Patents by Inventor Mao-Yuan Huang

Mao-Yuan Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7137828
    Abstract: A reinforced flexible printed circuit board (20) includes a conductive portion (21) and a connection portion (22). The conductive portion includes a first metallic wire layer (23) having a plurality of conductive metallic wires, and two first Insulation layers (24). The connection portion includes a second metallic wire layer (26) having a plurality of conductive metallic wires, two second insulation layers (27), and a reinforcement board (29) having a hand-grip portion (291). The reinforcement board is attached to one of the second insulation layers to reinforce the connection portion, and the hand-grip portion is positioned at an end of the reinforcement board so that it is convenient for workers to assemble the reinforced flexible printed circuit board to other components.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: November 21, 2006
    Assignee: Innolux Display Corp.
    Inventors: Cheng Hsien Yu, Hsueh Tien Chang, Mao-Yuan Huang
  • Patent number: 7075322
    Abstract: A testing apparatus (2) includes a probe station (21), a micropositioner (22), a probe (23), an electronic camera (27), and a monitor. The probe station has a working surface (211) for supporting an object to be tested. The micropositioner is located on the working surface. The probe is mounted on the micropositioner, and is used for testing circuits of the object. The electronic camera is mounted on the micropositioner, and is used for taking images of the probe and the circuits. The monitor connects with the electronic camera, and is used for displaying the images. Because the testing apparatus utilizes the electronic camera to take images of the probes and the circuits, and the images are displayed on the monitor, a user can conveniently observe the testing process. Further, the electronic cameras help reduce the overall cost of the testing apparatus.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: July 11, 2006
    Assignee: Innolux Display Corp.
    Inventor: Mao-Yuan Huang
  • Publication number: 20060116005
    Abstract: A reinforced flexible printed circuit board (20) includes a conductive portion (21) and a connection portion (22). The conductive portion includes a first metallic wire layer (13) having a plurality of conductive metallic wires, and two first insulation layers (24). The connection portion includes a second metallic wire layer (16) having a plurality of conductive metallic wires, two second insulation layers (17), and a reinforcement board (19) having a hand-grip portion (291). The reinforcement board is attached to one of the second insulation layers to reinforce the connection portion, and the hand-grip portion is positioned at an end of the reinforcement board so that it is convenient for workers to assemble the reinforced flexible printed circuit board to other components.
    Type: Application
    Filed: November 28, 2005
    Publication date: June 1, 2006
    Inventors: Cheng Yu, Hsueh Chang, Mao-Yuan Huang
  • Publication number: 20050253609
    Abstract: A testing apparatus (2) includes a probe station (21), a micropositioner (22), a probe (23), an electronic camera (27), and a monitor. The probe station has a working surface (211) for supporting an object to be tested. The micropositioner is located on the working surface. The probe is mounted on the micropositioner, and is used for testing circuits of the object. The electronic camera is mounted on the micropositioner, and is used for taking images of the probe and the circuits. The monitor connects with the electronic camera, and is used for displaying the images. Because the testing apparatus utilizes the electronic camera to take images of the probes and the circuits, and the images are displayed on the monitor, a user can conveniently observe the testing process. Further, the electronic cameras help reduce the overall cost of the testing apparatus.
    Type: Application
    Filed: May 16, 2005
    Publication date: November 17, 2005
    Inventor: Mao-Yuan Huang
  • Publication number: 20050180423
    Abstract: A device and method of network communication can receive a control/data signal from a computer motherboard via a storage interface bus and output a storage/network data packet to a network via a network connection port, so that the computer can access the network and a storage device such as hard disk via the device or the method of the present invention. Therefore, the cost of maintaining the storage device and the risk of destruction by computer virus is reduced. Wherein the device of the present invention includes a storage controller for converting the control/data signal into a storage signal, a network microprocessor for converting the storage signal into a storage data packet and a wireless/wired switching agent for converting the storage data packet and a network data packet into the storage/network data packet.
    Type: Application
    Filed: December 13, 2004
    Publication date: August 18, 2005
    Applicant: Fine Appliance Corporation
    Inventors: Hsin-Tung Liao, Ming-Chen Weng, Mao-Yuan Huang
  • Publication number: 20040262035
    Abstract: An electronic component mounting structure (2) with reinforced mechanical connecting performance includes a packaging substrate (23) and an electronic chip (21) mounted thereon. A plurality of pairs of conductive bumps (211) and conductive pads (231) respectively formed on the electronic chip and the packaging substrate are mechanically and electrically connected together. In addition, mechanical connection between the packaging substrate and the electronic chip is enhanced by mechanical connection between a plurality of pairs of dummy bumps (212) and dummy pads (232) respectively formed on corners of the electronic chip and the packaging substrate. An anisotropic conductive film (ACF) (22) is sandwiched between the packaging substrate and the electronic chip, and bonds the packaging substrate and the electronic chip together.
    Type: Application
    Filed: June 30, 2004
    Publication date: December 30, 2004
    Inventors: Bing-Hong Ko, Mao-Yuan Huang