Abstract: The present disclosure discloses a touch device, including a display region and a transmission region. The transmission region is arranged on at least one side around the display region. The touch device includes a first flexible film, a first low-resistance conductive layer, a first adhesive layer, a second flexible film, a second low-resistance conductive layer, a second adhesive layer, and a transparent cover plate sequentially from bottom to top. The first low-resistance conductive layer includes a first touch conductive layer and a first wire integrally formed. The second low-resistance conductive layer includes a second touch conductive layer and a second wire integrally formed. The first touch conductive layer and the second touch conductive layer correspond to the display region. The first wire and the second wire correspond to the transmission region.

Abstract: Systems and methods for healthcare insights with knowledge graphs are provided. In one example, a method includes constructing, with a processor, a knowledge graph with data from a heterogeneous plurality of data sources, generating, with the processor, healthcare insights from the knowledge graph, and outputting, to a user device for display to a user, a healthcare recommendation based on the healthcare insights. In this way, various types of data may be used to efficiently provide personalized healthcare recommendations for users.

Abstract: A semiconductor structure and fabrication method are provided. The method includes: providing a substrate with a first doped region and a second doped region; forming discrete first isolation structures in the second doped region; forming a third doped region in the second doped region between adjacent first isolation structures and under the first isolation structures; forming a gate structure; forming a source region in the first doped region; and forming a drain region in the second doped region. The first doped region includes first doping ions and the second doped region includes second doping ions with a conductivity type opposite to a conductivity type of the first doping ions. The third doped region includes third doping ions with a conductivity type opposite to the conductivity type of the second doping ions. A portion of the first isolation structure is located between the gate structure and the drain region.

Abstract: The present disclosure provides an LDMOS device and a manufacturing method thereof.

Abstract: A method for positioning key features of a lens based on ocular B-mode ultrasound images includes: acquiring and preprocessing the ocular B-mode ultrasound images to obtain a preprocessed B-mode ultrasound image, eyeball coordinates and lens coordinates; sending the preprocessed B-mode ultrasound image, the eyeball coordinates and the lens coordinates into a trained target detection network YOLOv3 to obtain eyeball position images and lens position images; substituting the eyeball position images and the lens position images into a trained feature extraction network group to obtain image features and feature coordinates corresponding to the eyeball position images and the lens position images, respectively; substituting the image features into a trained collaborative learning network to screen key image features; and marking a feature coordinate corresponding to the key image features on the ocular B-mode ultrasound images to complete positioning the key features of the lens.

Abstract: An electronic apparatus. The electronic apparatus includes a flexible display panel and a support for supporting the flexible display panel. The flexible display panel has a display area and a peripheral area, and an edge groove in the peripheral area defining an edge portion of the flexible display panel. The edge portion being on a side of the edge groove distal to the display area. The support has a first support groove configured to receive the edge portion of the flexible display panel. The flexible display panel is bent about the edge groove, facilitating insertion of the edge portion of the flexible display panel into the first support groove.

Abstract: The present disclosure discloses a touch device, including a display region and a transmission region. The transmission region is arranged on at least one side around the display region. The touch device includes a first flexible film, a first low-resistance conductive layer, a first adhesive layer, a second flexible film, a second low-resistance conductive layer, a second adhesive layer, and a transparent cover plate sequentially from bottom to top. The first low-resistance conductive layer includes a first touch conductive layer and a first wire integrally formed. The second low-resistance conductive layer includes a second touch conductive layer and a second wire integrally formed. The first touch conductive layer and the second touch conductive layer correspond to the display region. The first wire and the second wire correspond to the transmission region.

Abstract: Disclosed is a display device comprising a display panel, a backlight module and a bendable light-transmissive layer. The display panel comprises a light incident surface and a light exit surface opposite to each other and a plurality of panel sides connecting the light incident surface with the light exit surface. The backlight module is located on the light incident surface of the display panel and comprises a first surface facing the light incident surface, a second surface opposite to the first surface, and a plurality of module sides connecting the first surface with the second surface. The bendable light-transmissive layer at least partially covers the light exit surface of the display panel, the plurality of panel sides and the plurality of module sides to fix the display panel and the backlight module.

Abstract: A semiconductor device package includes a semiconductor device, a conductive bump, a first encapsulant and a second encapsulant. The semiconductor device has a first surface, a second surface and a lateral surface. The second surface is opposite to the first surface. The lateral surface extends between the first surface and the second surface. The semiconductor device comprises a conductive pad adjacent to the first surface of the semiconductor device. The conductive bump is electrically connected to the conductive pad. The first encapsulant covers the first surface of the semiconductor device and a first portion of the lateral surface of the semiconductor device, and surrounds the conductive bump. The second encapsulant covers the second surface of the semiconductor device and a second portion of the lateral surface of the semiconductor device.

