Abstract: Embodiments are directed to monitoring network traffic using network monitoring computers (NMCs). Metrics may be determined based on monitoring network traffic associated with a plurality of entities each associated with a profile that includes the metrics for each entity. Beaconing metrics associated with beaconing activity may be determined based on the metrics. The profile of each entity may be compared with the beaconing metrics to determine the entities that may be engaged in beaconing activity. The entities may be characterized based on beaconing activity such that the beaconing activity includes communication with endpoints associated with the third parties, employing communication protocols associated with the third-parties, or exchanging payloads consistent with the beaconing activity. Reports that include information associated with the entities and its beaconing activity may be generated.

Abstract: A shotcrete nozzle assembly comprising: a tubular body including a body sidewall defining a central passageway extending along a central longitudinal passageway axis, and water dispensing bores extending through the body sidewall and including: first and second sets of water dispensing bores positioned such that outlet openings thereof defined in an inner face of the body sidewall are disposed in a respective one of longitudinally spaced-apart first and second transversal planes extending perpendicularly to the passageway axis, at least some of the water dispensing bores being oriented such that the central bore axes thereof extend in a non-radial direction relative to the passageway axis, and such that an orthogonal projection of the central bore axes of the first and second sets of water dispensing bores onto one of the transversal planes forms first and second projected central bore axes which intersect each other at a first non-zero angle.

Abstract: Plastic packaging materials and processes that facilitate recycling of PET (polyethylene terephthalate) containers such as PET bottles and crystallizable clear PET-g (glycol-modified polyethylene terephthalate) labels such as heat shrinking sleeve labels. A clear primer coating for recyclable PET-g shrink-sleeve labels, curable upon exposure to UV light, which is excellent in adhesion, steam-resistance and overprint ability, and which promotes the de-inking of subsequent coloured ink layers under relatively mild caustic wash conditions. Methods of utilizing such a primer coating within flexographic printing processes.

Abstract: A plasma coating method for coating particulate matter, including the steps of: a) providing a low-temperature atmospheric plasma jet from a plasma gas outside of the reaction chamber; b) inserting a precursor into the plasma jet, thereby obtaining a plasma coating flow comprising an excited precursor, followed by injecting the plasma coating flow comprising the excited precursor in the reaction chamber, and c) subjecting particulate matter to said plasma coating flow comprising said excited precursor, thereby obtaining particulate matter comprising an at least partial coating. a coating reactor apparatus and a system involve the plasma coating method.

Abstract: The present disclosure describes a coaxial-interconnect structure that is integrated into a semiconductor component and methods of forming the coaxial-interconnect structure. The coaxial interconnect-structure, which electrically couples circuitry of an integrated-circuit (IC) die to traces of a packaging substrate, comprises a signal core elongated about an axis, a ground shield elongated about the axis, and an insulator disposed between the signal core and the ground shield.

Abstract: A probe card for testing dies of a substrate during a wafer sort process includes a printed circuit board (PCB) and a test site arranged to connect respectively to one of the dies during a test cycle. The test site includes a first pin connecting band and a first pin set. The first pin connecting band is connected to the PCB. The first pin set is connected to the first pin connecting band and includes a pin configuration for a testing device to perform a first type of test on a first die. The test site includes only pins in the first pin set. A number of pins in the first pin set is less than a number of pins used to perform a second type of test on the first die. The second type of test is performed at a slower processing speed than the first type of test.

Abstract: The present disclosure describes apparatuses and techniques for self-aligning integrated circuit (IC) dies. In some aspects, a hydrophobic material is deposited on a surface of a substrate to form a pattern on the surface of the substrate. The pattern may expose areas of the substrate surface for placement of IC dies. A water-based solution is then applied to the exposed areas such that droplets form on the exposed areas of the substrate surface. IC dies are placed on the droplets of the water-based solution, which can cause the IC dies to align with the exposed areas of the substrate surface. The droplets are then caused to evaporate such that the IC dies settle on the exposed areas of the substrate surface.

Abstract: The present disclosure describes methods and apparatuses for testing an integrated circuit. In some aspects, a test engine of a system-on-chip (SoC) receives a test trigger from an external test port of a multi-chip module. The multi-chip module includes the SoC and integrated circuitry. Responsive to receiving the test trigger, the test engine initiates execution of a test associated with the integrated circuitry. The test engine also generates test data associated with the test and provides the test data at the external test port of the MCM. In this manner, internal tests can be executed within the multi-chip module. In other aspects, the SoC and the integrated circuitry are not packaged together. The test engine can receive the test trigger from a test port of the SoC and initiate execution of the test. In this way, the SoC may act as a test instrument for the integrated circuitry.

Abstract: The present disclosure describes a coaxial-interconnect structure that is integrated into a semiconductor component and methods of forming the coaxial-interconnect structure. The coaxial interconnect-structure, which electrically couples circuitry of an integrated-circuit (IC) die to traces of a packaging substrate, comprises a signal core elongated about an axis, a ground shield elongated about the axis, and an insulator disposed between the signal core and the ground shield.

Abstract: A probe card for testing dies of a substrate during a wafer sort process includes a printed circuit board (PCB) and a test site arranged to connect respectively to one of the dies during a test cycle. The test site includes a first pin connecting band and a first pin set. The first pin connecting band is connected to the PCB. The first pin set is connected to the first pin connecting band and includes a pin configuration for a testing device to perform a first type of test on a first die. The test site includes only pins in the first pin set. A number of pins in the first pin set is less than a number of pins used to perform a second type of test on the first die. The second type of test is performed at a slower processing speed than the first type of test.

Abstract: An apparatus, including methods of construction and use, for super-fine pitch integrated circuit testing is disclosed. The apparatus includes a substrate of one or more redistribution layers (RDLs), a plurality of vertical interconnect access (via) columns, a material that backs the substrate, and another material that protects the plurality of via columns. Semiconductor wafer fabrication processes are used to fabricate the apparatus, effective to enable the apparatus to test one or more IC die having pad pitch spacing of less than 50 um.

Abstract: The present disclosure describes apparatuses and techniques for self-aligning integrated circuit (IC) dies. In some aspects, a hydrophobic material is deposited on a surface of a substrate to form a pattern on the surface of the substrate. The pattern may expose areas of the substrate surface for placement of IC dies. A water-based solution is then applied to the exposed areas such that droplets form on the exposed areas of the substrate surface. IC dies are placed on the droplets of the water-based solution, which can cause the IC dies to align with the exposed areas of the substrate surface. The droplets are then caused to evaporate such that the IC dies settle on the exposed areas of the substrate surface.

Abstract: A process for recovering unreacted olefin in a polyolefin manufacturing process comprising the treatment of a purge bin vent gas. The process involves cooling and condensing the vent gas (purge stream), which contains at least an olefin, a paraffin, and nitrogen, to produce a liquid condensate and an uncondensed (residual) gas stream. Both streams are then passed through membrane separation steps. The membrane separation of the uncondensed gas stream results in a residue stream containing mostly nitrogen and/or paraffin and a permeate stream enriched in either C2+ hydrocarbons or olefin, depending on the type of separation. The permeate from this step is recirculated within the process prior to the condensation step. The membrane separation of the condensate results in a residue stream containing paraffin and a permeate stream enriched in olefin, which may be recycled to the polymerization reactor.

Abstract: Embodiments of the present disclosure provide a method directed towards applying an average radio calibration result obtained from one or more units of a manufacturing order to another unit of the manufacturing order and performing a verification test on the other unit to determine whether the other unit is calibrated to a pre-determined specification. Other embodiments may be described and/or claimed.