Patents by Inventor Mao-Lin Kao
Mao-Lin Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9921493Abstract: A photolithography system includes a photo-mask storage, at least one photolithography machine and an overhead crane for transporting at least one photo-mask at least between the photo-mask storage and the photolithography machine. The overhead crane includes at least one main rail, a mask girder, a mask hoist and a mask holding device. The mask girder is coupled with the main rail and movable at least between a first position above the photo-mask storage and a second position above the photolithography machine. The mask hoist is movably coupled with the mask girder. The mask holding device is coupled with the mask hoist.Type: GrantFiled: November 14, 2013Date of Patent: March 20, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chi-Feng Tung, Hsiang-Yin Shen, Mao-Lin Kao, Chih-Cheng Hsiao
-
Patent number: 9852932Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.Type: GrantFiled: November 30, 2016Date of Patent: December 26, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Mao-Lin Kao, Hsu-Shui Liu, Jiun-Rong Pai, Li-Jen Ko, Hsiang-Yin Shen, Tien-Chen Hu
-
Publication number: 20170148651Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.Type: ApplicationFiled: November 30, 2016Publication date: May 25, 2017Inventors: Mao-Lin KAO, Hsu-Shui LIU, Jiun-Rong PAI, Li-Jen KO, Hsiang-Yin SHEN, Tien-Chen HU
-
Patent number: 9558974Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.Type: GrantFiled: September 27, 2012Date of Patent: January 31, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Mao-Lin Kao, Hsu-Shui Liu, Tien-Chen Hu, Li-Jen Ko, Hsiang-Yin Shen, Jiun-Rong Pai
-
Patent number: 9305815Abstract: A rail transport system and method for a semiconductor fabrication facility (FAB). In one embodiment, the system includes a network of stationary rails and a wheeled vehicle movable on the rails via rolling movement. The vehicle is operable to hold a wafer carrier that stores a plurality of wafers. A cross-floor transport system is provided that may include a vehicle lifter positioned near the network of rails that extends between a first elevation and a second elevation in the FAB. The lifter is configured and operable to receive the vehicle from rails at the first elevation and vertically transport the vehicle to rails at the second elevation without removing the wafer carrier from the wheeled vehicle. In one embodiment, the lifter is configured so that the vehicle may be rolled directly onto and off of the lifter for vertical transport.Type: GrantFiled: March 1, 2012Date of Patent: April 5, 2016Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chi-Feng Tung, Mao-Lin Kao, Hsiang-Yin Shen, Chin-Hsiang Lin
-
Patent number: 9281221Abstract: One or more techniques or systems for ultra-high vacuum (UHV) wafer processing are provided herein. In some embodiments, a vacuum system includes one or more cluster tools connected via one or more bridges. For example, a first cluster tool is connected to a first bridge. Additionally, a second cluster tool is connected to a second bridge. In some embodiments, the first bridge is configured to connect the second cluster tool to the first cluster tool. In some embodiments, the second cluster tool is connected to the first bridge, thus forming a ‘tunnel’. In some embodiments, the second bridge comprises one or more facets configured to enable a connection to an additional process chamber or an additional cluster tool. In this manner, a more efficient UHV environment is provided, thus enhancing a yield associated with wafer processing, for example.Type: GrantFiled: November 16, 2012Date of Patent: March 8, 2016Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chung-En Kao, Tien-Chen Hu, Mao-Lin Kao, Kuo-Fu Chien, Keith Koai
-
Patent number: 9048274Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.Type: GrantFiled: December 8, 2008Date of Patent: June 2, 2015Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Cheng Wang, Feng-Ning Lee, Chi-Feng Tung, Mao-Lin Kao, Li-Jen Ko
-
Publication number: 20150131070Abstract: A photolithography system includes a photo-mask storage, at least one photolithography machine and an overhead crane for transporting at least one photo-mask at least between the photo-mask storage and the photolithography machine. The overhead crane includes at least one main rail, a mask girder, a mask hoist and a mask holding device. The mask girder is coupled with the main rail and movable at least between a first position above the photo-mask storage and a second position above the photolithography machine. The mask hoist is movably coupled with the mask girder. The mask holding device is coupled with the mask hoist.Type: ApplicationFiled: November 14, 2013Publication date: May 14, 2015Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chi-Feng TUNG, Hsiang-Yin SHEN, Mao-Lin KAO, Chih-Cheng HSIAO
-
Publication number: 20140140792Abstract: One or more techniques or systems for ultra-high vacuum (UHV) wafer processing are provided herein. In some embodiments, a vacuum system includes one or more cluster tools connected via one or more bridges. For example, a first cluster tool is connected to a first bridge. Additionally, a second cluster tool is connected to a second bridge. In some embodiments, the first bridge is configured to connect the second cluster tool to the first cluster tool. In some embodiments, the second cluster tool is connected to the first bridge, thus forming a ‘tunnel’. In some embodiments, the second bridge comprises one or more facets configured to enable a connection to an additional process chamber or an additional cluster tool. In this manner, a more efficient UHV environment is provided, thus enhancing a yield associated with wafer processing, for example.Type: ApplicationFiled: November 16, 2012Publication date: May 22, 2014Applicant: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chung-En Kao, Tien-Chen Hu, Mao-Lin Kao, Kuo-Fu Chien, Keith Koai
-
Publication number: 20140086720Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.Type: ApplicationFiled: September 27, 2012Publication date: March 27, 2014Applicant: Taiwan Semiconductor Manufaturing Company, Ltd.Inventors: Mao-Lin KAO, Hsu-Shui Liu, Tien-Chen Hu, Li-Jen Ko, Hsiang-Yin Shen, Jiun-Rong Pai
-
Publication number: 20130230375Abstract: A rail transport system and method for a semiconductor fabrication facility (FAB). In one embodiment, the system includes a network of stationary rails and a wheeled vehicle movable on the rails via rolling movement. The vehicle is operable to hold a wafer carrier that stores a plurality of wafers. A cross-floor transport system is provided that may include a vehicle lifter positioned near the network of rails that extends between a first elevation and a second elevation in the FAB. The lifter is configured and operable to receive the vehicle from rails at the first elevation and vertically transport the vehicle to rails at the second elevation without removing the wafer carrier from the wheeled vehicle. In one embodiment, the lifter is configured so that the vehicle may be rolled directly onto and off of the lifter for vertical transport.Type: ApplicationFiled: March 1, 2012Publication date: September 5, 2013Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chi-Feng TUNG, Mao-Lin Kao, Hsiang-Yin Shen, Chin-Hsiang Lin
-
Publication number: 20100143082Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.Type: ApplicationFiled: December 8, 2008Publication date: June 10, 2010Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Cheng Wang, Feng-Ning Lee, Chi-Feng Tung, Mao-Lin Kao, Li-Jen Ko