Patents by Inventor Marc Abouaf

Marc Abouaf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microreactor systems and methods
    Patent number: 11642644
    Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: May 9, 2023
    Assignee: H.C. Starck Solutions Coldwater, LLC
    Inventors: Paul R. Aimone, Marc Abouaf, Patrick Hogan
  • Copper-alloy capping layers for metallization in touch-panel displays
    Patent number: 11640222
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: May 2, 2023
    Assignee: Materion Newton, Inc.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
    Publication number: 20220308705
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Application
    Filed: June 13, 2022
    Publication date: September 29, 2022
    Inventors: Shuwei SUN, Francois-Charles DARY, Marc ABOUAF, Patrick HOGAN, Qi ZHANG
  • Copper-alloy capping layers for metallization in touch-panel displays
    Patent number: 11392257
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: July 19, 2022
    Assignee: MATERION NEWTON INC.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • MICROREACTOR SYSTEMS AND METHODS
    Publication number: 20220023821
    Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.
    Type: Application
    Filed: August 4, 2021
    Publication date: January 27, 2022
    Inventors: Paul R. Aimone, Marc Abouaf, Patrick Hogan
  • Microreactor systems and methods
    Patent number: 11110426
    Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: September 7, 2021
    Assignee: H.C. STARCK INC.
    Inventors: Paul R. Aimone, Marc Abouaf, Patrick Hogan
  • COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
    Publication number: 20210208738
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 8, 2021
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • Thin-film transistor and method of forming an electrode of a thin-film transistor
    Patent number: 10916569
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: February 9, 2021
    Assignee: H.C. STARCK INC.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • MICROREACTOR SYSTEMS AND METHODS
    Publication number: 20200147579
    Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.
    Type: Application
    Filed: November 13, 2019
    Publication date: May 14, 2020
    Inventors: Paul R. Aimone, Marc Abouaf, Patrick Hogan
  • Microreactor systems and methods
    Patent number: 10507449
    Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: December 17, 2019
    Assignee: H.C. STARCK INC.
    Inventors: Paul R. Aimone, Marc Abouaf, Patrick Hogan
  • MICROREACTOR SYSTEMS AND METHODS
    Publication number: 20190022620
    Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.
    Type: Application
    Filed: September 21, 2018
    Publication date: January 24, 2019
    Inventors: Paul R. Aimone, Marc Abouaf, Patrick Hogan
  • Microreactor systems and methods
    Patent number: 10105671
    Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: October 23, 2018
    Assignee: H.C. STARCK INC.
    Inventors: Paul R. Aimone, Marc Abouaf, Patrick Hogan
  • COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
    Publication number: 20180175075
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Application
    Filed: February 13, 2018
    Publication date: June 21, 2018
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • Copper-alloy capping layers for metallization in touch-panel displays
    Patent number: 9929187
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: March 27, 2018
    Assignee: H.C. STARCK INC.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSISTORS AND FLAT PANEL DISPLAYS
    Publication number: 20160172386
    Abstract: In various embodiments, electronic devices such as thin-film transistors incorporate electrodes featuring a conductor layer and, disposed below the conductor layer, a barrier layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Application
    Filed: February 19, 2016
    Publication date: June 16, 2016
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • MICROREACTOR SYSTEMS AND METHODS
    Publication number: 20160129417
    Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.
    Type: Application
    Filed: November 10, 2015
    Publication date: May 12, 2016
    Inventors: Paul R. AIMONE, Marc ABOUAF, Patrick HOGAN
  • Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displays
    Patent number: 9299472
    Abstract: In various embodiments, electronic devices such as thin-film transistors incorporate electrodes featuring a conductor layer and, disposed below the conductor layer, a barrier layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: March 29, 2016
    Assignee: H.C. Starck Inc.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • SPRAY REJUVENATION OF SPUTTERING TARGETS
    Publication number: 20160076138
    Abstract: In various embodiments, used sputtering targets are refurbished at least in part by maintaining a large obliquity angle between the spray-deposition gun and the depressed surface contour of the target during spray deposition of the target material.
    Type: Application
    Filed: November 24, 2015
    Publication date: March 17, 2016
    Inventors: Christopher MICHALUK, William LOEWENTHAL, Gary ROZAK, Marc ABOUAF, Patrick HOGAN, Steven A. MILLER
  • COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
    Publication number: 20140362307
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 11, 2014
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSISTORS AND FLAT PANEL DISPLAYS
    Publication number: 20140363933
    Abstract: In various embodiments, electronic devices such as thin-film transistors incorporate electrodes featuring a conductor layer and, disposed below the conductor layer, a barrier layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 11, 2014
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang