Patents by Inventor Maraki Maetani
Maraki Maetani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105600Abstract: A wiring substrate includes an insulator and first and second conductors. The insulator has a first top surface, a first side surface, and first and second recesses. The first conductor is positioned on the first top surface and has a first end surface. The second conductor is positioned on the first top surface and has a second end surface. The first recess contacts the first and second end surfaces. The second recess is between the first and second conductors. The first recess extends in a second direction and has a first inner side surface and a first bottom surface. The second recess has a second inner side surface and a second bottom surface. The distance from the first top surface to the first bottom surface in a third direction is smaller than the distance from the first top surface to the second bottom surface in the third direction.Type: ApplicationFiled: September 26, 2023Publication date: March 28, 2024Applicant: KYOCERA CorporationInventors: Yoshiki KAWAZU, Tomoya KON, Maraki MAETANI, Ryota FUJIWARA
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Patent number: 9360638Abstract: An optical transmission body includes a substrate having a through hole penetrating therethrough in a thickness direction thereof; a cladding member at least a part of which is positioned to be filled in the through hole, and which has an optical waveguide hole which is positioned inside the through hole and penetrates through the cladding member in a thickness direction thereof and a guide hole portion which is positioned away from the optical waveguide hole and is concave in the thickness direction; and a core member disposed inside the optical waveguide hole.Type: GrantFiled: August 31, 2011Date of Patent: June 7, 2016Assignee: Kyocera CorporationInventors: Maraki Maetani, Yuji Masuda
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Patent number: 9057827Abstract: Provided are an optical transmission structure having a high degree of flexibility in the design of an optical waveguide and a method for manufacturing the optical transmission structure, and also an optical transmission module. An optical transmission structure includes a main substrate (30), a cladding member (40), and core members (50). The main substrate (30) has a through hole (30a) penetrating therethrough in a thickness direction thereof. The cladding member (40) is disposed inside the through hole (30a) and has a plurality of optical waveguide holes (40a) penetrating therethrough in a thickness direction thereof. The core members (50) are disposed inside the plurality of optical waveguide holes (40a), respectively, and have a refractive index larger than the cladding member (40).Type: GrantFiled: May 31, 2011Date of Patent: June 16, 2015Assignee: Kyocera CorporationInventors: Maraki Maetani, Takahiro Matsubara, Yuji Masuda, Kaori Tanaka
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Patent number: 8989531Abstract: The invention relates to an optical-electrical wiring board (2) and an optical module (1). The optical-electrical wiring board (2) includes a substrate (8), a dielectric layer (11), first conductive layers (16a) and second conductive layers (16b). The dielectric layer (11) includes a first region (B) and a second region (C). The first region (B) constitutes a plurality of light transmission portions (11B). The second region (C) has a plurality of pairs of conductive layers each having an overlap portion (10) in which one of the plurality of second conductive layers (16b) and one of the plurality of first conductive layers (16a) overlap each other when seen through in a laminated direction (a) of the dielectric layer (11) and the substrate (8).Type: GrantFiled: March 30, 2010Date of Patent: March 24, 2015Assignee: Kyocera CorporationInventors: Maraki Maetani, Masahiko Hirose
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Patent number: 8811782Abstract: An optical transmission board includes a substrate being provided with a through hole formed in a thickness direction of the substrate so as to penetrate from top to bottom of the substrate; a cladding member at least part of which locates inside the through hole, having an optical waveguide hole being inside the through hole and penetrating the cladding member in the thickness direction thereof, and having an upper surface having a surface roughness smaller than that of an upper surface of the substrate; a core member disposed inside the optical waveguide hole; an electrically conductive body disposed on the upper surface of the cladding member; and an optical element electrically connected to the electrically conductive body, having a light-receiving surface or a light-emitting surface opposed to an upper surface of the core member.Type: GrantFiled: August 31, 2011Date of Patent: August 19, 2014Assignee: Kyocera CorporationInventor: Maraki Maetani
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Publication number: 20130188908Abstract: An optical transmission body includes a substrate having a through hole penetrating therethrough in a thickness direction thereof; a cladding member at least a part of which is positioned to be filled in the through hole, and which has an optical waveguide hole which is positioned inside the through hole and penetrates through the cladding member in a thickness direction thereof and a guide hole portion which is positioned away from the optical waveguide hole and is concave in the thickness direction; and a core member disposed inside the optical waveguide hole.Type: ApplicationFiled: August 31, 2011Publication date: July 25, 2013Applicant: KYOCERA CORPORATIONInventors: Maraki Maetani, Yuji Masuda
