Patents by Inventor Marc Füldner

Marc Füldner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240182297
    Abstract: A method for manufacturing a micromechanical environmental barrier chip includes providing a substrate having a first surface and an opposite second surface, depositing a material layer having a different etch characteristic than the substrate onto the first surface, creating a microstructured micromechanical environmental barrier structure on top of the material layer by applying a microstructuring process, applying an anisotropic etching process comprising at least one etching step for anisotropically etching from the second surface towards the first surface to create at least a cavity underneath the micromechanical environmental barrier structure, the cavity extending between the second surface and the material layer, and removing the material layer underneath the micromechanical environmental barrier structure to expose the environmental barrier structure.
    Type: Application
    Filed: November 27, 2023
    Publication date: June 6, 2024
    Inventors: Hutomo Suryo Wasisto, Fabian Streb, Sebastian Anzinger, Marc Füldner, Dominic Maier
  • Publication number: 20240182295
    Abstract: A method for manufacturing a MEMS pressure transducer chip with a hybrid integrated environmental barrier structure includes a step of providing a substrate comprising at least one membrane, a step of structuring a stepped recess structure into the substrate, the stepped recess structure comprising a first recess having a first lateral width and an adjacent second recess having a larger second lateral width, where the stepped recess structure extends between the membrane and a substrate surface opposite to the membrane, and a step of arranging an environmental barrier structure inside the second recess.
    Type: Application
    Filed: November 17, 2023
    Publication date: June 6, 2024
    Inventors: Hutomo Suryo Wasisto, Marc Füldner, Dominic Maier, Andreas Wiesbauer, Sebastian Anzinger
  • Publication number: 20240187770
    Abstract: A method for manufacturing a MEMS microphone device with a monolithically integrated environmental barrier structure includes providing a substrate structure including a base substrate and an additional substrate material layer deposited on the base substrate, creating a micromechanical environmental barrier structure in the substrate structure by applying a microstructuring process, where the micromechanical environmental barrier structure is configured to let a first amount of air pass through while preventing a second amount of at least one of moisture, liquid, oil or solid environmental particles from passing through, and creating a MEMS sound transducer structure in the additional substrate material of the substrate structure by applying a microstructuring process.
    Type: Application
    Filed: November 17, 2023
    Publication date: June 6, 2024
    Inventors: Hutomo Suryo Wasisto, Fabian Streb, Sebastian Anzinger, Marc Füldner, Dominic Maier
  • Publication number: 20240067520
    Abstract: An encapsulated MEMS device and a method for manufacturing the MEMS device are provided. The method comprises providing a cavity structure having an inner volume comprising a plurality of MEMS elements, which are relatively displaceable with respect to each other, and having an opening structure to the inner volume, depositing a Self-Assembled Monolayer (SAM) through the opening structure onto exposed surfaces within the inner volume of the cavity structure, and closing the cavity structure by applying a layer structure on the opening structure for providing a hermetically closed cavity.
    Type: Application
    Filed: August 30, 2023
    Publication date: February 29, 2024
    Inventors: Fabian Streb, Johann Straßer, Hans-Jörg Timme, Marc Füldner, Arnaud Walther, Hutomo Suryo Wasisto
  • Publication number: 20230339743
    Abstract: A MEMS device includes a first deflectable membrane structure, a rigid electrode structure and a second deflectable membrane structure in a vertically spaced configuration. The rigid electrode structure is arranged between the first and second deflectable membrane structures. The first and second deflectable membrane structures each includes a deflectable portion, and the deflectable portions of the first and second deflectable membrane structures are mechanically coupled by mechanical connection elements to each other and are mechanically decoupled from the rigid electrode structure. At least a subset of the mechanical connection elements are elongated mechanical connection elements.
