Patents by Inventor Marc A. Abelanet

Marc A. Abelanet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Socket assembly for integrated circuit chip carrier package
    Patent number: 5829988
    Abstract: A socket for a ball grid array chip carrier package containing a die which is electrically interconnected. Individual spring elements in the socket are utilized for interconnecting each ball of the ball grid array. The individual spring elements provide upward pressure against individual sections of a substrate in direct contact with the balls of the ball grid array. The individual sections of the substrate are formed into individual beam members that are permitted to flex in response to pressure from the underlying spring elements.
    Type: Grant
    Filed: November 14, 1996
    Date of Patent: November 3, 1998
    Assignee: Amkor Electronics, Inc.
    Inventors: John R. McMillan, William H. Maslakow, Marc A. Abelanet