Abstract: The invention provides an LED module having a concentrated light output window. Light output from a first output window of an LED assembly (e.g. from a plurality of LEDs) is passed to an input window of a light directing element and redirected to be emitted from a second, smaller output window of a light directing element. This difference in size thereby concentrates the light output by the light directing element. The second output window (of the light directing element) is substantially perpendicular to the first output window, allowing for the size of the LED assembly in a particular dimension to not be necessarily constrained by the size of the second output window.

Abstract: A negative pressure wound treatment assembly comprising: a covering layer, a vacuum system comprising: a chamber having a tightly closed space with a reduced pressure, said chamber comprising an end closed by a perforable cap, a connecting device adapted to be attached to the covering layer and to the chamber to form a communication passage between the covering layer and the space of the chamber, the connecting device having at least one needle portion adapted to perforate the cap of the chamber, the connecting device comprising at least one valve member, wherein the valve member comprises a cover mounted on the needle portion, said cover covering a tipped end of the needle portion in a closing position and being adapted to be resiliently deformed to an opening position.

Abstract: A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads.

Abstract: A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads.

Abstract: A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads.

Abstract: Mounting an electro-optical component (1) on a carrier substrate (2) in an accurate position with respect to an optical element (6), the carrier substrate and the electro-optical component each being provided with at least one solder pad (3, 4). The solder pads are arranged such that, when said electro-optical component is soldered onto the pads, a force is generated that acts on the electro-optical component in a direction (x) towards the optical element, and the structure is designed to allow said electro-optical component to move laterally during soldering, such that it is brought into abutment with said optical element, thereby ensuring an accurate relative positioning between the electro-optical component and the optical element.

Abstract: A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads.

Abstract: Mounting an electro-optical component (1) on a carrier substrate (2) in an accurate position with respect to an optical element (6), the carrier substrate and the electro-optical component each being provided with at least one solder pad (3, 4). The solder pads are arranged such that, when said electro-optical component is soldered onto the pads, a force is generated that acts on the electro-optical component in a direction (x) towards the optical element, and the structure is designed to allow said electro-optical component to move laterally during soldering, such that it is brought into abutment with said optical element, thereby ensuring an accurate relative positioning between the electro-optical component and the optical element.

Abstract: A carrier substrate (100) with laser sources includes a transparent center substrate (20), an upper substrate (30) adhered to the center substrate having openings (40) formed therein to expose the center substrate on a first side, and a lower substrate (32) adhered to the center substrate on a second side opposite the first side and having openings (42) formed therein to expose the center substrate on the second side, the openings on the lower substrate corresponding to positions of the openings in the upper substrate. Frequency conversion elements (60) are disposed on the center substrate within the openings of the lower substrate. Laser dies (70) are aligned to the frequency conversion elements and coupled to the lower substrate to provide light though the frequency conversion elements and the center substrate during operation. Methods for fabrication are also disclosed.

Abstract: The present invention relates to a light-emitting device comprising a substrate, a circuitry, a LED in electrical connection with said circuitry, and a heat sink arranged to transport heat away from the LED, wherein the LED is in thermal contact with said heat sink through an opening in said substrate. The present invention also relates to methods for the manufacture of such a device.

Abstract: The device of the invention comprises a semiconductor element, a first connection element, a first patterned electrically conductive layer and a second patterned electrically conductive layer. The device is further provided with an encapsulation that encapsulates all except the first conductive layer, which is part of the substrate. The device can be suitably made in that the second conductive layer is provided, in pre-patterned form, with a permeable isolating layer as a foil.

Abstract: The invention relates to an opto-electronic input device (10), wherein the input is formed by detected movements of an object (M), which opto-electronic input device is provided with an optical module (11) comprising at least one laser (1) mounted on a carrier plate (4), which laser emits a radiation beam (S) that is guided to a plate (V) close to the object (M) and, after reflection therefrom, causes a change in the resonant cavity of the laser (1) which is representative of the movement of the object (M), and which is measured within the module (11).

Abstract: The invention relates to an optoelectronic input device (10) in which the input is formed by detected movements of an object (M), the device comprising an optical module (11) comprising at least one laser (1,1?) with a cavity for the generation of a measuring radiation beam (S), optical means (2) for the guidance of the radiation beam (S) to a plane (V) close to the object (M) and conversion means (C) for the conversion of measuring beam radiation reflected and modulated by the object into an electrical signal, wherein the conversion means (C) are formed by a combination of the cavity of the laser (1) and measuring means (3) for measuring a change in the cavity during operation, which radiation is caused by reflected radiation entering the cavity.

Abstract: Method suitable for transferring an electronic component (2??) supported by a carrier (3) to a desired position on a substrate (1). The carrier supporting the component is moved relative to the substrate whilst the component is present on a side of the carrier facing towards the substrate, until the component is positioned opposite the desired position on teh substrate. Then a light beam (4) is directed at the carrier (3), at the location of the component (2??), from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.

Abstract: The invention relates to a method of manufacturing a semiconductor device (10), wherein a semiconductor element (1) provided with a number of connection regions (2) is fitted between a first, electroconductive plate (3) and a second plate (4), wherein two connection conductors (3A, 3B) are formed, from the first plate (3), for the two connection regions (2A, 2B) of the element (1), wherein a passivating encapsulation (5) is provided between the plates (3, 4) and around the element (1), and wherein the device (10) is formed by applying a mechanical separating technique in two mutually perpendicular directions (L, M). In a method according to the invention, the connection conductors (3A, 3B) are formed by providing a mask (6) on the first conducting plate (3) in such a manner that a part (3C) of the plate (3) situated between the connection regions (2A, 2B) remains exposed, which part is subsequently removed by etching.

Abstract: The electronic device (100) comprises a body (20) with a cavity (30) wherein a semiconductor element (10) and a thermally conductive layer (33) are present. The cavity (30) is filled with an encapsulation (35) of an electrically insulating material wherein contact faces (47, 48) are mechanically anchored.

Abstract: The invention relates to a thin film circuit with component. The thin film circuit comprises a network of capacitors, or a network of capacitors and resistors, or a network of capacitors, resistors and inductances, or a network of capacitors and inductances. Current supply contacts such as, for example, SMD end contacts or bump end contacts render it possible for the thin film circuit to be connected to further components of a circuit or, for example, to be combined with active components through the use of contact surfaces.