Abstract: A cabinet for housing and cooling electronic components with internally circulating air that is cooled at each of a plurality of equipment shelves.

Abstract: A heat sink comprising a base, fins attached to the base and a flow diverter in contact with the base or at least one of the fins. The flow diverter has a rectangular cross-sectional profile in a plane that is coplanar with and elevated above a plane of the base and spanning the entire separation distance, and, a segment of the flow diverter is angled towards the base to direct the fluid flow towards the base.

Abstract: A heat sink comprising a base, fins attached to the base and a flow diverter in contact with the base or at least one of the fins. The flow diverter has a rectangular cross-sectional profile in a plane that is coplanar with and elevated above a plane of the base and spanning the entire separation distance, and, a segment of the flow diverter is angled towards the base to direct the fluid flow towards the base.

Abstract: A heat sink includes a base and a heat exchange element coupled to the base. The heat exchange element includes a foam structure that is coupled to the base.

Abstract: A heat sink includes a base and fins attached to the base. A flow diverter is in contact with the base or at least one of the fins and is configured to disturb a laminar flow region of a fluid flowing adjacent to at least one of the fins or the base.

Abstract: A heat sink includes a base and a heat exchange element monolithically connected to the base. The heat exchange element has a surface that at least partially bounds first and second paths through the heat exchange element. The surface forms an upper boundary of the first and second paths and includes an opening therethrough connecting the first and second paths.

Abstract: A heat sink includes a surface and a first active element connected to the surface. The first active element is configured to move from a first position relative to the surface to a second position relative to the surface. The movement alters the heat transfer characteristics of the heat sink.

Abstract: Cabinet for housing and cooling electronic components with internally circulating air that is cooled at each of a plurality of equipment shelves.

Abstract: Apparatus and method for increasing the concentration of a chemical substance in a fluid comprise a micro-fluidic elongated channel formed in a substrate, with the channel being in fluid-flow communication with an ambient region along its elongated dimension. In general, the fluid includes first and second chemical substances having different vapor pressures. The apparatus includes an evaporation controller for increasing the evaporation rate of the fluid from the channel into the ambient region, thereby increasing the concentration of the higher vapor pressure (HVP) substance in the portion of the fluid remaining in the channel and increasing the concentration of the lower vapor pressure (LVP) substance in the portion of the fluid evaporated into the ambient region.

Abstract: A method is provided for cooling electrical equipment located in distinct regions in a cabinet. A first air flow is provided to a first region in the cabinet. A second air flow is provided to a second region in the cabinet. The temperature of the first and second air flows provided to the first and second regions is substantially equalized to provide similar cooling characteristics within the first and second regions. The equalization is accomplished via a heat exchanger arrangement that may be an active or passive system.

Abstract: A device comprising a substrate having a surface that comprises a conductive base layer. The device also comprises fluid-support-structures on the conductive base layer. Each of the fluid-support-structures has at least one dimension of about 1 millimeter or less. Each of the fluid-support-structures is coated with an electrical insulator. The device is configured to oscillate a fluid locatable between tops of the fluid-support-structures and the conductive base layer when a voltage is applied between the conductive base layer and the fluid.

Abstract: An apparatus comprising a substrate having a surface configured to accommodate a fluid thereover. A plurality of fluid-support-structures are on the surface. Each of the fluid-support-structures has at least one dimension of less than one millimeter. A well in the substrate has an opening on the surface. A medium is locatable between the plurality of fluid-support-structures and in the well. The medium located between the fluid-support-structures is in communication with the medium in the well.

Abstract: A device comprising a substrate having a base layer, the base layer being connectable to a source of current. The device also includes fluid-support-structures located on the base layer. Each of the fluid-support-structures has at least one dimension of about 1 millimeter or less. The base layer is configured to impart heat to a fluid locatable over the base layer and convert at least a portion of the fluid to a vapor when a current is applied to the base layer.

Abstract: A thermal management for EMI shielded circuit packs having one or more high-power components, i.e. heat sources. More particularly, a heat transfer device or assembly for EMI shielded circuit packs is provided whereby multiple components (e.g., high-power components) are cooled by individual heat sinks (i.e., each component has its own individual heat sink) which protrude into an external airflow through individual openings in the lid of the EMI shield. Mechanically-compliant, electrically-conductive gaskets are used to seal the base plates of the individual heat sinks against the lid of the EMI shield enclosure. As such, in accordance with the various embodiments, the conductive gaskets establish a compliance layer which accommodates any variation in the heights of the individual components, thereby, allowing optimum thermal contact between the components and their respective heat sinks without compromising the EMI shielding.

Abstract: Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device is provided. The heat-transfer device comprises one or more microchannels suitable for containing a heat-transfer fluid, one or more of the microchannels having protruding structures on at least one inner surface thereof configured to affect flow of the heat-transfer fluid through the one or more microchannels. The structures may comprise posts coated with a hydrophobic coating.

Abstract: Techniques for heat removal are provided. In one illustrative embodiment, a heat-transfer device is provided. The heat-transfer device comprises at least one heat-dissipating structure thermally connectable to at least one heat source, wherein the heat-dissipating structure comprises at least two components thermally coupled to each other and configured to slide relative to one another, one or more of the components comprising one or more heat-dissipating fins configured to dissipate at least a portion of heat from the heat source to air proximate to the device.

Abstract: Techniques for heat removal are provided. In one illustrative embodiment, a heat-transfer device is provided. The heat-transfer device comprises at least one heat-dissipating structure thermally connectable to at least one heat source, wherein the heat-dissipating structure comprises at least two components thermally coupled to each other and configured to slide relative to one another.

Abstract: A battery having a nanostructured battery electrode is disclosed wherein it is possible to reverse the contact of the electrolyte with the battery electrode and, thus, to return a battery to a reserve state after it has been used to generate current. In order to achieve this reversibility, the nanostructures on the battery electrode comprise a plurality of closed cells and the pressure within the enclosed cells is varied. In a first embodiment, the pressure is varied by varying the temperature of a fluid within the cells by, for example, applying a voltage to electrodes disposed within said cells. In a second illustrative embodiment, once the battery has been fully discharged, the battery is recharged and then the electrolyte fluid is expelled from the cells in a way such that it is no longer in contact with the battery electrode.

Abstract: Apparatus and method for increasing the concentration of a chemical substance in a fluid comprise a micro-fluidic elongated channel formed in a substrate, with the channel being in fluid-flow communication with an ambient region along its elongated dimension. In general, the fluid includes first and second chemical substances having different vapor pressures. The apparatus includes an evaporation controller for increasing the evaporation rate of the fluid from the channel into the ambient region, thereby increasing the concentration of the higher vapor pressure (HVP) substance in the portion of the fluid remaining in the channel and increasing the concentration of the lower vapor pressure (LVP) substance in the portion of the fluid evaporated into the ambient region.

Abstract: A method and apparatus is disclosed wherein the flow resistance of a droplet disposed on a nanostructured or microstructured surface is controlled. A closed-cell feature is used in a way such that, when the pressure of at least a first fluid within one or more of the cells of said surface is decreased to or below a desired level, a droplet disposed on that surface is caused to at least partially penetrate the surface. In another illustrative embodiment, the pressure within one or more of the cells is increased to or above a desired level in a way such that the droplet of liquid is returned at least partially to its original, unpenetrated position. In yet another embodiment, a closed-cell structure feature pattern is used to prevent penetration of the nanostructured or microstructured surface, even when the pressure of the fluid disposed on the surface is relatively high.