Abstract: A method of detecting and identifying road surface defects is provided. Motion and position information is received from a plurality of vehicles. A profile is retrieved for a particular vehicle from a database of vehicle profiles by using an identifier of the particular vehicle. One or more criteria are identified for detecting a particular type of road surface defect based on the retrieved profile of the particular vehicle. Upon determining that the received motion and position data satisfies the identified criteria, a detection of a road surface defect of the particular type and a location associated with the detected road surface defect based on the received position information is reported.

Abstract: A structure to couple light to a waveguide is described. In an example, a light source of the structure may emit light from an emission point towards a lens of the structure. The light source may be disposed at a location such that the emission point of the light source is offset from a center of the lens. The lens may be integrated in a substrate of a structure comprising the light source. The lens may refract the light emitted from the emission point at an angle. The angle may be based on the offset between the emission point and the center of the lens. The structure may couple the refracted light to a coupler of the waveguide at an incident angle.

Abstract: A structure to couple light to a waveguide is described. In an example, a light source of the structure may emit light from an emission point towards a lens of the structure. The light source may be disposed at a location such that the emission point of the light source is offset from a center of the lens. The lens may be integrated in a substrate of a structure comprising the light source. The lens may refract the light emitted from the emission point at an angle. The angle may be based on the offset between the emission point and the center of the lens. The structure may couple the refracted light to a coupler of the waveguide at an incident angle.

Abstract: A structure to couple light to a waveguide is described. In an example, a light source of the structure may emit light from an emission point towards a lens of the structure. The light source may be disposed at a location such that the emission point of the light source is offset from a center of the lens. The lens may be integrated in a substrate of a structure comprising the light source. The lens may refract the light emitted from the emission point at an angle. The angle may be based on the offset between the emission point and the center of the lens. The structure may couple the refracted light to a coupler of the waveguide at an incident angle.

Abstract: A method of detecting and identifying road surface defects is provided. Motion and position information is received from a plurality of vehicles. A profile is retrieved for a particular vehicle from a database of vehicle profiles by using an identifier of the particular vehicle. One or more criteria are identified for detecting a particular type of road surface defect based on the retrieved profile of the particular vehicle. Upon determining that the received motion and position data satisfies the identified criteria, a detection of a road surface defect of the particular type and a location associated with the detected road surface defect based on the received position information is reported.

Abstract: An optical phase modulator includes an input source that is configured to receive a light source. There is an output operative to provide a phase modulated output signal based on the received light source. There is a first optical coupler configured to split the light source into a first optical path of a Mach Zehnder Interferometer (MZI) and a second optical path of the MZI. A static phase shifter is configured to provide a static phase shift to the first optical path. There is a phase modulator in the second optical path. There is a second optical coupler configured to combine the first optical path and the second optical path. The first and second optical couplers are tuned such that the phase modulated optical signal at the output provides a substantially constant amplitude that is independent of a change in loss introduced by the phase modulator.

Abstract: An optical phase modulator includes an input source that is configured to receive a light source. There is an output operative to provide a phase modulated output signal based on the received light source. There is a first optical coupler configured to split the light source into a first optical path of a Mach Zehnder Interferometer (MZI) and a second optical path of the MZI. A static phase shifter is configured to provide a static phase shift to the first optical path. There is a phase modulator in the second optical path. There is a second optical coupler configured to combine the first optical path and the second optical path. The first and second optical couplers are tuned such that the phase modulated optical signal at the output provides a substantially constant amplitude that is independent of a change in loss introduced by the phase modulator.

Abstract: Methods an systems for low-power transmission include biasing an emitter in a non-linear operating range of the emitter near a threshold current of the emitter. A data signal is distorted to add a precursor pulse to a rising edge of a data waveform to quickly bring the emitter into a linear operating range. The distorted data signal is transmitted at the emitter.

Abstract: Methods an systems for low-power transmission include biasing an emitter in a non-linear operating range of the emitter near a threshold current of the emitter. A data signal is distorted to add a precursor pulse to a rising edge of a data waveform to quickly bring the emitter into a linear operating range. The distorted data signal is transmitted at the emitter.

Abstract: Processing for a silicon photonics wafer is provided. A silicon photonics wafer that includes an active silicon photonics layer, a thin buried oxide layer, and a silicon substrate is received. The thin buried oxide layer is located between the active silicon photonics layer and the silicon substrate. An electrical CMOS wafer that includes an active electrical layer is also received. The active silicon photonics layer of the silicon photonics wafer is flip chip bonded to the active electrical layer of the electrical CMOS wafer. The silicon substrate is removed exposing a backside surface of the thin buried oxide layer. A low-optical refractive index backing wafer is added to the exposed backside surface of the thin buried oxide layer. The low-optical refractive index backing wafer is a glass substrate or silicon substrate wafer. The silicon substrate wafer includes a thick oxide layer that is attached to the thin buried oxide layer.

