Abstract: A measuring apparatus for measuring surface topography of the slides to be measured of a guide rail is provided. The measuring apparatus includes a plurality of detecting probe and at least one moving device. The detecting probes are mounted on a probe support according to the surface topography of the slides to be measured. The moving device shifts the probe support or the slides to be measured on the cross section of the guide rail so that the detecting probe has a displacement relative to the slides to be measured. Each of the detecting probes has a corresponding coordinate system, and the corresponding coordinate system is different from each other. A standard part is utilized to correct deviations among the corresponding coordinate systems to the same coordinate system, and then the same coordinate system as a benchmark to measure the surface topography of the slides to be measured.

Abstract: A measuring apparatus for measuring surface topography of the slides to be measured of a guide rail is provided. The measuring apparatus includes a plurality of detecting probe and at least one moving device. The detecting probes are mounted on a probe support according to the surface topography of the slides to be measured. The moving device shifts the probe support or the slides to be measured on the cross section of the guide rail so that the detecting probe has a displacement relative to the slides to be measured. Each of the detecting probes has a corresponding coordinate system, and the corresponding coordinate system is different from each other. A standard part is utilized to correct deviations among the corresponding coordinate systems to the same coordinate system, and then the same coordinate system as a benchmark to measure the surface topography of the slides to be measured.

Abstract: A device and method for detecting crystal quality of a low temperature poly-silicon (LTPS) backplane are provided, the method including: projecting narrowband light to the LTPS backplane; performing image capturing of each position on a surface of the LTPS backplane at a first angle in a first axial direction to obtain a first diffraction image, the first angle being an angle of maximum diffraction light intensity in the first axial direction; performing another image capturing of each position on the surface of the LTPS backplane at a second angle in a second axial direction to obtain a second diffraction image, the second angle being an angle of maximum diffraction light intensity in the second axial direction; and determining the crystal quality of the LTPS backplane based on a diffraction light intensity distribution obtained from the first and second diffraction images.

Abstract: A 3D printer has a base, a driving unit, a material exporting unit and a material tank. A three-dimensional prototype can be generated by the coordination of the material exporting unit and an X-axis rail, Y-axis rail and Z-axis rail of the base. The prototype can be a large item, and the driving unit and electrical control device can be used to control the melting and shooting-out of the plastic particles to increase the prototype's practicality, precision and completeness. Also, the costs of manufacturing the prototype can be significantly reduced.

Abstract: An electronic device includes a casing, a circuit board, an electronic component and a plurality of conductive elements. The circuit board is disposed in the casing. The electronic component is disposed on the circuit board and has a shielding surface and an electronic components body, in which the shielding surface and the casing together form a common casing surface, and there is a slit between the shielding surface and the casing. The conductive elements are disposed on the circuit board and grounded, in which the center position of each of the conductive elements and the edge of the shielding surface overlap each other, and the distance between the edge of the shielding surface and the conductive element is less than the distance between the edge of the shielding surface and the electronic component main body to evacuate static electricity around the electronic component.

Abstract: A test probe for testing an object electrically includes a main body, a first probe pin mounted to and protruding out of the main body, and at least one second probe pin coupled to the main body. The at least one second probe pin is changeable from a first state of being folded into the main body to a second state of being unfolded to protrude out of the main body. When the at least one second probe pin is in the first state, the first probe pin is used to contact the object, and when the at least one second probe pin is in the second state, the at least one second probe pin takes the place of the first probe pin in making electrical connection with the object.

Abstract: The present invention relates to a plug. The plug includes a plug body, a fixing frame, and a number of elastic plates. The plug body is made of an insulating material. A number of gold fingers are disposed on the outer surface of the plug body. The fixing frame is made of a conductive material and sleeves the plug body. The elastic plates are disposed on inner sidewalls of the fixing frame and electrically connected to the fixing frame. Each elastic plate includes an apex. The present disclosure also relates to a connector assembly using the plug.

Abstract: A test probe for testing an object electrically includes a main body, a first probe pin mounted to and protruding out of the main body, and at least one second probe pin coupled to the main body. The at least one second probe pin is changeable from a first state of being folded into the main body to a second state of being unfolded to protrude out of the main body. When the at least one second probe pin is in the first state, the first probe pin is used to contact the object, and when the at least one second probe pin is in the second state, the at least one second probe pin takes the place of the first probe pin in making electrical connection with the object.

Abstract: The present invention relates to a plug. The plug includes a plug body, a fixing frame, and a number of elastic plates. The plug body is made of an insulating material. A number of gold fingers are disposed on the outer surface of the plug body. The fixing frame is made of a conductive material and sleeves the plug body. The elastic plates are disposed on inner sidewalls of the fixing frame and electrically connected to the fixing frame. Each elastic plate includes an apex. The present disclosure also relates to a connector assembly using the plug.

Abstract: An electronic device comprises a circuit board, a conductive member, and a spring contact. The conductive member is spaced from the circuit board and comprises a surface opposite to the circuit board. The surface defines a recessed portion. The spring contact is connected to the conductive member and contacts the circuit board to achieve grounding. The spring contact comprises an end movably received in the recessed portion.

