Abstract: A positioning terminal is disposed on a movable object, and includes a satellite-based positioning module, a detecting module, a processing module, and a wireless communication module. The positioning module receives satellite-transmitted signals and generates positioning data therefrom. The detecting module detects status of the movable object, and generates an alarm signal when an abnormal status is detected. The processing module includes a storage medium for storing the positioning data from the positioning module, and a processing unit for processing the positioning data stored in the storage medium and for outputting geographical information of the movable object. The processing unit further outputs alarm information based on the alarm signal. The wireless communication module is used to transmit the geographical information and the alarm information from the processing module.

Abstract: A method and apparatus that determine a time window based on a presentation schedule for a multimedia content in response to receiving the presentation schedule is described herein. The multimedia content is played according to the presentation schedule at a predetermined location. During the time window, an interactive user interface pattern is presented within a vicinity of the predetermined location. In response to receiving a user input via the interactive user interface pattern, a reward is generated during the time window.

Abstract: The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

Abstract: A positioning terminal is disposed on a movable object, and includes a satellite-based positioning module, a detecting module, a processing module, and a wireless communication module. The positioning module receives satellite-transmitted signals and generates positioning data therefrom. The detecting module detects status of the movable object, and generates an alarm signal when an abnormal status is detected. The processing module includes a storage medium for storing the positioning data from the positioning module, and a processing unit for processing the positioning data stored in the storage medium and for outputting geographical information of the movable object. The processing unit further outputs alarm information based on the alarm signal. The wireless communication module is used to transmit the geographical information and the alarm information from the processing module.

Abstract: The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

Abstract: The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.

Abstract: A remote monitoring method is to be implemented using mobile telephone service equipment including a mobile telecommunications switching office and a plurality of base stations operably associated with the mobile telecommunications switching office. The remote monitoring method includes: enabling the mobile telecommunications switching office to receive a monitoring request from a requesting party, the monitoring request including a telephone number used by a target terminal of a monitored party; in response to the monitoring request, enabling the mobile telecommunications switching office to determine if the target terminal of the monitored party is able to be serviced by the mobile telephone service equipment; and upon determining that the target terminal of the monitored party is unable to be serviced by the mobile telephone service equipment, enabling the mobile telecommunications switching office to send a corresponding notification to the requesting party.

Abstract: An image sensor package structure and an image sensing module are proposed. A substrate, a frame and a light transparent layer are used to package an image sensing chip to form the image sensor package structure. The frame is mounted on the substrate and located around the image sensing chip. The top of the frame extends toward the image sensing chip and upwards to form a locking and placing portion with an L-shaped cross section. Bend positions of the locking and placing portion form a placement space formed to accommodate and position the light transparent layer. The structure is simple, the fabrication is easy, and the gluing and packaging operations can be facilitated. Moreover, when the image sensor package structure and a lens set are assembled into an image sensing module, a lens base with a smaller size can be used to shrink the package area.

Abstract: The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.

Abstract: An image sensor package structure is proposed, in which an image sensor is fixed on a substrate having metallization traces and an adhesion layer. Electric paths of the package structure are changed from the COG (chip on glass) process to the CIS (CMOS image sensor) process to improve electric characteristics. Moreover, spacers are formed at appropriate positions to prevent glue overflow from contaminating the sensing regions and solder balls. The proposed package structure can also shrink the package area to greatly enhance the yield and quality.

Abstract: The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

Abstract: An image sensor package structure is proposed, in which the electric connection of an image sensing chip and the assembly of a housing and a lens barrel are separately carried out to avoid restriction in the packaging process and influence of outside contaminants. Moreover, corresponding faces of the housing and the lens barrel are designed to be smooth surfaces to reduce the probability of adhesion and accumulation of outside contaminants, thereby enhancing the process yield and also reducing the process cost.

Abstract: The present invention relates to a package structure for an optical sensor having a base set with the plurality of metallization traces on its upper and under surface and several conductors passing through the base electrically connects to the plurality of metallization traces on the surface; at least one optical sensor and its peripheral frame are set upon the base in which the conductors can be located within the frame area or the area between the optical sensor and the frame; and a light-pervious lid encapsulates the frame and completes the package structure. In addition, an enclosing base having a containing capacity can be adopted to replace the base and the frame. The present invention can efficiently raise the reliability of elements and yield and quality by said package structure.

Abstract: A packaging structure of a light sensation module includes a substrate, a light sensation chip, a housing and a lens barrel. The light sensation chip is installed on the substrate and is electrically connected to the substrate. The lens barrel is movably installed to the housing, and the corresponding surfaces of the housing and the lens barrel are smooth. Thereby, the pollutants brought about by friction can be reduced; the deposition of external pollutants can be avoided; the yield can be promoted; and the cost can be lowered.