Abstract: A current test circuit can include a sampling resister array with a control end connected with a main control component, a first end is connected with a power conversion circuit, and a second end configured to be connected with a component to be tested. The sampling resistor array includes at least two sampling branches, each having an analog switch and a sampling resistor connected serially. In the test, the main control component can generate a control signal according to the operating state of the component and gate at least one sampling branch of the sampling resistor array through the control signal, obtain voltage values at two ends of the sampling resistor array through a voltage test assembly, and determine the current of the component according to the voltage values at two ends of the sampling resistor array and resistance values of the sampling resistor array.

Abstract: A package substrate, an apparatus for testing power supply noise, and a method for testing power supply noise are provided. The package substrate includes multiple pad arrays, and each of the multiple pad arrays at least includes power supply pads. Power supply pads belonging to a same power supply type in the multiple pad arrays are divided into a test pad and a power supply pad set. The power supply pad set includes power supply pads, other than the test pad, among the power supply pads belonging to the same power supply type, all the power supply pads in the power supply pad set are electrically connected together, and the test pad is configured to perform noise testing of at least one internal power supply corresponding to the same power supply type in a chip to be tested.

Abstract: A test fixture includes a signal test board, a circuit routing, and a branch routing. The signal test board includes a first surface and a second surface. The first surface has a first pin and a test point. The second surface has a second pin. The circuit routing is located in the signal test board and configured to connect the first pin and a corresponding second pin. A portion of the circuit routing includes an upper routing connected with one first pin, a lower routing connected with one second pin, and a via-hole routing connected with two ends of the upper routing and the lower routing. One end, connected with the via-hole routing, of the upper routing is located in a projection area of the corresponding test point. The branch routing is located in the signal test board and configured to connect the test point with a corresponding upper routing.

Abstract: A board adapter device includes: a first adapter structure provided with a gold finger matched with a board of a target memory module, a second adapter structure provided with a connector matched with the gold finger, and a signal transmission structure including a first and second transmission module. The first transmission module is for connecting a data signal line, a clock signal line, an address signal line, and a control signal line of the gold finger to corresponding connecting lines of the connector. The second transmission module is configured to, when receiving a power input signal, convert the power input signal into a power output signal matched with a power supply of the target memory module, and transmit the power output signal to a power signal line of the connector.

Abstract: The present disclosure provides a method, device and system for testing memory devices. The testing method includes: receiving a test instruction, the test instruction being used to characterize a model of a memory device to be tested that is connected to a test platform; selecting, according to the test instruction, a testing method corresponding to the model of the memory device to be tested from a plurality of pre-stored testing methods as a target testing method; and executing the target testing method to test the memory device to be tested.

Abstract: A package substrate, an apparatus for testing power supply noise, and a method for testing power supply noise are provided. The package substrate includes multiple pad arrays, and each of the multiple pad arrays at least includes power supply pads. Power supply pads belonging to a same power supply type in the multiple pad arrays are divided into a test pad and a power supply pad set. The power supply pad set includes power supply pads, other than the test pad, among the power supply pads belonging to the same power supply type, all the power supply pads in the power supply pad set are electrically connected together, and the test pad is configured to perform noise testing of at least one internal power supply corresponding to the same power supply type in a chip to be tested.

Abstract: A method and device for testing a memory array structure, and a non-transitory storage medium are provided. The method includes that: respective storage data corresponding to each preset test pattern is written into a to-be-tested memory array, the each preset test pattern being one of preset test patterns in a preset test pattern library; a row aggressing test is repeatedly performed on the to-be-tested memory array until a bit error occurs in the storage data, to obtain row aggressing test times, corresponding to the each preset test pattern, of the to-be-tested memory array, where the bit error characterizes that the storage data has changed; a target preset test pattern corresponding to the to-be-tested memory array is determined from the preset test pattern library based on the row aggressing test times; and an array structure of the to-be-tested memory array is determined based on the target preset test pattern.

Abstract: A method for measuring frequency domain characteristics of a PDN having an output terminal connected to a power supply end of a functional circuit. The method includes: a to-be-measured output interface of the functional circuit is acquired; the to-be-measured output interface is controlled to output a first level signal having a first preset rule; remaining at least one output interface of the functional circuit, other than the to-be-measured output interface, is controlled to output a second level signal having a second preset rule according to a first frequency; changing voltage values corresponding to the first frequency and output by the to-be-measured output interface are acquired; and a characteristic impedance of the PDN at the first frequency is determined based on the changing voltage values corresponding to the first frequency.

