Patents by Inventor Marc Baumann
Marc Baumann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250137010Abstract: Compositions and methods are capable of modulating male fertility in a plant. Compositions comprise polynucleotides and polypeptides, and fragments and variants thereof, which modulate male fertility. Expression cassettes comprise a male-fertility polynucleotide, or fragment or variant thereof, operably linked to a promoter, wherein expression of the polynucleotide modulates the male fertility of a plant. The level and/or activity of a polynucleotide that influences male fertility is modulated in a plant or plant part. Regulatory sequences drive expression in a male-tissue-preferred manner and may be targets to downregulate an operably linked gene. Methods to track mutations that induce nuclear recessive male sterility in subsequent selfing and crossing of wheat lines containing the mutations are also provided. Male-sterile plants may be maintained by pollinating with a maintainer plant.Type: ApplicationFiled: November 8, 2024Publication date: May 1, 2025Applicant: PIONEER HI-BRED INTERNATIONAL, INCInventors: MARC C ALBERTSEN, UTE BAUMANN, ANDREW MARK CIGAN, MANJIT SINGH, ELISE TUCKER, RYAN WHITFORD
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Patent number: 11397223Abstract: A Hall sensor has a Hall sensor element, which has multiple connection points spaced apart from one another. A supply source serves for feeding an exciter current into the Hall sensor element and is connected to a first and a second connection point of the Hall sensor element. The Hall sensor has a first and a second comparison device. The first comparison device has a first input connected to a third connection point of the Hall sensor element, a second input connected to a reference signal generator for an upper reference value signal, and an output for a first comparison signal. The second comparison device has a third input connected to the third connection point, a fourth input connected to a reference signal generator for a lower reference value signal, and an output for a second comparison signal. The outputs are connected to an evaluation device for generating an error signal as a function of the first and second comparison signal.Type: GrantFiled: July 15, 2019Date of Patent: July 26, 2022Assignee: TDK-Micronas GmbHInventors: Marc Baumann, David Muthers, Thomas Desel
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Patent number: 10845431Abstract: A Hall sensor has a Hall sensor element, having multiple connection locations and a current supply source or voltage supply source, which has a first and a second supply connector for output of a supply current or a supply voltage. The first supply connector is connected or can be connected with a first connection location to feed a current into the Hall sensor element, and the second supply connector is connected or can be connected with a second connection location of the Hall sensor element. The Hall sensor has a NAND gate, which is connected with the first connection location of the Hall sensor element using a first input, and with the second connection location of the Hall sensor element using a second input, and has an output for output of a first error signal.Type: GrantFiled: July 5, 2019Date of Patent: November 24, 2020Assignee: TDK-Micronas GmbHInventors: Marc Baumann, David Muthers, Thomas Desel
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Patent number: 10693057Abstract: A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.Type: GrantFiled: April 11, 2018Date of Patent: June 23, 2020Assignee: TDK-MICRONAS GMBHInventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
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Patent number: 10571347Abstract: A pressure sensor (10) has a carrier chip (20) in and/or on which at least one sensor element (30) is integrated, the measuring signal of which depends on the mechanical stress in the carrier chip (20). The carrier chip (20) is connected on its back side in a flat and material-locking fashion to a solid body (50), the modulus of elasticity of which differs from the modulus of elasticity of the carrier chip (20). The carrier chip (20) has at least two independent and longitudinal grooves (80a, 80b) between which the sensor element (30a, 30b) is arranged. The pressure sensor has a bias voltage circuit (40) and is used in a common rail injection system.Type: GrantFiled: March 23, 2016Date of Patent: February 25, 2020Assignee: Micronas GmbHInventor: Marc Baumann
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Publication number: 20200025842Abstract: A Hall sensor has a Hall sensor element, which has multiple connection points spaced apart from one another. A supply source serves for feeding an exciter current into the Hall sensor element and is connected to a first and a second connection point of the Hall sensor element. The Hall sensor has a first and a second comparison device. The first comparison device has a first input connected to a third connection point of the Hall sensor element, a second input connected to a reference signal generator for an upper reference value signal, and an output for a first comparison signal. The second comparison device has a third input connected to the third connection point, a fourth input connected to a reference signal generator for a lower reference value signal, and an output for a second comparison signal. The outputs are connected to an evaluation device for generating an error signal as a function of the first and second comparison signal.Type: ApplicationFiled: July 15, 2019Publication date: January 23, 2020Inventors: Marc Baumann, David Muthers, Thomas Desel
