Abstract: A method of manufacturing an image sensor comprising the forming of an opening in a substrate, the forming of a conductive pad covering the flanks of the opening and delimiting a gap in the opening, the forming of microlenses in a layer made of a first resin, the layer made of the first resin covering the pad and penetrating into the gap, the forming of a mask made of a second resin on top of and in contact with the layer made of the first resin, the chemical plasma etching of the layer made of the first resin, through the mask, delimiting a block of the first resin in the gap, the deposition of a protective layer on the microlenses and on the block, the removal of the portion of the protective layer covering the block, and the etching of the block.

Abstract: The present disclosure relates to a method for manufacturing a pixel by: depositing an insulating layer on an exposed face of an interconnect structure of an integrated circuit, the interconnect structure having a conductive element flush with said exposed face; etching an opening passing through the insulating layer to the conductive element; depositing an electrode layer on and in contact with the conductive element and the insulating layer; defining an electrode by removing, by etching, part of the electrode layer resting on the insulating layer; and depositing a film configured to convert photons into electron-hole pairs when a ray at an operating wavelength of the pixel reaches the pixel.

Abstract: The present disclosure relates to a method for manufacturing a pixel by: depositing an insulating layer on an exposed face of an interconnect structure of an integrated circuit, the interconnect structure having a conductive element flush with said exposed face; etching an opening passing through the insulating layer to the conductive element; depositing an electrode layer on and in contact with the conductive element and the insulating layer; defining an electrode by removing, by etching, part of the electrode layer resting on the insulating layer; and depositing a film configured to convert photons into electron-hole pairs when a ray at an operating wavelength of the pixel reaches the pixel.