Abstract: A method comprising forming two or more frames from a first wafer, forming two or more etalons from a second wafer, disposing a resistive thermal device on each of the two or more frames, dicing the first wafer and the second wafer, and bonding each of the frames to a corresponding one of the etalons to form optical subassemblies of optical filters.

Abstract: A method comprising generating an optical beam with a laser, filtering the optical beam to select a desired wavelength with an etalon positioned in a path of the optical beam, heating the etalon to an operational temperature using a heater, monitoring the operational temperature of the etalon with a resistive thermal device disposed in or on a thermally conductive frame bonded to the etalon, and applying feedback control of the heater based on the monitoring to select the desired wavelength.

Abstract: Briefly, in accordance with one or more embodiments, a thermally controlled optical filter comprises a frame coupled to an etalon where the frame includes a resistive thermal device disposed on the frame to obtain thermal measurements of the etalon during operation. The frame may be generally L-shaped or generally square-shaped. The frame may include a fillet that is generally planar, generally beveled or trapezoidal, or generally circular in shape. A heater may be additionally disposed on the frame. The etalon and frame subassembly may be bonded to a micro hot plate that is capable of heating the etalon to an operational temperature.

Abstract: Briefly, in accordance with one or more embodiments, a thermally controlled optical filter comprises a frame coupled to an etalon where the frame includes a resistive thermal device disposed on the frame to obtain thermal measurements of the etalon during operation. The frame may be generally L-shaped or generally square-shaped. The frame may include a fillet that is generally planar, generally beveled or trapezoidal, or generally circular in shape. A heater may be additionally disposed on the frame. The etalon and frame subassembly may be bonded to a micro hot plate that is capable of heating the etalon to an operational temperature.

Abstract: Briefly, in accordance with one or more embodiments, a thermally controlled optical filter comprises a frame coupled to an etalon where the frame includes a resistive thermal device disposed on the frame to obtain thermal measurements of the etalon during operation. The frame may be generally L-shaped or generally square-shaped. The frame may include a fillet that is generally planar, generally beveled or trapezoidal, or generally circular in shape. A heater may be additionally disposed on the frame. The etalon and frame subassembly may be bonded to a micro hot plate that is capable of heating the etalon to an operational temperature.

Abstract: Briefly, in accordance with one or more embodiments, a thermally controlled optical filter comprises a frame coupled to an etalon where the frame includes a resistive thermal device disposed on the frame to obtain thermal measurements of the etalon during operation. The frame may be generally L-shaped or generally square-shaped. The frame may include a fillet that is generally planar, generally beveled or trapezoidal, or generally circular in shape. A heater may be additionally disposed on the frame. The etalon and frame subassembly may be bonded to a micro hot plate that is capable of heating the etalon to an operational temperature.

Abstract: Briefly, in accordance with one or more embodiments, a thermally controlled optical filter comprises a frame coupled to an etalon where the frame includes a resistive thermal device disposed on the frame to obtain thermal measurements of the etalon during operation. The frame may be generally L-shaped or generally square-shaped. The frame may include a fillet that is generally planar, generally beveled or trapezoidal, or generally circular in shape. A heater may be additionally disposed on the frame. The etalon and frame subassembly may be bonded to a micro hot plate that is capable of heating the etalon to an operational temperature.

Abstract: Manufacturing of solar concentrators require the placement of primary optical components, a parabolic mirror for example, on a relatively fiat front panel in a predetermined alignment within a certain tolerance limit. Clips, in accordance with embodiments of the present invention, can be used to facilitate locating, placing and securing the primary optical components on the front panel, thereby enhancing manufacturability of the solar concentrator.

Abstract: The present invention provides an environmental control system for controlling moisture in a solar energy collector. The environmental control system facilitates the flow of air within and through the solar energy collector by using and enhancing a thermal gradient within the solar energy collector caused by exposure to sunlight. Two or more orifices are located in an enclosed solar energy system to permit air to enter, circulate and remove moisture from the system. The position of the two or more orifices and a thermal gradient generated by the solar energy collector facilitates this process.

Abstract: Briefly, in accordance with one or more embodiments, a thermally controlled optical filter comprises a frame coupled to an etalon where the frame includes a resistive thermal device disposed on the frame to obtain thermal measurements of the etalon during operation. The frame may be generally L-shaped or generally square-shaped. The frame may include a fillet that is generally planar, generally beveled or trapezoidal, or generally circular in shape. A heater may be additionally disposed on the frame. The etalon and frame subassembly may be bonded to a micro hot plate that is capable of heating the etalon to an operational temperature.

Abstract: A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Abstract: An external cavity laser apparatus includes a wavelength tuning element mounted to a carrier on the apparatus's platform. Thermal control of the platform sets an initial position of the carrier and tuning element, from which independent tuning of the element can be achieved for wavelength tuning. The carrier is formed of a liquid crystal polymer that thermally isolates the tuning element from this platform, for such independent thermo-optical tuning. The liquid crystal polymer may match the coefficient of thermal expansion of the carrier to that of the platform. The support further includes embedded electrodes, either within or on the outer surface of the carrier, which can couple from the tuning element to the controller, where in some examples such coupling is direct and without use of additional electrical traces or wire bonds.

Abstract: An external cavity laser apparatus includes a wavelength tuning element mounted to a carrier on the apparatus's platform. Thermal control of the platform sets an initial position of the carrier and tuning element, from which independent tuning of the element can be achieved for wavelength tuning. The carrier is formed of a liquid crystal polymer that thermally isolates the tuning element from this platform, for such independent thermo-optical tuning. The liquid crystal polymer may match the coefficient of thermal expansion of the carrier to that of the platform. The support further includes embedded electrodes, either within or on the outer surface of the carrier, which can couple from the tuning element to the controller, where in some examples such coupling is direct and without use of additional electrical traces or wire bonds.

Abstract: A thermally tuned filter comprising an optical tuning device and a pre-stressed membrane positioned on the optical tuning device. A tensile prestress of the pre-stressed membrane to increase a natural frequency of the thermally tuned filter.

Abstract: A thermally tuned filter having a pre-stressed membrane. The thermally tuned filter includes a handle layer, a dielectric layer positioned proximate to the handle layer, and a device layer positioned proximate to the handle layer. The device layer includes an optical device. A pre-stressed membrane is positioned proximate to the device layer; a tensile prestress of the pre-stressed membrane increases the natural frequency of the thermally tuned filter.

Abstract: A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Abstract: A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Abstract: A package for heating a micro-component is disclosed. The package comprises a platform having a resistive heating element integral with the platform. The package further includes a micro-component disposed on the platform.

Abstract: A thermally tuned filter comprising an optical tuning device and a pre-stressed membrane positioned on the optical tuning device. A tensile prestress of the pre-stressed membrane to increase a natural frequency of the thermally tuned filter.

Abstract: A thermally tuned filter having a pre-stressed membrane. The thermally tuned filter includes a handle layer, a dielectric layer positioned proximate to the handle layer, and a device layer positioned proximate to the handle layer. The device layer includes an optical device. A pre-stressed membrane is positioned proximate to the device layer; a tensile prestress of the pre-stressed membrane increases the natural frequency of the thermally tuned filter.