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Publication number: 20200025836Abstract: A Hall sensor has a Hall sensor element, having multiple connection locations and a current supply source or voltage supply source, which has a first and a second supply connector for output of a supply current or a supply voltage. The first supply connector is connected or can be connected with a first connection location to feed a current into the Hall sensor element, and the second supply connector is connected or can be connected with a second connection location of the Hall sensor element. The Hall sensor has a NAND gate, which is connected with the first connection location of the Hall sensor element using a first input, and with the second connection location of the Hall sensor element using a second input, and has an output for output of a first error signal.Type: ApplicationFiled: July 5, 2019Publication date: January 23, 2020Inventors: Marc Baumann, David Muthers, Thomas Desel
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Patent number: 10103320Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.Type: GrantFiled: May 4, 2016Date of Patent: October 16, 2018Assignee: TDK-Micronas GmbHInventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
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Publication number: 20180233658Abstract: A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.Type: ApplicationFiled: April 11, 2018Publication date: August 16, 2018Applicant: TDK-Micronas GmbHInventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
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Publication number: 20170324028Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.Type: ApplicationFiled: May 4, 2016Publication date: November 9, 2017Inventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
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Patent number: 9746345Abstract: A method and an apparatus for determining a rotation angle of a rotor in a motor with the aid of angle sensors by measurement of reference values and correction of the effected computations. The method is used, for example, in a synchronous motor.Type: GrantFiled: October 18, 2015Date of Patent: August 29, 2017Assignee: TDK-Micronas GmbHInventors: Marc Baumann, Redouane Sadeq
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Publication number: 20160282206Abstract: A pressure sensor (10) has a carrier chip (20) in and/or on which at least one sensor element (30) is integrated, the measuring signal of which depends on the mechanical stress in the carrier chip (20). The carrier chip (20) is connected on its back side in a flat and material-locking fashion to a solid body (50), the modulus of elasticity of which differs from the modulus of elasticity of the carrier chip (20). The carrier chip (20) has at least two independent and longitudinal grooves (80a, 80b) between which the sensor element (30a, 30b) is arranged. The pressure sensor has a bias voltage circuit (40) and is used in a common rail injection system.Type: ApplicationFiled: March 23, 2016Publication date: September 29, 2016Inventor: Marc Baumann
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Publication number: 20160109264Abstract: A method and an apparatus for determining a rotation angle of a rotor in a motor with the aid of angle sensors by measurement of reference values and correction of the effected computations. The method is used, for example, in a synchronous motor.Type: ApplicationFiled: October 18, 2015Publication date: April 21, 2016Inventors: Marc Baumann, Redouane Sadeq
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Patent number: 8915152Abstract: A force sensor comprising a substrate, a semiconductor body, and a piezoresistive element provided on a top surface of the semiconductor body. The semiconductor body is connected to the substrate in a force-fit manner, and includes a first wing which is provided on the top surface of the semiconductor body and being connected to the semiconductor body in a force-fit manner. A first force application area is provided on the first wing. A second wing has a second force application area provided opposite the first wing. The piezoresistive element is disposed between the first wing and the second wing. A force distribution component is connected to the first force application area and the second force application area in a force-fit manner. The force distribution component having a first surface which is oriented away from the top surface of the semiconductor body and includes a third force application area.Type: GrantFiled: September 13, 2012Date of Patent: December 23, 2014Assignees: Micronas GmbH, Albert-Ludwigs-Universitaet FrieburgInventors: Marc Baumann, Patrick Ruther, Alexander Peter, Oliver Paul
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Publication number: 20130061691Abstract: A force sensor comprising a substrate, a semiconductor body, and a piezoresistive element provided on a top surface of the semiconductor body. The semiconductor body is connected to the substrate in a force-fit manner, and includes a first wing which is provided on the top surface of the semiconductor body and being connected to the semiconductor body in force-fitting manner. A first force application area is provided on the first wing. A second wing has a second force application area provided opposite the first wing. The piezoresistive element is disposed between the first wing and the second wing. A force distribution component is connected to the first force application area and the second force application area in a force-fit manner. The force distribution component having a first surface which is oriented away from the top surface of the semiconductor body and includes a third force application area.Type: ApplicationFiled: September 13, 2012Publication date: March 14, 2013Inventors: Marc BAUMANN, Patrick RUTHER, Alexander PETER, Oliver PAUL
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Publication number: 20100044228Abstract: A device and a method for multidimensional separation and analysis of molecules is disclosed. The device comprises a chamber for subjecting a first substance to a first analysis step and a space for receiving a second substance. The device is configured to apply pressure to the second substance to move the second substance towards a product of the first analysis step for providing a sample for a second analysis step.Type: ApplicationFiled: May 22, 2007Publication date: February 25, 2010Inventors: Marc Baumann, Samuli Franssila, Zuzana Demianova, Eemeli Pöysä, Risto Kostiainen, Tapio Kotiaho