Abstract: A Hall sensor has a Hall sensor element, which has multiple connection points spaced apart from one another. A supply source serves for feeding an exciter current into the Hall sensor element and is connected to a first and a second connection point of the Hall sensor element. The Hall sensor has a first and a second comparison device. The first comparison device has a first input connected to a third connection point of the Hall sensor element, a second input connected to a reference signal generator for an upper reference value signal, and an output for a first comparison signal. The second comparison device has a third input connected to the third connection point, a fourth input connected to a reference signal generator for a lower reference value signal, and an output for a second comparison signal. The outputs are connected to an evaluation device for generating an error signal as a function of the first and second comparison signal.

Abstract: A Hall sensor has a Hall sensor element, having multiple connection locations and a current supply source or voltage supply source, which has a first and a second supply connector for output of a supply current or a supply voltage. The first supply connector is connected or can be connected with a first connection location to feed a current into the Hall sensor element, and the second supply connector is connected or can be connected with a second connection location of the Hall sensor element. The Hall sensor has a NAND gate, which is connected with the first connection location of the Hall sensor element using a first input, and with the second connection location of the Hall sensor element using a second input, and has an output for output of a first error signal.

Abstract: A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.

Abstract: A pressure sensor (10) has a carrier chip (20) in and/or on which at least one sensor element (30) is integrated, the measuring signal of which depends on the mechanical stress in the carrier chip (20). The carrier chip (20) is connected on its back side in a flat and material-locking fashion to a solid body (50), the modulus of elasticity of which differs from the modulus of elasticity of the carrier chip (20). The carrier chip (20) has at least two independent and longitudinal grooves (80a, 80b) between which the sensor element (30a, 30b) is arranged. The pressure sensor has a bias voltage circuit (40) and is used in a common rail injection system.

Abstract: A Hall sensor has a Hall sensor element, having multiple connection locations and a current supply source or voltage supply source, which has a first and a second supply connector for output of a supply current or a supply voltage. The first supply connector is connected or can be connected with a first connection location to feed a current into the Hall sensor element, and the second supply connector is connected or can be connected with a second connection location of the Hall sensor element. The Hall sensor has a NAND gate, which is connected with the first connection location of the Hall sensor element using a first input, and with the second connection location of the Hall sensor element using a second input, and has an output for output of a first error signal.

Abstract: A Hall sensor has a Hall sensor element, which has multiple connection points spaced apart from one another. A supply source serves for feeding an exciter current into the Hall sensor element and is connected to a first and a second connection point of the Hall sensor element. The Hall sensor has a first and a second comparison device. The first comparison device has a first input connected to a third connection point of the Hall sensor element, a second input connected to a reference signal generator for an upper reference value signal, and an output for a first comparison signal. The second comparison device has a third input connected to the third connection point, a fourth input connected to a reference signal generator for a lower reference value signal, and an output for a second comparison signal. The outputs are connected to an evaluation device for generating an error signal as a function of the first and second comparison signal.

Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.

Abstract: A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.

Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.

Abstract: A method and an apparatus for determining a rotation angle of a rotor in a motor with the aid of angle sensors by measurement of reference values and correction of the effected computations. The method is used, for example, in a synchronous motor.

Abstract: A pressure sensor (10) has a carrier chip (20) in and/or on which at least one sensor element (30) is integrated, the measuring signal of which depends on the mechanical stress in the carrier chip (20). The carrier chip (20) is connected on its back side in a flat and material-locking fashion to a solid body (50), the modulus of elasticity of which differs from the modulus of elasticity of the carrier chip (20). The carrier chip (20) has at least two independent and longitudinal grooves (80a, 80b) between which the sensor element (30a, 30b) is arranged. The pressure sensor has a bias voltage circuit (40) and is used in a common rail injection system.

Abstract: A method and an apparatus for determining a rotation angle of a rotor in a motor with the aid of angle sensors by measurement of reference values and correction of the effected computations. The method is used, for example, in a synchronous motor.

Abstract: A force sensor comprising a substrate, a semiconductor body, and a piezoresistive element provided on a top surface of the semiconductor body. The semiconductor body is connected to the substrate in a force-fit manner, and includes a first wing which is provided on the top surface of the semiconductor body and being connected to the semiconductor body in a force-fit manner. A first force application area is provided on the first wing. A second wing has a second force application area provided opposite the first wing. The piezoresistive element is disposed between the first wing and the second wing. A force distribution component is connected to the first force application area and the second force application area in a force-fit manner. The force distribution component having a first surface which is oriented away from the top surface of the semiconductor body and includes a third force application area.

Abstract: A force sensor comprising a substrate, a semiconductor body, and a piezoresistive element provided on a top surface of the semiconductor body. The semiconductor body is connected to the substrate in a force-fit manner, and includes a first wing which is provided on the top surface of the semiconductor body and being connected to the semiconductor body in force-fitting manner. A first force application area is provided on the first wing. A second wing has a second force application area provided opposite the first wing. The piezoresistive element is disposed between the first wing and the second wing. A force distribution component is connected to the first force application area and the second force application area in a force-fit manner. The force distribution component having a first surface which is oriented away from the top surface of the semiconductor body and includes a third force application area.

Abstract: A device and a method for multidimensional separation and analysis of molecules is disclosed. The device comprises a chamber for subjecting a first substance to a first analysis step and a space for receiving a second substance. The device is configured to apply pressure to the second substance to move the second substance towards a product of the first analysis step for providing a sample for a second analysis step.