Patents by Inventor Mao-Lin Kao

Mao-Lin Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9921493
    Abstract: A photolithography system includes a photo-mask storage, at least one photolithography machine and an overhead crane for transporting at least one photo-mask at least between the photo-mask storage and the photolithography machine. The overhead crane includes at least one main rail, a mask girder, a mask hoist and a mask holding device. The mask girder is coupled with the main rail and movable at least between a first position above the photo-mask storage and a second position above the photolithography machine. The mask hoist is movably coupled with the mask girder. The mask holding device is coupled with the mask hoist.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: March 20, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Feng Tung, Hsiang-Yin Shen, Mao-Lin Kao, Chih-Cheng Hsiao
  • Patent number: 9852932
    Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: December 26, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Mao-Lin Kao, Hsu-Shui Liu, Jiun-Rong Pai, Li-Jen Ko, Hsiang-Yin Shen, Tien-Chen Hu
  • Publication number: 20170148651
    Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.
    Type: Application
    Filed: November 30, 2016
    Publication date: May 25, 2017
    Inventors: Mao-Lin KAO, Hsu-Shui LIU, Jiun-Rong PAI, Li-Jen KO, Hsiang-Yin SHEN, Tien-Chen HU
  • Patent number: 9558974
    Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: January 31, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Mao-Lin Kao, Hsu-Shui Liu, Tien-Chen Hu, Li-Jen Ko, Hsiang-Yin Shen, Jiun-Rong Pai
  • Patent number: 9305815
    Abstract: A rail transport system and method for a semiconductor fabrication facility (FAB). In one embodiment, the system includes a network of stationary rails and a wheeled vehicle movable on the rails via rolling movement. The vehicle is operable to hold a wafer carrier that stores a plurality of wafers. A cross-floor transport system is provided that may include a vehicle lifter positioned near the network of rails that extends between a first elevation and a second elevation in the FAB. The lifter is configured and operable to receive the vehicle from rails at the first elevation and vertically transport the vehicle to rails at the second elevation without removing the wafer carrier from the wheeled vehicle. In one embodiment, the lifter is configured so that the vehicle may be rolled directly onto and off of the lifter for vertical transport.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: April 5, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Feng Tung, Mao-Lin Kao, Hsiang-Yin Shen, Chin-Hsiang Lin
  • Patent number: 9281221
    Abstract: One or more techniques or systems for ultra-high vacuum (UHV) wafer processing are provided herein. In some embodiments, a vacuum system includes one or more cluster tools connected via one or more bridges. For example, a first cluster tool is connected to a first bridge. Additionally, a second cluster tool is connected to a second bridge. In some embodiments, the first bridge is configured to connect the second cluster tool to the first cluster tool. In some embodiments, the second cluster tool is connected to the first bridge, thus forming a ‘tunnel’. In some embodiments, the second bridge comprises one or more facets configured to enable a connection to an additional process chamber or an additional cluster tool. In this manner, a more efficient UHV environment is provided, thus enhancing a yield associated with wafer processing, for example.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: March 8, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chung-En Kao, Tien-Chen Hu, Mao-Lin Kao, Kuo-Fu Chien, Keith Koai
  • Patent number: 9048274
    Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: June 2, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Cheng Wang, Feng-Ning Lee, Chi-Feng Tung, Mao-Lin Kao, Li-Jen Ko
  • Publication number: 20150131070
    Abstract: A photolithography system includes a photo-mask storage, at least one photolithography machine and an overhead crane for transporting at least one photo-mask at least between the photo-mask storage and the photolithography machine. The overhead crane includes at least one main rail, a mask girder, a mask hoist and a mask holding device. The mask girder is coupled with the main rail and movable at least between a first position above the photo-mask storage and a second position above the photolithography machine. The mask hoist is movably coupled with the mask girder. The mask holding device is coupled with the mask hoist.
    Type: Application
    Filed: November 14, 2013
    Publication date: May 14, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Feng TUNG, Hsiang-Yin SHEN, Mao-Lin KAO, Chih-Cheng HSIAO
  • Publication number: 20140140792
    Abstract: One or more techniques or systems for ultra-high vacuum (UHV) wafer processing are provided herein. In some embodiments, a vacuum system includes one or more cluster tools connected via one or more bridges. For example, a first cluster tool is connected to a first bridge. Additionally, a second cluster tool is connected to a second bridge. In some embodiments, the first bridge is configured to connect the second cluster tool to the first cluster tool. In some embodiments, the second cluster tool is connected to the first bridge, thus forming a ‘tunnel’. In some embodiments, the second bridge comprises one or more facets configured to enable a connection to an additional process chamber or an additional cluster tool. In this manner, a more efficient UHV environment is provided, thus enhancing a yield associated with wafer processing, for example.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 22, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chung-En Kao, Tien-Chen Hu, Mao-Lin Kao, Kuo-Fu Chien, Keith Koai
  • Publication number: 20140086720
    Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.
    Type: Application
    Filed: September 27, 2012
    Publication date: March 27, 2014
    Applicant: Taiwan Semiconductor Manufaturing Company, Ltd.
    Inventors: Mao-Lin KAO, Hsu-Shui Liu, Tien-Chen Hu, Li-Jen Ko, Hsiang-Yin Shen, Jiun-Rong Pai
  • Publication number: 20130230375
    Abstract: A rail transport system and method for a semiconductor fabrication facility (FAB). In one embodiment, the system includes a network of stationary rails and a wheeled vehicle movable on the rails via rolling movement. The vehicle is operable to hold a wafer carrier that stores a plurality of wafers. A cross-floor transport system is provided that may include a vehicle lifter positioned near the network of rails that extends between a first elevation and a second elevation in the FAB. The lifter is configured and operable to receive the vehicle from rails at the first elevation and vertically transport the vehicle to rails at the second elevation without removing the wafer carrier from the wheeled vehicle. In one embodiment, the lifter is configured so that the vehicle may be rolled directly onto and off of the lifter for vertical transport.
    Type: Application
    Filed: March 1, 2012
    Publication date: September 5, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Feng TUNG, Mao-Lin Kao, Hsiang-Yin Shen, Chin-Hsiang Lin
  • Publication number: 20100143082
    Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.
    Type: Application
    Filed: December 8, 2008
    Publication date: June 10, 2010
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Cheng Wang, Feng-Ning Lee, Chi-Feng Tung, Mao-Lin Kao, Li-Jen Ko