Abstract: A touch device is provided in the present disclosure, wherein the touch device comprises: a protection cover having a sensing area and a peripheral area surrounding the sensing area; a first mask layer disposed in the peripheral area surrounding the sensing area; a second mask layer disposed in the peripheral area surrounding the first mask layer, wherein the area of the second mask layer is bigger than that of the first mask layer; and a sensing electrode layer having a sensing portion located in the sensing area and an extension portion extending from the sensing area to the peripheral area, wherein the extension portion is disposed on the first mask layer. Moreover, a method for manufacturing the touch device described above is also provided in the present disclosure.

Abstract: A touch device is provided in the present disclosure, wherein the touch device comprises: a protection cover having a sensing area and a peripheral area surrounding the sensing area; a first mask layer disposed in the peripheral area surrounding the sensing area; a second mask layer disposed in the peripheral area surrounding the first mask layer, wherein the area of the second mask layer is bigger than that of the first mask layer; and a sensing electrode layer having a sensing portion located in the sensing area and an extension portion extending from the sensing area to the peripheral area, wherein the extension portion is disposed on the first mask layer. Moreover, a method for manufacturing the touch device described above is also provided in the present disclosure.

Abstract: The present disclosure relates to a touch-on-lens (TOL) device and a method for manufacturing the same. The method includes forming a plastic layer and a touch layer; cutting the plastic layer and the touch layer; and filially laminating the plastic layer and the touch layer after cutting to a strengthened lens. The method can not only help keep good mechanical property but can also help improve the efficiency of mass production. Moreover, the present disclosure adopts a photoetching process to form a sensing pattern, thereby making the circuit thinner and beautifying the appearance.