Abstract: Embodiments of a method to move a lens of an optoelectronic moduleto adjust steering of a light beam, and a system having the optoelectronic module, are described herein.

Abstract: An electromechanical system having an object and drives adapted to cooperate to provide the object with two degrees of mobility is described herein.

Abstract: Two etalons in series may be angled to reduce parasitic reflections in the space between the two. The etalons may be soldered on either side of a post having an aperture there through to allow light to pass. Various sized solder balls and/or solder pads may be used to create the desired angle and to secure the etalons to the post. Alternatively, a lip on the post may create the desired angle. Once secured to the post, rather than aligning the etalons by pick and place methods individually, the post and attached etalons may be secured as a single unit to an optical system, such as within the cavity of an external cavity diode laser (ECDL).

Abstract: Two etalons in series may be angled to reduce parasitic reflections in the space between the two. The etalons may be soldered on either side of a post having an aperture there through to allow light to pass. Various sized solder balls and/or solder pads may be used to create the desired angle and to secure the etalons to the post. Alternatively, a lip on the post may create the desired angle. Once secured to the post, rather than aligning the etalons by pick and place methods individually, the post and attached etalons may be secured as a single unit to an optical system, such as within the cavity of an external cavity diode laser (ECDL).

Abstract: A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.

Abstract: A fiber-flexure-substrate tray for transporting and protecting optical modules and optical module components. The fiber-flexture substrate tray may have a tray body for supporting an optical fiber and other components coupled to the optical fiber while the optical fiber and the other components are processed. In addition, the fiber-flexure-substrate tray may have a thermally conductive substrate holder coupled to the tray body for heat-treating other components coupled to the optical fiber. The tray body may have a support area designed to hold the optical fiber off of the thermally conductive substrate holder to thermally isolate the optical fiber. In addition, a component may be coupled to the tray to hold the optical fiber off of the thermally conductive substrate holder.

Abstract: A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

Abstract: A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

Abstract: A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.

Abstract: A low profile ringframe used in electro-optical module packaging is disclosed. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-subtrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.

Abstract: Described herein is a hermetic fiber optic package that may have a wide bandwidth radio frequency (e.g., between 9 kHz and 300 GHz) interface and a multilayer substrate provides a platform to integrated various components such as, for example, integrated circuits having electronic components, optoelectronic components, or optics. In one embodiment, the substrate has a wide bandwidth surface mountable interface that may be a single ended or a differential that allows for an electrical signal to pass from the exterior of the package to the interior. The interior of the package contains a “riser” that is used to bring an electrical signal from the plane of the substrate to the plane close to the optical axis. This riser includes a transmission line to achieve the change in height. The transmission line can be single ended or differential. Also within the package is a “submount” upon which electrical/optical/electro-optic components can be integrated.

Abstract: A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the lop surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.

Abstract: A low profile ringframe used in electro-optical module packaging, for being hermetically sealed, e.g., by a solder joint, to a metalized ceramic substrate base, and to which a deep cover is later hermetically sealed, e.g., by a laser weld, the ringframe's side walls being of sufficiently low height to permit computer-aided viewing from the side, as well as top, of the critical optical fiber end-to-laser diode alignment. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-substrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.

Abstract: A fiber-flexure-substrate tray for transporting and protecting optical modules and optical module components. The fiber-flexture substrate tray may have a tray body for supporting an optical fiber and other components coupled to the optical fiber while the optical fiber and the other components are processed. In addition, the fiber-flexure-substrate tray may have a thermally conductive substrate holder coupled to the tray body for heat-treating other components coupled to the optical fiber. The tray body may have a support area designed to hold the optical fiber off of the thermally conductive substrate holder to thermally isolate the optical fiber. In addition, a component may be coupled to the tray to hold the optical fiber off of the thermally conductive substrate holder.

Abstract: A fiber carrier and method for using the same are described. A portion on the fiber carrier is activated to enable the fiber carrier to receive a first portion of the fiber, and the fiber carrier is closed. The fiber carrier is moved to a predetermined position. The portion on the fiber carrier is activated to release the fiber.

Abstract: A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

Abstract: A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

Abstract: A flexure and package including the same are provided. In one embodiment, the flexure is coupled to a second optical element and a substrate to maintain the second optical element in alignment with a first optical element. The flexure comprises a body, a pair of front and back legs. The attachment of the rear legs to the substrate causes the flexure to move from a first flexure position to a second flexure position, the distance between the first flexure position and the second flexure position equaling an offset distance. A specified length of the body is chosen such that the offset distance causes a second offset distance of the second optical component held by the flexure, and this second offset distance is within a specified range. The second offset distance is equal to the difference between a primary second optical component position and a secondary second optical component position.

Abstract: A method for aligning optical components includes positioning a flexure having an attached first optical component with respect to a substrate having a second optical component attached thereto. The flexure has at least two legs, and each leg has a foot portion. The method further includes coupling at least one leg of the two legs to the substrate at a point of contact between the foot portion of the at least one leg and the substrate. The method further includes adjusting the alignment of the optical components by spot welding a location on the leg. Spot welding on the substrate may also be used to adjust the alignment of the optical components.

Abstract: An apparatus for use in calibrating lens position and field of view in an endoscope is disclosed. The apparatus includes tracking elements mounted at fixed positions on the endoscope's shaft, a holder providing an object or pattern to be viewed by the endoscope, when the endoscope is placed in the holder, and positional elements mounted on the holder at known positions. A processor in the apparatus operates to determine the positions of the tracking and positional elements, with the endoscope shaft received in the holder guide, and calculate from the determined positions, the coordinates of the endoscope lens with respect to the tracking elements, and the field of the view of the lens. Also disclosed is a calibration method which employs the apparatus.