Abstract: A device for testing a circuit made up of a printed circuit board on which components, preferably dummy components, are assembled by the solder connections. An enclosure of the testing device subjects the circuit under test to a schedule of thermo-mechanical and/or vibration constraints. Bridges of electrical resistors, forms a hardware portion of the testing device. A software portion of the testing device sets a detection criterion representing damage to one or more solder connections and displays the results of the test. An input/output interface converts each electrical resistor measurement of the tested chains of solder connections into data for use the software portion. An adjusting component modifies the criterion for detecting damage to the solder connections.

Abstract: To measure the fatigue ageing of an electronic component in an electronic assembly subjected to mechanical excitations, a dynamic correspondence is established between kinematic measurements at certain points and mechanical stresses experienced at points that are critical as regard to the reliability of the electronic assembly. The critical points may be different from the measurement points. This correspondence is integrated into a monitoring device as a functionality that calculates the mechanical stresses, thereby providing an indicator of the cumulative fatigue damage. The invention is such that the monitoring device can be incorporated into the electronic assembly, preferably, the monitoring device is autonomous both as regard to processing the measurements and calculating the damage.

Abstract: The invention relates to a device for testing a circuit made up of a printed circuit board on which components, preferably dummy components, are assembled by means of solder connections. The testing device comprises an enclosure for subjecting the circuit under test to a schedule of thermo-mechanical and/or vibration constraints. The testing device comprises a hardware portion comprising bridges of electrical resistors, a software portion comprising means for setting a detection criterion representing damage to one or more solder connections and for displaying the results of the test, an input/output interface for converting each electrical resistor measurement of the tested chains of solder connections into data that can be used by the software portion, and adjustment means for modifying a criterion for detecting damage to the solder connections.

Abstract: To measure the fatigue ageing of an electronic component in an electronic assembly subjected to mechanical excitations, a dynamic correspondence is established between kinematic measurements at certain points and mechanical stresses experienced at points that are critical as regards the reliability of the electronic assembly, which critical points may different from the measurement points. This correspondence is integrated into a monitoring device as a functionality that calculates the mechanical stresses directly as the value are being delivered by the kinematic sensors. The device also performs numerical processing of the mechanical stresses, thereby providing an indicator of the cumulative fatigue damage. The invention is such that the device can be incorporated into the electronic assembly, it being possible for this device to be autonomous both as regards processing the measurements and calculating the damage.