Abstract: Processing for a silicon photonics wafer is provided. A silicon photonics wafer that includes an active silicon photonics layer, a thin buried oxide layer, and a silicon substrate is received. The thin buried oxide layer is located between the active silicon photonics layer and the silicon substrate. An electrical CMOS wafer that includes an active electrical layer is also received. The active silicon photonics layer of the silicon photonics wafer is flip chip bonded to the active electrical layer of the electrical CMOS wafer. The silicon substrate is removed exposing a backside surface of the thin buried oxide layer. A low-optical refractive index backing wafer is added to the exposed backside surface of the thin buried oxide layer. The low-optical refractive index backing wafer is a glass substrate or silicon substrate wafer. The silicon substrate wafer includes a thick oxide layer that is attached to the thin buried oxide layer.

Abstract: A method, system, and computer program product for implementing stream processing are provided. The system includes an application framework and applications containing dataflow graphs managed by the application framework running on a first network. The system also includes at least one circuit switch in the first network having a configuration that is controlled by the application framework, a plurality of processing nodes interconnected by the first network over one of wireline and wireless links, and a second network for providing at least one of control and additional data transfer over the first network. The application framework reconfigures circuit switches in response to monitoring aspects of the applications and the first network.

Abstract: A method, system, and computer program product for implementing stream processing are provided. The system includes an application framework and applications containing dataflow graphs managed by the application framework running on a first network. The system also includes at least one circuit switch in the first network having a configuration that is controlled by the application framework, a plurality of processing nodes interconnected by the first network over one of wireline and wireless links, and a second network for providing at least one of control and additional data transfer over the first network.

Abstract: A method and structure for controlling a manufacturing tool includes measuring different manufacturing parameters of the tool, transforming a plurality of time series of the manufacturing parameters into intermediate variables based on restrictions and historical reference statistics, generating a surrogate variable based on the intermediate variables, if the surrogate variable exceeds a predetermined limit, identifying a first intermediate variable, of the intermediate variables, that caused the surrogate variable to exceed the predetermined limit and identifying a first manufacturing parameter associated with the first intermediate variable, and inhibiting further operation of the tool until the first manufacturing parameter has been modified to bring the surrogate value within the predetermined limit.

Abstract: A method and structure for controlling a manufacturing tool includes measuring different manufacturing parameters of the tool, transforming a plurality of time series of the manufacturing parameters into intermediate variables based on restrictions and historical reference statistics, generating a surrogate variable based on the intermediate variables, if the surrogate variable exceeds a predetermined limit, identifying a first intermediate variable, of the intermediate variables, that caused the surrogate variable to exceed the predetermined limit and identifying a first manufacturing parameter associated with the first intermediate variable, and inhibiting further operation of the tool until the first manufacturing parameter has been modified to bring the surrogate value within the predetermined limit.

Abstract: A method and structure for controlling a manufacturing tool includes measuring different manufacturing parameters of the tool, transforming a plurality of time series of the manufacturing parameters into intermediate variables based on restrictions and historical reference statistics, generating a surrogate variable based on the intermediate variables, if the surrogate variable exceeds a predetermined limit, identifying a first intermediate variable, of the intermediate variables, that caused the surrogate variable to exceed the predetermined limit and identifying a first manufacturing parameter associated with the first intermediate variable, and inhibiting further operation of the tool until the first manufacturing parameter has been modified to bring the surrogate value within the predetermined limit.

Abstract: A method and structure for controlling a manufacturing tool includes measuring different manufacturing parameters of the tool, transforming a plurality of time series of the manufacturing parameters into intermediate variables based on restrictions and historical reference statistics, generating a surrogate variable based on the intermediate variables, if the surrogate variable exceeds a predetermined limit, identifying a first intermediate variable, of the intermediate variables, that caused the surrogate variable to exceed the predetermined limit and identifying a first manufacturing parameter associated with the first intermediate variable, and inhibiting further operation of the tool until the first manufacturing parameter has been modified to bring the surrogate value within the predetermined limit.

Abstract: A method and structure for controlling a manufacturing tool includes measuring different manufacturing parameters of the tool, transforming a plurality of time series of the manufacturing parameters into intermediate variables based on restrictions and historical reference statistics, generating a surrogate variable based on the intermediate variables, if the surrogate variable exceeds a predetermined limit, identifying a first intermediate variable, of the intermediate variables, that caused the surrogate variable to exceed the predetermined limit and identifying a first manufacturing parameter associated with the first intermediate variable, and inhibiting further operation of the tool until the first manufacturing parameter has been modified to bring the surrogate value within the predetermined limit.

Abstract: The present invention is a contamination measuring device and method of using the same according to a Chemical Mechanical Polishing (CMP) brush cleaner equipment/technology. A collection device is mounted in a brush cleaning device for collecting effluent which flows off of a wafer. The effluent is passed to a particle counter which measures the contamination levels of the effluent. A computer stores the data collected by the particle counter and computes the particles per liter of effluent and provides real time data. The contamination of the effluent corresponds to the contamination of the brushes in the cleaning device and therefore is means for predicting when the brushes in the cleaning device should be replaced.

Abstract: The present invention is a contamination measuring device and method of using the same according to a Chemical Mechanical Polishing (CMP) brush cleaner equipment/technology. A collection device is mounted in a brush cleaning device for collecting effluent which flows off of a wafer. The effluent is passed to a particle counter which measures the contamination levels of the effluent. A computer stores the data collected by the particle counter and computes the particles per liter of effluent and provides real time data. The contamination of the effluent corresponds to the contamination of the brushes in the cleaning device and therefore is means for predicting when the brushes in the cleaning device should be replaced.