Patents by Inventor Marc Hauer
Marc Hauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11610703Abstract: A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.Type: GrantFiled: June 3, 2019Date of Patent: March 21, 2023Assignee: BIOTRONIK SE & Co. KGInventors: Eckardt Bihler, Marc Hauer
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Patent number: 11541244Abstract: A medical implant includes a first component having a surface and a plurality of electrical contacts and a second component having a surface and a plurality of electrical contacts. Each contact of the first component contacts an assigned contact of the second component in an electrically conducting manner. A seal is disposed between the two surfaces for sealing the contacts. The seal and the two surfaces are formed of a thermoplastic material. The seal is fused to the two surfaces for sealing the contacts and the seal is meltable so as to separate the two components from one another. A method for producing a medical implant is also provided.Type: GrantFiled: September 11, 2020Date of Patent: January 3, 2023Assignee: DYCONEX AGInventors: Eckardt Bihler, Marc Hauer
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Publication number: 20220395688Abstract: The disclosure relates to an implant comprising a substrate, a housing, wherein the housing is disposed on the substrate, an electronic circuit disposed on the substrate inside the housing, an electronic component disposed on the substrate outside the housing, and a conductor track, wherein the conductor track connects the electronic circuit to the electronic component. The conductor track is embedded into the substrate at least in sections in such a way that at least one section of the conductor track is completely surrounded by the substrate. Furthermore, a method for creating an implant is disclosed.Type: ApplicationFiled: August 22, 2022Publication date: December 15, 2022Applicant: BIOTRONIK SE & Co. KGInventors: Eckardt Bihler, Marc Hauer, Dirk Muessig
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Patent number: 11504506Abstract: A strain sensor for capacitive strain measurement has a flat and electrically conductive first conductor element and a flat and electrically conductive second conductor element. The two conductor elements oppose one another and are laterally displaceable relative to one another, so that the two conductor elements, proceeding from a first condition, may be displaced relative to one another into a second condition. An overlap between the two conductor elements is different in the first condition from the second condition. First and second springs attach the conductor elements to first and second attaching regions of the strain sensor. The first attaching region is disposed at a first reference point of a body to be measured, and/or the second attaching region is disposed at a second reference point of the body to be measured.Type: GrantFiled: June 5, 2019Date of Patent: November 22, 2022Assignee: Dyconex AGInventors: Eckardt Bihler, Marc Hauer
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Patent number: 11456277Abstract: A method for producing an electronic module includes providing a first substrate including at least one first electrical contacting surface, an electronic component including at least one second electrical contacting surface, and a first material layer made of a thermoplastic material including at least one recess extending through the material layer. The first substrate, the electronic component and the first material layer are arranged with the first material layer disposed between the first substrate and the electronic component, and the at least one first electrical contacting surface, the at least one second electrical contacting surface and the at least one recess aligned relative to one another. The first substrate, the electronic component and the material layer are thermocompression bonded. A joint formed between the at least one first electrical contacting surface and the at least one second electrical contacting surface is surrounded or enclosed by the first material layer.Type: GrantFiled: September 28, 2020Date of Patent: September 27, 2022Assignee: DYCONEX AGInventors: Eckardt Bihler, Marc Hauer
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Patent number: 11446503Abstract: The disclosure related to an implant comprising a substrate, a housing, wherein the housing is disposed on the substrate, an electronic circuit disposed on the substrate inside the housing, an electronic component disposed on the substrate outside the housing, and a conductor track, wherein the conductor track connects the electronic circuit to the electronic component. The conductor track is embedded into the substrate at least in sections in such a way that at least one section of the conductor track is completely surrounded by the substrate. Furthermore, a method for creating an implant is disclosed.Type: GrantFiled: June 28, 2019Date of Patent: September 20, 2022Assignee: BIOTRONIK SE & Co. KGInventors: Eckardt Bihler, Marc Hauer, Dirk Muessig
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Publication number: 20210121704Abstract: The disclosure related to an implant comprising a substrate, a housing, wherein the housing is disposed on the substrate, an electronic circuit disposed on the substrate inside the housing, an electronic component disposed on the substrate outside the housing, and a conductor track, wherein the conductor track connects the electronic circuit to the electronic component. The conductor track is embedded into the substrate at least in sections in such a way that at least one section of the conductor track is completely surrounded by the substrate. Furthermore, a method for creating an implant is disclosed.Type: ApplicationFiled: June 28, 2019Publication date: April 29, 2021Applicant: BIOTRONIK SE & Co. KGInventors: Eckardt BIHLER, Marc HAUER, Dirk MUESSIG
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Publication number: 20210093871Abstract: A medical implant includes a first component having a surface and a plurality of electrical contacts and a second component having a surface and a plurality of electrical contacts. Each contact of the first component contacts an assigned contact of the second component in an electrically conducting manner. A seal is disposed between the two surfaces for sealing the contacts. The seal and the two surfaces are formed of a thermoplastic material. The seal is fused to the two surfaces for sealing the contacts and the seal is meltable so as to separate the two components from one another. A method for producing a medical implant is also provided.Type: ApplicationFiled: September 11, 2020Publication date: April 1, 2021Inventors: ECKARDT BIHLER, MARC HAUER
