Abstract: Structures and methods of protecting membranes on pressure sensors. One example may provide a pressure sensor having a backside cavity defining a frame and under a membrane formed in a device layer. The sensor may further include a cap joined to the device layer by a bonding layer. A recess for a reference cavity may be formed in one or more of the cap, bonding layer, and membrane or other device layer portion. The recess may have a width that is narrower than a width of the backside cavity in at least one direction. A eutectically bondable metal stack may be provided on a bottom side of the sensor. Conductive traces in the sensor may be formed by implanting and annealing ions. An implanted field shield may be formed to protect the conductive traces that form sense elements. Damage prevention circuitry and a temperature sensing diode may also be provided.