Patents by Inventor Marc Andrew Yesnik

Marc Andrew Yesnik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
    Patent number: 7037184
    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: May 2, 2006
    Assignee: Raytech Innovation Solutions, LLC
    Inventors: Angela Petroski, Richard D. Cooper, Paul Fathauer, Marc Andrew Yesnik
  • Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
    Patent number: 6852020
    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: February 8, 2005
    Assignee: Raytech Innovative Solutions, Inc.
    Inventors: Angela Petroski, Richard D. Cooper, Paul Fathauer, Marc Andrew Yesnik
  • Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
    Publication number: 20040142637
    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
    Type: Application
    Filed: January 22, 2003
    Publication date: July 22, 2004
    Inventors: Angela Petroski, Richard D. Cooper, Paul Fathauer, Marc Andrew Yesnik
  • Polishing pad for use in chemical - mechanical planarization of semiconductor wafers and method of making same
    Publication number: 20040142638
    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
    Type: Application
    Filed: January 22, 2003
    Publication date: July 22, 2004
    Inventors: Angela Petroski, Richard D. Cooper, Paul Fathauer, Marc Andrew Yesnik
  • Friction disc with surface pattern
    Patent number: D803116
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: November 21, 2017
    Inventors: Jeremiah Joseph Shepard, Przemyslaw A. Zagrodzki, Angela L. Petroski, Marc Andrew Yesnik