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Publication number: 20210098416Abstract: A method for producing an electronic module includes providing a first substrate including at least one first electrical contacting surface, an electronic component including at least one second electrical contacting surface, and a first material layer made of a thermoplastic material including at least one recess extending through the material layer. The first substrate, the electronic component and the first material layer are arranged with the first material layer disposed between the first substrate and the electronic component, and the at least one first electrical contacting surface, the at least one second electrical contacting surface and the at least one recess aligned relative to one another. The first substrate, the electronic component and the material layer are thermocompression bonded. A joint formed between the at least one first electrical contacting surface and the at least one second electrical contacting surface is surrounded or enclosed by the first material layer.Type: ApplicationFiled: September 28, 2020Publication date: April 1, 2021Inventors: Eckardt Bihler, Marc Hauer
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Patent number: 10964459Abstract: An electrical resistor has a resistance conductor, which is applied to a carrier layer, and two connection elements, which are electrically conductively connected to the resistance conductor. The two connection elements are configured to each be welded or soldered to an electrical contact in order to electrically contact the resistor. The resistance conductor for each connection element has a region that overlaps the corresponding connection element. The overlap region is in electrical contact with the corresponding connection element.Type: GrantFiled: January 23, 2019Date of Patent: March 30, 2021Assignee: Biotronik SE & Co. KGInventors: Marc Hauer, Birgit Neubauer, Jochen Held, Martin Henschel, Thomas Pfefferkorn, Alexander Dettmer
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Patent number: 10932386Abstract: An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.Type: GrantFiled: May 31, 2018Date of Patent: February 23, 2021Assignee: DYCONEX AGInventors: Marc Hauer, Eckardt Bihler, Jochen Held
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Publication number: 20190392964Abstract: A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.Type: ApplicationFiled: June 3, 2019Publication date: December 26, 2019Inventors: Eckardt Bihler, Marc Hauer
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Publication number: 20190366057Abstract: A strain sensor for capacitive strain measurement has a flat and electrically conductive first conductor element and a flat and electrically conductive second conductor element. The two conductor elements oppose one another and are laterally displaceable relative to one another, so that the two conductor elements, proceeding from a first condition, may be displaced relative to one another into a second condition. An overlap between the two conductor elements is different in the first condition from the second condition.Type: ApplicationFiled: June 5, 2019Publication date: December 5, 2019Inventors: ECKARDT BIHLER, MARC HAUER
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Patent number: 10426948Abstract: An implantable electrode having a connection portion. So as to be able to easily stretch the electrode lengthwise, provision is made so that the connection portion is embodied in a coiled manner.Type: GrantFiled: November 23, 2016Date of Patent: October 1, 2019Assignee: BIOTRONIK SE & Co. KGInventors: Eckardt Bihler, Marc Hauer
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Publication number: 20190228887Abstract: An electrical resistor has a resistance conductor, which is applied to a carrier layer, and two connection elements, which are electrically conductively connected to the resistance conductor. The two connection elements are configured to each be welded or soldered to an electrical contact in order to electrically contact the resistor. The resistance conductor for each connection element has a region that overlaps the corresponding connection element. The overlap region is in electrical contact with the corresponding connection element.Type: ApplicationFiled: January 23, 2019Publication date: July 25, 2019Inventors: MARC HAUER, BIRGIT NEUBAUER, JOCHEN HELD, MARTIN HENSCHEL, THOMAS PFEFFERKORN, ALEXANDER DETTMER
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Publication number: 20180359874Abstract: An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.Type: ApplicationFiled: May 31, 2018Publication date: December 13, 2018Inventors: Marc Hauer, Eckardt Bihler, Jochen Held
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Patent number: 10154617Abstract: An electronic assembly, including an encasement joined from at least two casing parts, wherein at least one gap region between two mutually adjoining casing parts is hermetically sealed by a metal layer that is electrodeposited onto the sections of the adjoining casing parts abutting the gap region and bridges the gap region.Type: GrantFiled: June 5, 2017Date of Patent: December 11, 2018Assignee: BIOTRONIK SE & Co. KGInventor: Marc Hauer
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Patent number: 10068681Abstract: A method for producing a medical electrode lead or a catheter, and also to an associated semifinished product. The semifinished product for this purpose includes a cable having at least one electrical conductor, which is embedded in a sheath made of an electrically insulating, thermoplastic material. It is characterized in that the cable, at least at one cable end, forms a connection point, via which the conductor can be attached permanently and non-detachably to further components, wherein part of the surface of the conductor is exposed in the region of the connection point and forms a contact face, and the sheath has, in the region of the connection point, a recess that is continuous in the longitudinal direction of the cable.Type: GrantFiled: January 5, 2017Date of Patent: September 4, 2018Assignee: BIOTRONIK SE & Co. KGInventors: Eckardt Bihler, Marc Hauer, René Toelke
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Publication number: 20180076155Abstract: A circuit substrate of an extremely high frequency electronic component having an organic substrate material and at least one hollow space incorporated into the substrate material, the hollow space being provided, on at least part of its peripheral surfaces, with a metal layer and acting as a hollow waveguide for electrical signals with a carrier frequency of 10 GHz or higher, and being directly adjacent to an active component part, and thereby being electrically connected with such an active component part, or being electrically connected with it through a metal lead, in particular a strip line projecting into the hollow space.Type: ApplicationFiled: July 31, 2017Publication date: March 15, 2018Inventors: Eckardt Bihler, Marc Hauer, Daniel Schulze
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Publication number: 20180068759Abstract: A stretchable electrode conductor arrangement for a medical implant, this stretchable electrode conductor arrangement having at least one zigzag or meandering conductor track on an insulating support with an insulating cover that is tightly connected with the support, embedding the conductor track, the support having an essentially non-stretchable material and being cut in a zigzag or meandering pattern to adapt it to the contour of the conductor track(s).Type: ApplicationFiled: July 31, 2017Publication date: March 8, 2018Inventors: Eckardt Bihler, Marc Hauer, Daniel Schulze