    Type: Application
    Filed: April 24, 2023
    Publication date: October 26, 2023
    Inventors: Hans-Jörg Timme, Stefan Barzen, Marc Füldner, Stefan Geißler, Matthias Friedrich Herrmann, Maria Kiriak, Abidin Güçlü Onaran, Konstantin Tkachuk, Arnaud Walther
  • Publication number: 20230202833
    Abstract: A MEMS device comprises a housing with an interior volume, wherein the housing includes an access port to the interior volume; a MEMS sound transducer in the housing, and a mechanical barrier structure having a plate element that is fixed by elastic spacers to a carrier and overlaps the access port, and providing a ventilation path passing a boundary region of the plate element, wherein a clearance of the ventilation path is set by the distance of the boundary region of the plate element to the housing or by the distance of the boundary region of the plate element to a blocking structure that opposes the boundary region of the plate element.
    Type: Application
    Filed: November 30, 2022
    Publication date: June 29, 2023
    Inventor: Marc Füldner
  • Patent number: 11225408
    Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: January 18, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Wiesbauer, Christian Mandl, Marc Füldner, Shu-Ting Hsu
  • Patent number: 10200801
    Abstract: According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal plate, a first sensing plate, and a second sensing plate. The symmetry detection circuit is coupled to a differential output of the transducer element and is configured to output an error signal based on asymmetry in the differential output.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: February 5, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Wiesbauer, Christian Jenkner, Ulrich Krumbein, Marc Füldner
  • Publication number: 20180109892
    Abstract: According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal plate, a first sensing plate, and a second sensing plate. The symmetry detection circuit is coupled to a differential output of the transducer element and is configured to output an error signal based on asymmetry in the differential output.
    Type: Application
    Filed: December 15, 2017
    Publication date: April 19, 2018
    Inventors: Andreas Wiesbauer, Christian Jenkner, Ulrich Krumbein, Marc Füldner
  • Patent number: 9942677
    Abstract: According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal plate, a first sensing plate, and a second sensing plate. The symmetry detection circuit is coupled to a differential output of the transducer element and is configured to output an error signal based on asymmetry in the differential output.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: April 10, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Wiesbauer, Christian Jenkner, Ulrich Krumbein, Marc Füldner
  • Patent number: 9888331
    Abstract: According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal plate, a first sensing plate, and a second sensing plate. The symmetry detection circuit is coupled to a differential output of the transducer element and is configured to output an error signal based on asymmetry in the differential output.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: February 6, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Wiesbauer, Christian Jenkner, Ulrich Krumbein, Marc Füldner
  • Publication number: 20160080879
    Abstract: According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal plate, a first sensing plate, and a second sensing plate. The symmetry detection circuit is coupled to a differential output of the transducer element and is configured to output an error signal based on asymmetry in the differential output.
    Type: Application
    Filed: September 15, 2014
    Publication date: March 17, 2016
    Inventors: Andreas Wiesbauer, Christian Jenkner, Ulrich Krumbein, Marc Füldner
  • Patent number: 7253016
    Abstract: A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated by perforation openings. The opening width of the perforation openings corresponds approximately to the thickness of the carrier layer.
    Type: Grant
    Filed: November 15, 2004
    Date of Patent: August 7, 2007
    Assignee: Infineon Technologies AG
    Inventors: Stefan Barzen, Alfons Dehe, Marc Füldner
  • Publication number: 20070034976
    Abstract: A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated by perforation openings. The opening width of the perforation openings corresponds approximately to the thickness of the carrier layer.
    Type: Application
    Filed: October 23, 2006
    Publication date: February 15, 2007
    Applicant: Infineon Technologies AG
    Inventors: Stefan Barzen, Alfons Dehe, Marc Fuldner
  • Publication number: 20050179100
    Abstract: A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated by perforation openings. The opening width of the perforation openings corresponds approximately to the thickness of the carrier layer.
    Type: Application
    Filed: November 15, 2004
    Publication date: August 18, 2005
    Applicant: Infineon Technologies AG
    Inventors: Stefan Barzen, Alfons Dehe, Marc Fuldner