Abstract: Disclosed herein are electrolyte solutions and methods for electrolytic co-deposition of calcium phosphate and drug composites. The electrolyte solution may be formed by mixing solutions comprising calcium and phosphate precursors together to form an electrolyte solution. The electrolyte solution can have a water content less than 30 weight percent. The electrolyte solution may comprise a water-soluble non-aqueous solvent. A therapeutic agent, such as water-insoluble drug, is also present in the solution. The electrolyte solution thus formed may be used to co-deposit a calcium phosphate coating and the therapeutic agent on a substrate.

Abstract: This application relates to a composition comprising a mixture of different organic solvents formulated for controlled drug release. The release profile of the drug can be regulated by adjusting the compositional ratios of the solvents. In one embodiment of the invention a first solvent is water-soluble and a second solvent is water-insoluble. The first and second solvents are miscible and together form a solution containing the drug. The hydrophobicity of the composition can be adjusted by altering the relative amount of the second solvent. The composition also includes a solid lipid dissolved in the drug-containing solution. In aqueous environments the lipid may precipitate to form a thin membrane in an outer surface portion of the composition, thereby further regulating the release of the drug. The membrane is preferably renewable. That is, as the outermost portion of the lipid is biodegraded at a target location in vivo, additional outer portions of the lipid precipitate to renew the thin membrane.

Abstract: This application relates to a method of modifying the surface of a metal substrate to improve the surface coverage of a coating applied to the substrate. The method comprises heating at least the surface of the substrate to a temperature within the range of approximately 175-400° C.; and applying at least one layer of the coating to the substrate. In one particular embodiment the substrate is heated to a temperature within the range of 200-350° C. The low temperature heating enhances the hydrophilicity of the metal substrate while avoiding the disadvantages of high temperature thermal oxidation.