic shell is ball-shaped and hollow, and includes silica and crystalline inorganic powder sintered together. A resin composition has the inorganic shells and the resin composition has certain dieletric characteristics. A method for making the inorganic shell is also provided.

Abstract: A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

Abstract: A resin composition having lower dielectric constant Dk, lower dielectric loss Df, lower water absorption, higher surface impedance, and higher glass transition temperature includes resins. The resins have a chemical structure selected from a group consisting of or any combination thereof.

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar? represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.

Abstract: A photosensitive resin composition which is non-reactive and thus storable at a normal temperatures includes 100 parts (by weight) of an epoxy acrylate, 10-50 parts acrylate monomers, 1-40 parts acrylate oligomers, 5-15 parts of a photoinitiator, 1-5 parts of a coloring agent, and 10-50 parts of a blocked polyisocyanate. A method of making and a printed circuit board made accordingly are also disclosed.

Abstract: A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.

Abstract: A method for forming a hydraulic transfer film includes: (a) forming a water-soluble sacrificial layer on a water-soluble substrate; (b) forming a first holographic pattern on the water-soluble sacrificial layer; (c) forming a pattern forming layer on the water-soluble sacrificial layer such that the pattern forming layer is formed with a second holographic pattern on a surface that contacts the first holographic pattern and being complementary to the first holographic pattern, the pattern forming layer having a water-soluble region and an oil-soluble region; (d) forming an oil-soluble base layer on the pattern forming layer; and (e) forming an activating layer that is on the oil-soluble base layer and that includes a curable activating agent.

Abstract: A polyamic acid as a polymer of a dianhydride monomer and a diamine monomer is disclosed. The dianhydride monomer is an aromatic tetrabasic carboxylic acid dianhydride monomer. The diamine monomer comprises a diamine monomer containing pyrimidinyl and an aromatic diamine monomer. A polyimide, a polyimide film and a copper clad laminate using the polyamic acid are also provided.

Abstract: A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

Abstract: A resin composition suitable as an adhesive layer and as a circuit board substrate includes an acrylic resin, a non-photosensitive resin with carboxyl groups, nano core-shell particles, a photoinitiator, and a solvent, such adhesive layer and circuit board substrate being high-strength and temperature-resistant whilst retaining flexibility. The acrylic resin is in an amount by weight of 150 parts in the resin composition, the non-photosensitive resin is in an amount by weight of 30 parts to 80 parts in the resin composition, the nano core-shell particles are in an amount by weight of 5 parts to 30 parts in the resin composition, and the photoinitiator is in an amount by weight of 1 part to 10 parts in the resin composition.

Abstract: A hydraulic transfer film includes: a water-soluble substrate, a pattern-forming layer formed on the water-soluble substrate and having a water-soluble region and an oil-soluble region, an oil-soluble pattern layer formed on the pattern-forming layer, an oil-soluble base layer formed on the oil-soluble pattern layer, and an activating layer including a curable activating agent that permeates into the oil-soluble region, the oil-soluble pattern layer, and the oil-soluble base layer such that the oil-soluble region, the oil-soluble pattern layer, and the oil-soluble base layer are partly soluble in the curable activating agent. A method of forming the hydraulic transfer film and a pattern film are also disclosed.

Abstract: A method for forming a hydraulic transfer film includes: (a) forming a water-soluble sacrificial layer on a water-soluble substrate; (b) forming a first holographic pattern on the water-soluble sacrificial layer; (c) forming a pattern forming layer on the water-soluble sacrificial layer such that the pattern forming layer is formed with a second holographic pattern on a surface that contacts the first holographic pattern and being complementary to the first holographic pattern, the pattern forming layer having a water-soluble region and an oil-soluble region; (d) forming an oil-soluble base layer on the pattern forming layer; and (e) forming an activating layer that is on the oil-soluble base layer and that includes a curable activating agent.

Abstract: A hydraulic transfer film includes: a water-soluble substrate, a pattern-forming layer formed on the water-soluble substrate and having a water-soluble region and an oil-soluble region, an oil-soluble pattern layer formed on the pattern-forming layer, an oil-soluble base layer formed on the oil-soluble pattern layer, and an activating layer including a curable activating agent that permeates into the oil-soluble region, the oil-soluble pattern layer, and the oil-soluble base layer such that the oil-soluble region, the oil-soluble pattern layer, and the oil-soluble base layer are partly soluble in the curable activating agent. A method of forming the hydraulic transfer film and a pattern film are also disclosed.

Abstract: The present invention discloses a high-molecule-based organic light-emitting diode (OLED) and a fabrication method thereof. The high-molecule-based OLED comprises a layer selected from a group consisting of an organic emissive layer, a first emission-auxiliary layer and a second emission-auxiliary layer. The organic emissive layer, first emission-auxiliary layer or second emission-auxiliary layer comprises a molecular material having a molecular weight of larger than approximately 730 g mol?1, and is formed by a solution-process.

Abstract: The present invention discloses a high-molecule-based organic light-emitting diode (OLED) and a fabrication method thereof. The high-molecule-based OLED comprises a layer selected from a group consisting of an organic emissive layer, a first emission-auxiliary layer and a second emission-auxiliary layer. The organic emissive layer, first emission-auxiliary layer or second emission-auxiliary layer comprises a molecular material having a molecular weight of larger than approximately 730 g mol?1, and is formed by a solution-process.

Abstract: The present invention discloses a modified nano-dot and a fabrication method thereof. The modified nano-dot comprises a surface portion having a functional group and a core portion comprising a polymeric metal oxide, polymeric metalloid oxide or polymeric metal alloy oxide. The mean particle size of the modified nano-dot is 1-100 nm, preferably 1-10 nm. The modified nano-dot capable of modulating a carrier flux can be further applied to the element manufacture in the organic semiconductor industry, optoelectronics industry, and solar cell industry.

Abstract: The present invention discloses a high-molecule-based organic light-emitting diode (OLED) and a fabrication method thereof. The high-molecule-based OLED comprises a layer selected from a group consisting of an organic emissive layer, a first emission-auxiliary layer and a second emission-auxiliary layer. The organic emissive layer, first emission-auxiliary layer or second emission-auxiliary layer comprises a molecular material having a molecular weight of larger than approximately 730 g mol?1, and is formed by a solution-process.

Abstract: The present invention discloses a high-molecule-based organic light-emitting diode (OLED) and a fabrication method thereof. The high-molecule-based OLED comprises a layer selected from a group consisting of an organic emissive layer, a first emission-auxiliary layer and a second emission-auxiliary layer. The organic emissive layer, first emission-auxiliary layer or second emission-auxiliary layer comprises a molecular material having a molecular weight of larger than approximately 730 g mol?1, and is formed by a solution-process.

Abstract: The present invention discloses a modified nano-dot and a fabrication method thereof. The modified nano-dot comprises a surface portion having a functional group and a core portion comprising a polymeric metal oxide, polymeric metalloid oxide or polymeric metal alloy oxide. The mean particle size of the modified nano-dot is 1-100 nm, preferably 1-10 nm. The modified nano-dot capable of modulating a carrier flux can be further applied to the element manufacture in the organic semiconductor industry, optoelectronics industry, and solar cell industry.