Abstract: A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.

Abstract: A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.

Abstract: One embodiment of the invention includes a reconfigurable circuit comprising a phase-change material switch. The phase-change material switch includes an actuation portion configured to receive a control signal having one of a first state and a second state and to emit a first heat profile in response to the first state of the control signal and a second heat profile in response to the second state of the control signal. The phase-change material switch also includes a switch portion comprising a phase-change material in proximity with the actuation portion. The switch portion can be selectable between a conducting state in response to the first heat profile to conduct an input signal from an input to an output of the phase-change material switch and a blocking state in response to the second heat profile to substantially block the input signal from the input to the output.

Abstract: A phase change material (PCM) switch is disclosed that includes a resistive heater element, and a PCM element proximate the resistive heater element. A thermally conductive electrical insulating barrier layer positioned between the PCM heating element and the resistive heating element, and conductive lines extend from ends of the PCM element and control lines extend from ends of the resistive heater element.

Abstract: One embodiment of the invention includes a reconfigurable circuit comprising a phase-change material switch. The phase-change material switch includes an actuation portion configured to receive a control signal having one of a first state and a second state and to emit a first heat profile in response to the first state of the control signal and a second heat profile in response to the second state of the control signal. The phase-change material switch also includes a switch portion comprising a phase-change material in proximity with the actuation portion. The switch portion can be selectable between a conducting state in response to the first heat profile to conduct an input signal from an input to an output of the phase-change material switch and a blocking state in response to the second heat profile to substantially block the input signal from the input to the output.