Abstract: Provided are a fuse blowing method and apparatus for a memory, a storage medium, and an electronic device. The method includes: controlling a memory to enter a test mode, and reducing an internal clock frequency of the memory (S210); starting a fuse blowing load mode, and controlling the memory to enter a fuse blowing mode (S220); enabling internal precharge of the memory, and writing a location of a fuse to be blown into a fuse blowing location register (S230); starting a fuse blowing process of the memory, and disabling the internal precharge after preset time (S240); and controlling the memory to exit the fuse blowing mode and the test mode successively (S250).

Abstract: A method and device for testing a memory array structure, and a non-transitory storage medium are provided. The method includes that: respective storage data corresponding to each preset test pattern is written into a to-be-tested memory array, the each preset test pattern being one of preset test patterns in a preset test pattern library; a row aggressing test is repeatedly performed on the to-be-tested memory array until a bit error occurs in the storage data, to obtain row aggressing test times, corresponding to the each preset test pattern, of the to-be-tested memory array, where the bit error characterizes that the storage data has changed; a target preset test pattern corresponding to the to-be-tested memory array is determined from the preset test pattern library based on the row aggressing test times; and an array structure of the to-be-tested memory array is determined based on the target preset test pattern.

Abstract: A board adapter device includes: a first adapter structure provided with a gold finger matched with a board of a target memory module, a second adapter structure provided with a connector matched with the gold finger, and a signal transmission structure including a first and second transmission module. The first transmission module is for connecting a data signal line, a clock signal line, an address signal line, and a control signal line of the gold finger to corresponding connecting lines of the connector. The second transmission module is configured to, when receiving a power input signal, convert the power input signal into a power output signal matched with a power supply of the target memory module, and transmit the power output signal to a power signal line of the connector.

Abstract: A test board for testing a memory signal includes a first surface and a second surface. The first surface of the test board comprises a convex region and a non-convex region. The convex region is provided with a first connection area connectable to a main board, and a level at which the convex region is located is higher than a level at which the non-convex region is located by a preset value. The second surface of the test board includes a test area and a second connection area connectable to a memory chip. The test board is provided with a first connection harness for connecting the test area to the first connection area and a second connection harness for connecting the test area to the second connection area, to enable the memory signal of the memory chip to be tested based on the test area.

Abstract: The present disclosure provides a method, device and system for testing memory devices. The testing method includes: receiving a test instruction, the test instruction being used to characterize a model of a memory device to be tested that is connected to a test platform; selecting, according to the test instruction, a testing method corresponding to the model of the memory device to be tested from a plurality of pre-stored testing methods as a target testing method; and executing the target testing method to test the memory device to be tested.

Abstract: A power consumption measurement assembly includes: at least two sampling modules respectively connected to a circuit to be measured in series; a gating module configured to gate one of the at least two sampling modules; an amplifying module configured to acquire and amplify a voltage signal across the gated sampling module; and a processing module connected to the gating module and the amplifying module and configured to: control and adjust the gated sampling module and an amplification of the amplifying module, calculate a power consumption value based on the amplified voltage signal and transmit the power consumption value.

Abstract: A current test circuit can include a sampling resister array with a control end connected with a main control component, a first end is connected with a power conversion circuit, and a second end configured to be connected with a component to be tested. The sampling resistor array includes at least two sampling branches, each having an analog switch and a sampling resistor connected serially. In the test, the main control component can generate a control signal according to the operating state of the component and gate at least one sampling branch of the sampling resistor array through the control signal, obtain voltage values at two ends of the sampling resistor array through a voltage test assembly, and determine the current of the component according to the voltage values at two ends of the sampling resistor array and resistance values of the sampling resistor array.

Abstract: A test fixture includes a signal test board, a circuit routing, and a branch routing. The signal test board includes a first surface and a second surface. The first surface has a first pin and a test point. The second surface has a second pin. The circuit routing is located in the signal test board and configured to connect the first pin and a corresponding second pin. A portion of the circuit routing includes an upper routing connected with one first pin, a lower routing connected with one second pin, and a via-hole routing connected with two ends of the upper routing and the lower routing. One end, connected with the via-hole routing, of the upper routing is located in a projection area of the corresponding test point. The branch routing is located in the signal test board and configured to connect the test point with a corresponding upper routing.