Abstract: A circuit board includes a signal layer and a power supply layer. The signal layer includes a first surface and a second surface opposite to the first surface. A number of pads are formed on the first surface for connecting to an electronic component. The power supply layer is formed on the second surface of the signal layer. The power supply layer includes an insulating substrate and at least one conductor formed on/in the insulating substrate. The conductor which is located under the pads defines a number of holes corresponding to the pads, each hole is substantially aligned with the corresponding pad, and the size of each hole is larger than the size of the corresponding pad.

Abstract: An electronic device comprises a circuit board, a conductive member, and a spring contact. The conductive member is spaced from the circuit board and comprises a surface opposite to the circuit board. The surface defines a recessed portion. The spring contact is connected to the conductive member and contacts the circuit board to achieve grounding. The spring contact comprises an end movably received in the recessed portion.

Abstract: A circuit board includes a signal layer and a power supply layer. The signal layer includes a first surface and a second surface opposite to the first surface. A number of pads are formed on the first surface for connecting to an electronic component. The power supply layer is formed on the second surface of the signal layer. The power supply layer includes an insulating substrate and at least one conductor formed on/in the insulating substrate. The conductor which is located under the pads defines a number of holes corresponding to the pads, each hole is substantially aligned with the corresponding pad, and the size of each hole is larger than the size of the corresponding pad.

Abstract: A connector jack includes a housing, a receptacle shield, and a brace. The housing is configured for receiving a plug. The receptacle shield defines a receiving space for receiving the housing and exposing a plug receiving chamber of the housing to the outside, and includes two inward projecting prongs. Each prong has a base portion and a free end bent to form a ramped surface projecting inward into the interior of the receptacle. The brace is positioned between the receptacle shield and the housing, and has a main frame and two tabs respectively connected on the two ends of the main frame for abutting the prongs of the receptacle shield.

Abstract: A support device used to support a circuit board includes a substrate, a plurality of protrusions, and a plurality of electrical-conductive pads. The protrusions are perpendicularly extending from a surface of the substrate and arranged as a matrix and each of the protrusions defines a threaded hole therein. The electrical-conductive pads are mounted on the substrate around the corresponding protrusions and grounding the circuit board.

Abstract: An electromagnetic field sensing apparatus includes an optical modulator, a miniature antenna for sensing the electromagnetic field, a light source, a first optical fiber, an optical detector and a second fiber. The optical modulator can vary the amplitude of a light beam propagating therethrough in response to an electric field intensity. The miniature antenna for sensing the electromagnetic field can sense both the electric field intensity and the magnetic field intensity of an electromagnetic field and apply an electric voltage to the optical modulator in response to the sensed electromagnetic field intensity. The light source is used to generate a light beam, the first optical fiber is used for transmitting the light beam to the modulator, and the second fiber is used for transmitting the light beam from the modulator to the optical detector.

Abstract: An electromagnetic field sensing apparatus includes an optical modulator, a miniature antenna for sensing the electromagnetic field, a light source, a first optical fiber, an optical detector and a second fiber. The optical modulator can vary the amplitude of a light beam propagating therethrough in response to an electric field intensity. The miniature antenna for sensing the electromagnetic field can sense both the electric field intensity and the magnetic field intensity of an electromagnetic field and apply an electric voltage to the optical modulator in response to the sensed electromagnetic field intensity. The light source is used to generate a light beam, the first optical fiber is used for transmitting the light beam to the modulator, and the second fiber is used for transmitting the light beam from the modulator to the optical detector.

Abstract: An electromagnetic field sensing apparatus includes an optical modulator, a miniature antenna for sensing the electromagnetic field, a light source, a first optical fiber, an optical detector and a second fiber. The optical modulator can vary the amplitude of a light beam propagating therethrough in response to an electric field intensity. The miniature antenna for sensing the electromagnetic field can sense both the electric field intensity and the magnetic field intensity of an electromagnetic field and apply an electric voltage to the optical modulator in response to the sensed electromagnetic field intensity. The light source is used to generate a light beam, the first optical fiber is used for transmitting the light beam to the modulator, and the second fiber is used for transmitting the light beam from the modulator to the optical detector.

Abstract: An electromagnetic field sensing apparatus includes an optical modulator, a miniature antenna for sensing the electromagnetic field, a light source, a first optical fiber, an optical detector and a second fiber. The optical modulator can vary the amplitude of a light beam propagating therethrough in response to an electric field intensity. The miniature antenna for sensing the electromagnetic field can sense both the electric field intensity and the magnetic field intensity of an electromagnetic field and apply an electric voltage to the optical modulator in response to the sensed electromagnetic field intensity. The light source is used to generate a light beam, the first optical fiber is used for transmitting the light beam to the modulator, and the second fiber is used for transmitting the light beam from the modulator to the optical detector.

Abstract: The present invention discloses a novel apparatus and method for stabilizing the frequency of a laser. To avoid the effect that a single-frequency absorption spectrum is easy to be affected by variations of laser power and the complexity to modulate a laser frequency, the present invention adopts at least two laser beams at different frequencies and obtains an error signal that is a difference in absorption spectrums of the laser beams. Since the error signal is a difference between two laser beams coming from an identical laser source, the variation of laser power could be eliminated. Furthermore, since the absorption spectrum is usually above hundreds of (MHz), the range of locked frequency of the present invention is large, and the laser frequency is not easily unlocked due to outside disturbance.