Patents by Inventor Maoqiang Dang

Maoqiang Dang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CAPACITIVE MEMS MICROPHONE, MICROPHONE UNIT AND ELECTRONIC DEVICE
    Publication number: 20230353951
    Abstract: Disclosed in embodiments of the present disclosure are a capacitive MEMS microphone, a microphone unit and an electronic device. The capacitive MEMS microphone includes: a back electrode plate; a diaphragm; and a spacer for separating the back electrode plate from the diaphragm, wherein in a state where no operating bias is applied, at least a portion of the diaphragm is pre-deviated in a direction away from the back electrode plate relative to a flat position.
    Type: Application
    Filed: June 30, 2020
    Publication date: November 2, 2023
    Applicant: GOERTEKMICROELECTRONICS CO., LTD.
    Inventors: Quanbo Zou, Maoqiang Dang, Dexin Wang
  • CAPACITIVE MEMS MICROPHONE, MICROPHONE UNIT AND ELECTRONIC DEVICE
    Publication number: 20230224646
    Abstract: Disclosed in embodiments of the present disclosure are a capacitive MEMS microphone, a microphone unit and an electronic device. The capacitive MEMS microphone includes: a back electrode plate; a diaphragm; and a spacer for separating the back electrode plate from the diaphragm, wherein in a state where an operating bias is applied, a ratio of a static effective displacement of the diaphragm relative to a flat position to a thickness of the diaphragm is greater than or equal to 0.5.
    Type: Application
    Filed: June 30, 2020
    Publication date: July 13, 2023
    Applicant: GOERTEKMICROELECTRONICS CO., LTD.
    Inventors: Quanbo Zou, Maoqiang Dang, Dexin Wang
  • Sensitive diaphragm with rim structure and sensor
    Patent number: 11363384
    Abstract: The present disclosure discloses a sensitive diaphragm comprising a diaphragm body, an edge region of the diaphragm body being provided with a rim structure, wherein the rim structure is in a non-closed annular shape, a non-closed region is located at a part not closed by the rim structure, and the non-closed region are integral and continuous with parts of the diaphragm body adjacent to the rim structure. According to the sensitive diaphragm of the present disclosure, the annular rim structure is separated by the non-closed region.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: June 14, 2022
    Assignee: Weifang Goertek Microelectronics Co., Ltd.
    Inventors: Maoqiang Dang, Guanxun Qiu, Mengjin Cai
  • SENSITIVE DIAPHRAGM AND SENSOR
    Publication number: 20210185447
    Abstract: The present disclosure discloses a sensitive diaphragm comprising a diaphragm body, an edge region of the diaphragm body being provided with a rim structure, wherein the rim structure is in a non-closed annular shape, a non-closed region is located at a part not closed by the rim structure, and the non-closed region are integral and continuous with parts of the diaphragm body adjacent to the rim structure.
    Type: Application
    Filed: September 6, 2018
    Publication date: June 17, 2021
    Applicant: Goertek, Inc.
    Inventors: MAOQIANG DANG, GUANXUN QIU, MENGJIN CAI
  • Miniature microphone, protection frame thereof and method for manufacturing the same
    Patent number: 9271435
    Abstract: A method of manufacturing a protection frame used in a miniature microphone is provided.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: February 23, 2016
    Inventors: Rongguo Yao, Zhongyuan Liu, Xianbin Wang, Maoqiang Dang, Shaoyang Yao
  • Condenser microphone
    Patent number: 8693712
    Abstract: The present invention provides a condenser microphone. In one embodiment, the condenser microphone comprises: a frame of the microphone formed of a circuit board substrate and a casing, and an amplifier device, an elastic holding component and capacitance components provided inside the microphone. One or more sound holes are provided on the circuit board substrate or the casing. The capacitance components are provided on the side with the sound holes. The amplifier device is provided on the side opposite to the side with the sound holes. The elastic holding component is provided on the side with the amplifier device or on the side with the capacitance components.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: April 8, 2014
    Assignee: Goertek Inc.
    Inventors: Weihua Sun, Wenbin Wei, Rongguo Yao, Xianbin Wang, Maoqiang Dang
  • Miniature microphone, protection frame thereof and method for manufacturing the same
    Patent number: 8553921
    Abstract: A miniature microphone is provided.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: October 8, 2013
    Assignee: GoerTek Inc.
    Inventors: Rongguo Yao, Zhongyuan Liu, Xianbin Wang, Maoqiang Dang, Shaoyang Yao
  • CONDENSER MICROPHONE
    Publication number: 20110044479
    Abstract: The present invention provides a condenser microphone. In one embodiment, the condenser microphone comprises: a frame of the microphone formed of a circuit board substrate and a casing, and an amplifier device, an elastic holding component and capacitance components provided inside the microphone. One or more sound holes are provided on the circuit board substrate or the casing. The capacitance components are provided on the side with the sound holes. The amplifier device is provided on the side opposite to the side with the sound holes. The elastic holding component is provided on the side with the amplifier device or on the side with the capacitance components.
    Type: Application
    Filed: December 22, 2009
    Publication date: February 24, 2011
    Applicant: Goertek Inc.
    Inventors: Weihua Sun, Wenbin Wei, Rongguo Yao, Xianbin Wang, Maoqiang Dang
  • MINIATURE MICROPHONE, PROTECTION FRAME THEREOF AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20110026752
    Abstract: A miniature microphone is provided.
    Type: Application
    Filed: July 17, 2009
    Publication date: February 3, 2011
    Inventors: Rongguo Yao, Zhongyuan Liu, Xianbin Wang, Maoqiang Dang, Shaoyang Yao