Patents by Inventor Maraki Hirosawa

Maraki Hirosawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper conductive composition
    Patent number: 5045236
    Abstract: A copper conductive composition comprising 100 parts by weight of spherical copper powder coated with silver as metal powder, 6 to 18 parts by weight of resol type phenolic resin containing a dimethylene ether bond in bonded formaldehyde by 5% or more, the molar ratio between the formaldehyde thereof and phenol thereof (formaldehyde/phenol) being 1.0 to 3.0, 0.05 to 1 parts by weight of dispersant, and 2 to 15 parts by weight of solvent. Therefore, an excellent conductivity and solderability of the cured film can be obtained.
    Type: Grant
    Filed: November 14, 1989
    Date of Patent: September 3, 1991
    Assignees: Mitsui Mining & Smelting Co., Gunei Chemical Industry Co., Ltd.
    Inventors: Masayuki Tsunaga, Kazuaki Yuba, Yoshiaki Kurimoto, Maraki Hirosawa