Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: A telephone adapter includes a spool mounted in a casing and controlled by a winding spring in the casing to take up a telephone line, which extends out of the casing for connection to the handset or phone base of a telephone, a module jack disposed in a hole on the casing and electrically connected to the telephone line by two annular metal contact elements and two metal contact springs and adapted to receive an external telephone module plug, a lock and automatic rewind switch, and a locking mechanism controlled by the lock and automatic rewind switch to lock/unlock the spool.