Abstract: The present disclosure provides an LDMOS device and a manufacturing method thereof.

Abstract: A display device is disclosed. The display device includes a housing, a display screen, a driving device, and a measuring component, wherein an opening is arranged on the housing, at least a part of the display screen is located in the housing, the display screen is connected with the driving device, the driving device is configured to drive the display screen to extend out of the housing, and/or to retract into the housing through the opening, and the measuring component is configured to measure a length of the display screen extending out of the housing.

Abstract: In one embodiment, a computing system accesses a three-dimensional (3D) model of an environment, the 3D model comprising a virtual representation of an object in the environment. The computing system accesses an image of the object captured by a camera from a camera pose. The computing system accesses light source parameters associated with a virtual representation of a light source in the environment. The computing system renders, using the 3D model, pixels associated with the virtual representation of the object based on the light source parameters, the pixels being rendered from a virtual perspective corresponding to the camera pose. The computing system determines updated light source parameters based on a comparison of the rendered pixels to corresponding pixels located in the image of the object.

Abstract: In one embodiment, a computing system accesses a three-dimensional (3D) model of an environment, the 3D model comprising a virtual representation of an object in the environment. The computing system accesses an image of the object captured by a camera from a camera pose. The computing system accesses material parameters associated with a material property for the virtual representation of the object. The computing system renders, using the 3D model, pixels associated with the virtual representation of the object based on the material parameters associated with the virtual representation of the object, the pixels being rendered from a virtual perspective corresponding to the camera pose. The computing system determines updated material parameters associated with the material property for the virtual representation of the object based on a comparison of the rendered pixels to corresponding pixels located in the image of the object.

Abstract: A method for forming a semiconductor structure includes providing a substrate, including a first region and a second region; forming a plurality of fin structures on the substrate; forming an isolation structure between adjacent fin structures; forming a mask layer over the substrate and the plurality of fin structures; forming an opening by removing a portion of the mask layer formed in the first region; removing a portion of the isolation structure exposed in the opening by using a remaining portion of the mask layer as a mask; removing the remaining portion of the mask layer; and forming a gate structure across the plurality of fin structures. The gate structure covers the first region.

Abstract: The present disclosure provides an LDMOS device and a manufacturing method thereof.

Abstract: A semiconductor structure and fabrication method are provided. The method includes: providing a substrate with a first doped region and a second doped region; forming discrete first isolation structures in the second doped region; forming a third doped region in the second doped region between adjacent first isolation structures and under the first isolation structures; forming a gate structure; forming a source region in the first doped region; and forming a drain region in the second doped region. The first doped region includes first doping ions and the second doped region includes second doping ions with a conductivity type opposite to a conductivity type of the first doping ions. The third doped region includes third doping ions with a conductivity type opposite to the conductivity type of the second doping ions. A portion of the first isolation structure is located between the gate structure and the drain region.

Abstract: A display device is disclosed. The display device includes a housing, a display screen, a driving device, and a measuring component, wherein an opening is arranged on the housing, at least a part of the display screen is located in the housing, the display screen is connected with the driving device, the driving device is configured to drive the display screen to extend out of the housing, and/or to retract into the housing through the opening, and the measuring component is configured to measure a length of the display screen extending out of the housing.

Abstract: A system, method, and computer readable medium for inverse graphics rendering comprise a differentiable rendering pipeline and a gradient descent optimization engine. A given scene is described using scene parameters. Visibility functions, and other rendered functions, are constructed to be continuous and differentiable, allowing the optimization engine and the rendering pipeline to efficiently iterate through increasingly refined scene models.

Abstract: A system, method, and computer readable medium for inverse graphics rendering comprise a differentiable rendering pipeline and a gradient descent optimization engine. A given scene is described using scene parameters. Visibility functions, and other rendered functions, are constructed to be continuous and differentiable, allowing the optimization engine and the rendering pipeline to efficiently iterate through increasingly refined scene models.

Abstract: A semiconductor device package includes a semiconductor device, a conductive bump, a first encapsulant and a second encapsulant. The semiconductor device has a first surface, a second surface and a lateral surface. The second surface is opposite to the first surface. The lateral surface extends between the first surface and the second surface. The semiconductor device comprises a conductive pad adjacent to the first surface of the semiconductor device. The conductive bump is electrically connected to the conductive pad. The first encapsulant covers the first surface of the semiconductor device and a first portion of the lateral surface of the semiconductor device, and surrounds the conductive bump. The second encapsulant covers the second surface of the semiconductor device and a second portion of the lateral surface of the semiconductor device.