Patents by Inventor Marc C. Apell
Marc C. Apell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8128720Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.Type: GrantFiled: July 18, 2011Date of Patent: March 6, 2012Assignee: Illinois Tool Works Inc.Inventors: John Neiderman, Rita Mohanty, Marc C. Apell, Azhar Qureshi, Giovanni Filippelli
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Patent number: 8110015Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.Type: GrantFiled: May 30, 2007Date of Patent: February 7, 2012Assignee: Illinois Tool Works, Inc.Inventors: John Neiderman, Rita Mohanty, Marc C. Apell, Azhar Qureshi, Giovanni Filippelli
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Publication number: 20110272451Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.Type: ApplicationFiled: July 18, 2011Publication date: November 10, 2011Applicant: ILLINOIS TOOL WORKS INC.Inventors: John Neiderman, Rita Mohanty, Marc C. Apell, Azhar Qureshi, Giovanni Filippelli
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Patent number: 7981178Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.Type: GrantFiled: May 30, 2007Date of Patent: July 19, 2011Assignee: Illinois Tool Works, Inc.Inventors: John Neiderman, Rita Mohanty, Marc C. Apell, Azhar Qureshi, Giovanni Filippelli
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Publication number: 20080295686Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.Type: ApplicationFiled: May 30, 2007Publication date: December 4, 2008Applicant: Illinois Tool Works Inc.Inventors: John Neiderman, Rita Mohanty, Marc C. Apell, Azhar Qureshi, Giovanni Filippelli
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Patent number: 6694637Abstract: Flux management systems and methods are provided for filtering vaporized flux from the gas of a reflow soldering oven. A flux management system includes a cooling chamber having a cooling medium through which the gas passes. The vaporized flux condenses on the surfaces of the cooling chamber and drips into a collection pan, thereby preventing it from dripping onto circuit boards passing through the oven. The flux management system may further include a self-cleaning feature that includes a compressed gas, which is allowed to enter the cooling chamber through a solenoid valve. The compressed gas may then be directed through a heater, which increases the temperature of the cooling chamber, thereby causing a decrease in viscosity of the flux, which allows it to flow freely into a drain tube. The flux may then be transported by gravity into a collection container.Type: GrantFiled: January 18, 2002Date of Patent: February 24, 2004Assignee: Speedline Technologies, Inc.Inventors: Richard W. Miller, Jr., Jonathan M. Dautenhalm, Marc C. Apell
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Publication number: 20030136020Abstract: Flux management systems and methods are provided for filtering vaporized flux from the gas of a reflow soldering oven. A flux management system includes a cooling chamber having a cooling medium through which the gas passes. The vaporized flux condenses on the surfaces of the cooling chamber and drips into a collection pan, thereby preventing it from dripping onto circuit boards passing through the oven. The flux management system may further include a self-cleaning feature that includes a compressed gas, which is allowed to enter the cooling chamber through a solenoid valve. The compressed gas may then be directed through a heater, which increases the temperature of the cooling chamber, thereby causing a decrease in viscosity of the flux, which allows it to flow freely into a drain tube. The flux may then be transported by gravity into a collection container.Type: ApplicationFiled: January 18, 2002Publication date: July 24, 2003Inventors: Richard W. Miller, Jonathan M. Dautenhahn, Marc C. Apell