Abstract: The present disclosure relates to an organic light emitting diode display. The display includes: a substrate; a thin film transistor array disposed on the substrate; a light emitting module including: a pixel-defining layer disposed on the thin film transistor array and provided with a plurality of openings for defining positions of pixels; and a plurality of light emitting units disposed on the thin film transistor array and in the openings of the pixel-defining layer; color filter units on the light emitting module which are disposed in the openings of the pixel-defining layer so that the color filter units corresponds to the light emitting units in the openings of the pixel-defining layer; and a package layer disposed on and covering the color filter units. The organic light emitting diode display in the present disclosure may be applied into large-sized displays and meet lighting and thinning requirements.

Abstract: An AMOLED panel and a method for producing the AMOLED panel. The AMOLED panel includes a touch control cover with a detecting function. An AMOLED substrate includes array substrate, a lighting unit mounted on the array substrate, and an integrated circuit connected to and controlling the lighting unit. The touch control cover is electrically connected to the integrated circuits. An encapsulant layer is mounted between the touch control cover and the AMOLED substrate to sealingly connect the touch control cover with the AMOLED substrate. Since the encapsulant layer contacts the touch control cover, the touch control cover and the encapsulant layer are on the same side during the packaging process, avoiding the risk of scratch. The integrated circuit mounted on the array substrate is electrically connected to the touch control cover, such that the disposition of the integrated circuit on the AMOLED panel proceeds only once.

Abstract: The present disclosure discloses a packaging structure and a manufacturing method thereof, and a display panel. The packaging structure includes: a sintering part, formed between the substrate and the cover plate, wherein an encapsulation space is formed by the sintering part, the cover plate and the substrate, and the light emitting display unit is formed in the encapsulation space; and a protection part, formed on the cover plate, wherein the sintering part partially contacts with the protection part and partially contact with the cover plate. The present disclosure provides a protection part between the sintering part and the cover plate, the sintering part is divided into non-sintering regions and sintering regions by the protection part which covers a part of regions of the sintering part, thus reducing high temperature and stress generated in the process of laser sintering.