Abstract: A system for the treatment of a region of an object adjacent to a substrate. The system includes a source of an incident laser beam delivering a focused laser beam. The wavelength of the incident laser beam is greater than the sum of 500 nm and of the wavelength associated with the bandgap of the material forming the substrate and smaller than the sum of 2,500 nm and of this wavelength. The system includes an optical device associating a digital aperture greater than 0.3 and means for correcting the spherical aberrations appearing during the crossing of the substrate for a given thickness of the substrate and a given distance between the substrate and the optical device. The processing being performed on the region through the substrate, and including the physical, chemical, or physico-chemical modification or the ablation of said region.

Abstract: A system for the treatment of a region of an object adjacent to a substrate. The system includes a source of an incident laser beam delivering a focused laser beam. The wavelength of the incident laser beam is greater than the sum of 500 nm and of the wavelength associated with the bandgap of the material forming the substrate and smaller than the sum of 2,500 nm and of this wavelength. The system includes an optical device associating a digital aperture greater than 0.3 and means for correcting the spherical aberrations appearing during the crossing of the substrate for a given thickness of the substrate and a given distance between the substrate and the optical device. The processing being performed on the region through the substrate, and including the physical, chemical, or physico-chemical modification or the ablation of said region.