Abstract: An electronic window is provided for adjusting light and includes a first panel, a second panel, and an intermediate layer. The first panel includes a first alignment layer. The second panel includes a second alignment layer. The intermediate layer is disposed between the first panel and the second panel. The angle of orientation of the first alignment layer is between 25 degrees and 65 degrees, and the angle of orientation of the second alignment layer is between 115 degrees and 155 degrees.

Abstract: An optical device includes: a first substrate; a second substrate disposed opposite to the first substrate; a first conductive layer disposed on the first substrate, wherein the first conductive layer includes a first surface and a third side surface connecting to the first surface; a second conductive layer disposed on the second substrate; a sealant disposed between the first conductive layer and the second conductive layer and having a first side and a second side opposite to the first side; a liquid crystal layer disposed between the first conductive layer and the second conductive layer and locating at the first side of the sealant; and a barrier layer disposed between the first conductive layer and the second conductive layer and locating at the second side of the sealant, wherein at least part of the first surface and the third side surface are not covered by the barrier layer.

Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.

Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.

Abstract: A power supply device includes a conversion module, a plastic case and an inorganic material, and the conversion module includes an input end, a potential ignition source, a conversion circuit and an output end. The input end is configured to receive an input source, and the potential ignition source is configured to suppress a surge of the input source. The conversion circuit is configured to convert the input source into an output source, and the output end is configured to provide the output source to a load. The plastic case accommodates the conversion module, and the plastic case includes an inner surface. The inorganic material is configured between the potential ignition source and the inner surface, and a distance between the potential ignition source and the inner surface is less than 13 mm.

Abstract: A conducting wire structure for transmitting electric power is provided, which includes a plurality of first core wires and a plurality of second core wires twisted together with each other, in which each of the first core wires is composed of multiple metal materials, a first metal layer is located at the center of the first core wire and the first metal layer is clad in a second metal layer.