Abstract: The invention relates to a system for providing access information to a service provider for a property comprising of an apartment or condo association and for a specific apartment within the apartment or condo association. The system utilizes a software system to schedule the access for the service provider and automated lock management access control to control the access to the property and the specific apartment.

Abstract: Provided are TCRs (e.g., TCRs that bind to MLL, e.g., TCRs that bind to an MLL phosphopeptide, e.g., TCRs that bind to an MLL phosphopeptide/MHC complex), cells and pharmaceutical compositions comprising these TCRs, nucleic acids encoding these TCRs, expression vectors and host cells for making these TCRs, and methods of treating a subject using these TCRs.

Abstract: Plastic packaging materials and processes that facilitate recycling of PET (polyethylene terephthalate) containers such as PET bottles and crystallizable clear PET-g (glycol-modified polyethylene terephthalate) labels such as heat shrinking sleeve labels. A clear primer coating for recyclable PET-g shrink-sleeve labels, curable upon exposure to UV light, which is excellent in adhesion, steam-resistance and overprint ability, and which promotes the de-inking of subsequent coloured ink layers under relatively mild caustic wash conditions. Methods of utilizing such a primer coating within flexographic printing processes.

Abstract: A deck for holding a cosmetic product, the deck including a rigid outer rim including one or more securing points for securing the outer rim to a container and a flexible inner portion connected to the rigid outer rim, the flexible inner portion including a well for suspending a cosmetic product.

Abstract: A method for performing a task in registration with a discrete seal in at least one material is described herein. The method involves simultaneously forming a discrete seal and a fiducial/eye mark in the at least one material. The method includes providing a detection device; providing a unit operation mechanism; and performing an operation on the material(s) in registration with the discrete seal. The task performed in registration with the discrete seal is based upon the location of the eye mark that was simultaneously formed with the discrete seal. A method of making flexible containers using cutting to form the outer periphery of the packages is described herein. Also described herein are flexible containers and container blanks made by such a method.

Abstract: A plasma coating method for coating particulate matter, including the steps of: a) providing a low-temperature atmospheric plasma jet from a plasma gas outside of the reaction chamber; b) inserting a precursor into the plasma jet, thereby obtaining a plasma coating flow comprising an excited precursor, followed by injecting the plasma coating flow comprising the excited precursor in the reaction chamber, and c) subjecting particulate matter to said plasma coating flow comprising said excited precursor, thereby obtaining particulate matter comprising an at least partial coating. a coating reactor apparatus and a system involve the plasma coating method.

Abstract: The present disclosure describes a coaxial-interconnect structure that is integrated into a semiconductor component and methods of forming the coaxial-interconnect structure. The coaxial interconnect-structure, which electrically couples circuitry of an integrated-circuit (IC) die to traces of a packaging substrate, comprises a signal core elongated about an axis, a ground shield elongated about the axis, and an insulator disposed between the signal core and the ground shield.

Abstract: A probe card for testing dies of a substrate during a wafer sort process includes a printed circuit board (PCB) and a test site arranged to connect respectively to one of the dies during a test cycle. The test site includes a first pin connecting band and a first pin set. The first pin connecting band is connected to the PCB. The first pin set is connected to the first pin connecting band and includes a pin configuration for a testing device to perform a first type of test on a first die. The test site includes only pins in the first pin set. A number of pins in the first pin set is less than a number of pins used to perform a second type of test on the first die. The second type of test is performed at a slower processing speed than the first type of test.

Abstract: The present disclosure describes apparatuses and techniques for self-aligning integrated circuit (IC) dies. In some aspects, a hydrophobic material is deposited on a surface of a substrate to form a pattern on the surface of the substrate. The pattern may expose areas of the substrate surface for placement of IC dies. A water-based solution is then applied to the exposed areas such that droplets form on the exposed areas of the substrate surface. IC dies are placed on the droplets of the water-based solution, which can cause the IC dies to align with the exposed areas of the substrate surface. The droplets are then caused to evaporate such that the IC dies settle on the exposed areas of the substrate surface.

Abstract: The present disclosure describes methods and apparatuses for testing an integrated circuit. In some aspects, a test engine of a system-on-chip (SoC) receives a test trigger from an external test port of a multi-chip module. The multi-chip module includes the SoC and integrated circuitry. Responsive to receiving the test trigger, the test engine initiates execution of a test associated with the integrated circuitry. The test engine also generates test data associated with the test and provides the test data at the external test port of the MCM. In this manner, internal tests can be executed within the multi-chip module. In other aspects, the SoC and the integrated circuitry are not packaged together. The test engine can receive the test trigger from a test port of the SoC and initiate execution of the test. In this way, the SoC may act as a test instrument for the integrated circuitry.

Abstract: The present disclosure describes a coaxial-interconnect structure that is integrated into a semiconductor component and methods of forming the coaxial-interconnect structure. The coaxial interconnect-structure, which electrically couples circuitry of an integrated-circuit (IC) die to traces of a packaging substrate, comprises a signal core elongated about an axis, a ground shield elongated about the axis, and an insulator disposed between the signal core and the ground shield.

Abstract: A probe card for testing dies of a substrate during a wafer sort process includes a printed circuit board (PCB) and a test site arranged to connect respectively to one of the dies during a test cycle. The test site includes a first pin connecting band and a first pin set. The first pin connecting band is connected to the PCB. The first pin set is connected to the first pin connecting band and includes a pin configuration for a testing device to perform a first type of test on a first die. The test site includes only pins in the first pin set. A number of pins in the first pin set is less than a number of pins used to perform a second type of test on the first die. The second type of test is performed at a slower processing speed than the first type of test.

Abstract: An apparatus, including methods of construction and use, for super-fine pitch integrated circuit testing is disclosed. The apparatus includes a substrate of one or more redistribution layers (RDLs), a plurality of vertical interconnect access (via) columns, a material that backs the substrate, and another material that protects the plurality of via columns. Semiconductor wafer fabrication processes are used to fabricate the apparatus, effective to enable the apparatus to test one or more IC die having pad pitch spacing of less than 50 um.

Abstract: The present disclosure describes apparatuses and techniques for self-aligning integrated circuit (IC) dies. In some aspects, a hydrophobic material is deposited on a surface of a substrate to form a pattern on the surface of the substrate. The pattern may expose areas of the substrate surface for placement of IC dies. A water-based solution is then applied to the exposed areas such that droplets form on the exposed areas of the substrate surface. IC dies are placed on the droplets of the water-based solution, which can cause the IC dies to align with the exposed areas of the substrate surface. The droplets are then caused to evaporate such that the IC dies settle on the exposed areas of the substrate surface.