Patents by Inventor Marc E. Holyfiield

Marc E. Holyfiield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to integrate multiple electric circuits into organic matrix composite
    Patent number: 10294817
    Abstract: A method of forming a circuit in a composite component includes providing a plurality of preform modules comprised of an organic matrix composite material, applying at least one electrical circuit on at least first and second preform modules of the plurality of preform modules, and arranging the first and second preform modules such that the electrical circuit of the first preform module is in contact with the electrical circuit of the second preform module. An additional step includes molding the first and second preform modules together to form a one-piece molded component such that the electrical circuits of the first and second preform modules form a complete circuit.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: May 21, 2019
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: David R. Lyders, Marc E. Holyfiield, Kevin M. Bell
  • Method to Integrate Multiple Electric Circuits into Organic Matrix Composite
    Publication number: 20160245113
    Abstract: A method of forming a circuit in a composite component includes providing a plurality of preform modules comprised of an organic matrix composite material, applying at least one electrical circuit on at least first and second preform modules of the plurality of preform modules, and arranging the first and second preform modules such that the electrical circuit of the first preform module is in contact with the electrical circuit of the second preform module. An additional step includes molding the first and second preform modules together to form a one-piece molded component such that the electrical circuits of the first and second preform modules form a complete circuit.
    Type: Application
    Filed: October 21, 2014
    Publication date: August 25, 2016
    Inventors: David R. Lyders, Marc E. Holyfiield, Kevin M. Bell