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Publication number: 20130163920Abstract: An optical transmission board includes a substrate being provided with a through hole formed in a thickness direction of the substrate so as to penetrate from top to bottom of the substrate; a cladding member at least part of which locates inside the through hole, having an optical waveguide hole being inside the through hole and penetrating the cladding member in the thickness direction thereof, and having an upper surface having a surface roughness smaller than that of an upper surface of the substrate; a core member disposed inside the optical waveguide hole; an electrically conductive body disposed on the upper surface of the cladding member; and an optical element electrically connected to the electrically conductive body, having a light-receiving surface or a light-emitting surface opposed to an upper surface of the core member.Type: ApplicationFiled: August 31, 2011Publication date: June 27, 2013Applicant: KYOCERA CORPORATIONInventor: Maraki Maetani
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Publication number: 20130156371Abstract: Provided are an optical transmission structure having a high degree of flexibility in the design of an optical waveguide and a method for manufacturing the optical transmission structure, and also an optical transmission module. An optical transmission structure includes a main substrate (30), a cladding member (40), and core members (50). The main substrate (30) has a through hole (30a) penetrating therethrough in a thickness direction thereof. The cladding member (40) is disposed inside the through hole (30a) and has a plurality of optical waveguide holes (40a) penetrating therethrough in a thickness direction thereof. The core members (50) are disposed inside the plurality of optical waveguide holes (40a), respectively, and have a refractive index larger than the cladding member (40).Type: ApplicationFiled: May 31, 2011Publication date: June 20, 2013Applicant: KYOCERA CORPORATIONInventors: Maraki Maetani, Takahiro Matsubara, Yuji Masuda, Kaori Tanaka
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Patent number: 8324508Abstract: A composite circuit board according to an embodiment of the invention includes a first circuit board having a first conductive line and a second conductive line which is longer in length than the first conductive line, and a second circuit board having a third conductive line which is electrically connected to the first conductive line and a fourth conductive line which is electrically connected to the second conductive line and is shorter in length than the third conductive line.Type: GrantFiled: March 27, 2009Date of Patent: December 4, 2012Assignee: Kyocera CorporationInventor: Maraki Maetani
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Publication number: 20120014641Abstract: The invention relates to an optical-electrical wiring board (2) and an optical module (1). The optical-electrical wiring board (2) includes a substrate (8), a dielectric layer (11), first conductive layers (16a) and second conductive layers (16b). The dielectric layer (11) includes a first region (B) and a second region (C). The first region (B) constitutes a plurality of light transmission portions (11B). The second region (C) has a plurality of pairs of conductive layers each having an overlap portion (10) in which one of the plurality of second conductive layers (16b) and one of the plurality of first conductive layers (16a) overlap each other when seen through in a laminated direction (a) of the dielectric layer (11) and the substrate (8).Type: ApplicationFiled: March 30, 2010Publication date: January 19, 2012Applicant: KYOCERA CORPORATIONInventors: Maraki Maetani, Masahiko Hirose
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Patent number: 8013427Abstract: A wiring board equipped with differential lines which compensate for differences in via lengths to minimize signal deterioration is disclosed. Two conductors are couple to different substrate levels through vias of different lengths. Compensation means are provided to correct for the phase difference caused by the different lengths.Type: GrantFiled: August 26, 2009Date of Patent: September 6, 2011Assignee: Kyocera CorporationInventor: Maraki Maetani
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Publication number: 20100206625Abstract: A composite circuit board according to an embodiment of the invention includes a first circuit board having a first conductive line and a second conductive line which is longer in length than the first conductive line, and a second circuit board having a third conductive line which is electrically connected to the first conductive line and a fourth conductive line which is electrically connected to the second conductive line and is shorter in length than the third conductive line.Type: ApplicationFiled: March 27, 2009Publication date: August 19, 2010Applicant: KYOCERA CORPORATIONInventor: Maraki Maetani
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Publication number: 20090315158Abstract: A wiring board equipped with differential lines which compensate for differences in via lengths to minimize signal deterioration is disclosed. Two conductors are couple to different substrate levels through vias of different lengths. Compensation means are provided to correct for the phase difference caused by the different lengths.Type: ApplicationFiled: August 26, 2009Publication date: December 24, 2009Applicant: KYOCERA CORPORATIONInventor: Maraki MAETANI
