Patents by Inventor Mao-Liang Tien

Mao-Liang Tien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10542130
    Abstract: A mobile device includes a metal back cover, a display device, a display frame, a nonconductive filling element, a dielectric substrate, a ground element, and a radiator. The metal back cover has a slot. The display device and the display frame are disposed opposite to the metal back cover. The nonconductive filling element is at least partially embedded in the slot. The dielectric substrate is disposed on the nonconductive filling element. The ground element is coupled to the metal back cover. The radiator is coupled to the ground element and is disposed on the dielectric substrate. An antenna structure is formed by the radiator and the slot of the metal back cover. The distance from the slot to an edge of the metal back cover is shorter than 10 mm.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: January 21, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Wen-Yuan Lo, Mao-Liang Tien, Jui-Chun Jao
  • Publication number: 20110120763
    Abstract: The present invention is a film for prevention of electromagnetic interference and transmission of wireless signals. A conductive lamination is integrally attached to a preset position of a substrate and shaped as a film and a signal transceiver. The method of forming the film includes selecting a substrate and selecting a signal transmitting and receiving mode and a form of the conductive surface according to a specific need. A film-shaped signal transceiver and conductive lamination are integrally formed on a preset area of the substrate. By plating and/or coating, the present invention can form a conductive lamination on the substrate with both functions as a signal transceiver and a shield.
    Type: Application
    Filed: November 21, 2009
    Publication date: May 26, 2011
    Applicant: PARAGON TECHNOLOGIES Co., Ltd.
    Inventors: Pi-Hsi Cheng, Chung-Han Chen, Chun-Yang Li, Mao-Liang Tien