Abstract: An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips.

Abstract: A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

Abstract: An electrical connector that includes a dielectric housing and at least one pair of signal conductors adapted to mate with a printed circuit board. The pair of signal conductors include first and second conductors. The first conductor includes a first mating portion, a first contact portion remote from the first mating portion, and a the intermediate portion therebetween. The second conductor includes a second mating portion, a second contact portion remote from the second mating portion, and a second intermediate portion therebetween. Each of the first and second mating portions define a mating portion axis and each of the first and second contact portions define a contact portion axis. The contact portion axes are offset from the mating portion axis.

Abstract: An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips.

Abstract: A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

Abstract: There is disclosed an electrical connector assembly having a first electrical connector mateable to a second electrical connector. In one embodiment, the first electrical connector includes a plurality of wafers, with each wafer having an insulative housing, a plurality of signal conductors and a shield plate. A portion of the shield plate is exposed so that a conductive member can electrically connect the shield plates of the wafers at the exposed portion of the shield plate. In one embodiment, the second electrical connector includes an insulative housing, and a plurality of signal conductors and ground conductors in a plurality of rows. Each row corresponds to a wafer of the first electrical connector. Each signal conductor has a contact tail and each ground conductors has two contact tails.

Abstract: In one embodiment of the invention, there is disclosed an electrical connector connectable to a printed circuit board, the electrical connector having an insulative housing including side walls and a base. The electrical connector also includes signal conductors and ground conductors. Each of the signal conductors and ground conductors has a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion therebetween that is disposed in the base of the insulative housing. The signal conductors and the ground conductors are arranged in a plurality of rows, with each row having signal conductors and ground conductors. For each of the plurality of rows, there is a corresponding ground strip positioned adjacent thereto disposed in the base of the insulative housing. And the ground strip is electrically connected to the ground conductors of the row.

Abstract: A technique provides a radio frequency probe. The technique involves obtaining a surface mount connector having a flat-faced side that includes (i) a central region, (ii) a conductive outer region that extends along a periphery of the flat-faced side, and (iii) a conductive intermediate region disposed between the central region and the conductive outer region. The conductive outer region and the conductive intermediate region are electrically connected with each other. The technique further involves forming a cavity within the surface mount connector through the conductive intermediate region of the flat-faced side of the surface mount connector, and installing an end of a ground post within the cavity formed within the surface mount connector.

Abstract: A circuit board includes (i) a section of circuit board material having a signal conductor, a ground conductor, and dielectric material that separates the signal conductor and the ground conductor, and (ii) a signal launch. The signal launch includes a signal via that contacts the signal conductor and the dielectric material of the section of circuit board material, a first set of ground vias and a second set of ground vias. The ground vias contact the ground conductor and the dielectric material of the section of circuit board material. The first set of ground vias is disposed a first radial distance from the signal via. The second set of ground vias is disposed a second radial distance from the signal via. A coaxial connector mounts to the signal launch of the circuit board in order to provide electrical access to the signal and ground conductors.

Abstract: A technique provides a radio frequency probe. The technique involves obtaining a surface mount connector having a flat-faced side that includes (i) a central region, (ii) a conductive outer region that extends along a periphery of the flat-faced side, and (iii) a conductive intermediate region disposed between the central region and the conductive outer region. The conductive outer region and the conductive intermediate region are electrically connected with each other. The technique further involves forming a cavity within the surface mount connector through the conductive intermediate region of the flat-faced side of the surface mount connector, and installing an end of a ground post within the cavity formed within the surface mount connector.

Abstract: The invention is directed to techniques for connecting to a signal launch using a radio frequency (RF) probe having a flat-faced side with a ground post extending from a non-peripheral region (e.g., an intermediate region between a central region and a peripheral region of the flat-faced side). The use of such a probe alleviates the need to use many RF connectors permanently mounted to signal launches on a circuit board since the probe of the invention can be temporarily connected to the signal launches without such connectors. Furthermore, the ground post of the invention probe can be configured (e.g., positioned relative to a signal post) to avoid large inductance loops thus preserving signal integrity. One arrangement of the invention is directed to an RF probe for connecting to a signal launch. The RF probe includes a cabling portion for coupling to a cable, and a base portion attached to the cabling portion.