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Patent number: 6566601Abstract: The invention is directed to a high frequency semiconductor device housing package comprising: an insulating substrate having on its top surface a high frequency semiconductor device mounting and housing portion; a plurality of wiring conductors delivered from the mounting and housing portion through the under surface of the insulating substrate, to which an electrode of the high frequency semiconductor device is electrically connected; and a plurality of ball-shaped signal terminals and ball-shaped grounding terminals arranged on the under surface of the insulating substrate and electrically connected to the wiring conductor, the ball-shaped grounding terminals being arranged substantially circularly so as to surround the centered ball-shaped signal terminal. This construction achieves efficient transmission of high-frequency signals because of its excellent high frequency characteristics in the ball-shaped terminals. It also excels in easiness of mass production and mounting accuracy.Type: GrantFiled: March 26, 2002Date of Patent: May 20, 2003Assignee: Kyocera CorporationInventor: Maraki Maetani
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Patent number: 6538316Abstract: A high frequency semiconductor device housing package comprises a dielectric substrate, an internal signal wiring conductor, an interlayer grounding conductor layer, a signal wiring conductor, a ball-shaped signal terminal mounting pad, and a grounding conductor layer. In the interlayer grounding conductor layer opposed to the signal wiring conductor is provided a conductive layer non-forming portion so as to be located in a region directly above the ball-shaped signal terminal mounting pad. An effective distance from the ball-shaped signal terminal mounting pad to the interlayer grounding conductor layer is made greater than an effective distance from the ball-shaped signal terminal mounting pad to the grounding conductor layer. With this configuration, the parasitic capacitance at the pad is reduced and a high frequency signal is efficiently transmitted.Type: GrantFiled: March 27, 2002Date of Patent: March 25, 2003Assignee: Kyocera CorporationInventor: Maraki Maetani
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Publication number: 20020166689Abstract: The invention is directed to a high frequency semiconductor device housing package comprising: an insulating substrate having on its top surface a high frequency semiconductor device mounting and housing portion; a plurality of wiring conductors delivered from the mounting and housing portion through the under surface of the insulating substrate, to which an electrode of the high frequency semiconductor device is electrically connected; and a plurality of ball-shaped signal terminals and ball-shaped grounding terminals arranged on the under surface of the insulating substrate and electrically connected to the wiring conductor, the ball-shaped grounding terminals being arranged substantially circularly so as to surround the centered ball-shaped signal terminal. This construction achieves efficient transmission of high-frequency signals because of its excellent high frequency characteristics in the ball-shaped terminals. It also excels in easiness of mass production and mounting accuracy.Type: ApplicationFiled: March 26, 2002Publication date: November 14, 2002Inventor: Maraki Maetani
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Publication number: 20020140090Abstract: A high frequency semiconductor device housing package comprises a dielectric substrate, an internal signal wiring conductor, an interlayer grounding conductor layer, a signal wiring conductor, a ball-shaped signal terminal mounting pad, and a grounding conductor layer. In the interlayer grounding conductor layer opposed to the signal wiring conductor is provided a conductive layer non-forming portion so as to be located in a region directly above the ball-shaped signal terminal mounting pad. An effective distance from the ball-shaped signal terminal mounting pad to the interlayer grounding conductor layer is made greater than an effective distance from the ball-shaped signal terminal mounting pad to the grounding conductor layer. With this configuration, the parasitic capacitance at the pad is reduced and a high frequency signal is efficiently transmitted.Type: ApplicationFiled: March 27, 2002Publication date: October 3, 2002Applicant: KYOCERA CORPORATIONInventor: Maraki Maetani
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Patent number: 6441471Abstract: A high frequency wiring substrate comprises surface transmission line conductors formed on upper and lower surfaces of a dielectric substrate and surrounded by respective surface ground conductors, and a transmission line interconnect structure for transmitting a high frequency signal between the surface transmission line conductors via an interlayer transmission line conductor surrounded by an interlayer ground conductor and connected at both ends thereof to the respective ends of the surface transmission line conductors by signal conducting through-hole conductors. The surface ground conductors are connected together by two arrays of top-to-bottom through-hole ground conductors, while the interlayer ground conductor is connected to the surface ground conductors by interlayer through-hole ground conductors.Type: GrantFiled: December 26, 2001Date of Patent: August 27, 2002Assignee: Kyocera CorporationInventor: Maraki Maetani
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Publication number: 20020084514Abstract: A high frequency wiring substrate comprises surface transmission line conductors formed on upper and lower surfaces of a dielectric substrate and surrounded by respective surface ground conductors, and a transmission line interconnect structure for transmitting a high frequency signal between the surface transmission line conductors via an interlayer transmission line conductor surrounded by an interlayer ground conductor and connected at both ends thereof to the respective ends of the surface transmission line conductors by signal conducting through-hole conductors. The surface ground conductors are connected together by two arrays of top-to-bottom through-hole ground conductors, while the interlayer ground conductor is connected to the surface ground conductors by interlayer through-hole ground conductors.Type: ApplicationFiled: December 26, 2001Publication date: July 4, 2002Inventor: Maraki Maetani