Abstract: A host module configured for insertion into a chassis of a network element includes a Printed Circuit Board (PCB); a plurality of rails disposed on the PCB, for housing one or more universal sub slot modules on the host module, wherein the plurality of rails are for guiding a universal sub slot module during insertion and for stabilization thereof; and a faceplate disposed to the PCB and including one or more openings each for the one or more universal sub slot modules, wherein the PCB communicates to each of the one or more universal sub slot modules via a plurality of high-speed links that are at least 28 Gbps each. At least one of the one or more universal sub slot modules can be a coherent modem or a router.

Abstract: Systems and methods for controlling airflow through a casing or shelf assembly are provided. An apparatus, according to one implementation, includes a mount plate configured to be attached to a side panel of a casing for housing network equipment. For example, the mount plate may include a window. The apparatus also includes one or more hinges arranged at an edge of the window of the mount plate and a baffle pivotably attached to the one or more hinges. The baffle can be arranged within a range of positions with respect to the mount plate to control an amount of airflow through the window. Within these range of positions, the baffle is configured to redirect the airflow in a front-to-back direction through the casing.

Abstract: A module for use in a hardware platform for networking, computing, or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side has greater vertical clearance than the secondary side; at least one component mounted on the secondary side, the at least one component being placed on the secondary side due to an increased complexity and component density on the printed circuit board assembly preventing its placement on the primary side; and a floating heatsink assembly disposed on the secondary side to dissipate heat from the at least one component, the floating heatsink assembly being biased against the at least one component by at least one resilient member arranged within a limited vertical space on the secondary side.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly; components disposed on a primary side of the printed circuit board assembly; a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module. The module further includes a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly; components disposed on a primary side of the printed circuit board assembly; a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module. The module further includes a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.

Abstract: Methods and systems implement computing systems configured to trigger a volatile memory scan based on execution of computer-executable instructions, and to downselect scope of a volatile memory scan. Such techniques for triggering scans are sufficiently selective to avoid volatile memory scans for each and every running process, or vast majority of running processes. Moreover, volatile memory scans are triggered responsively after the computer-executable instructions are run, so that target processes to be scanned have not yet terminated at the time of the volatile memory scan. Additionally, a variety of techniques are implemented to minimize the volatile memory scans adversely impacting computational performance of the computing system.

Abstract: Systems and methods include receiving an Optical Transport Network (OTN) signal; segmenting the OTN signal into one or more flows of packets; and transmitting the one or more flows of packets spread over one or more Ethernet links. The one or more flows can be transmitted over a Leaf/Spine network, and the one or more flows can be elephant and/or mice flows.

Abstract: A host module configured for insertion into a chassis of a network element includes a Printed Circuit Board (PCB); a plurality of rails disposed on the PCB, for housing one or more universal sub slot modules on the host module, wherein the plurality of rails are for guiding a universal sub slot module during insertion and for stabilization thereof; and a faceplate disposed to the PCB and including one or more openings each for the one or more universal sub slot modules, wherein the PCB communicates to each of the one or more universal sub slot modules via a plurality of high-speed links that are at least 28 Gbps each. At least one of the one or more universal sub slot modules can be a coherent modem or a router.

Abstract: Systems and methods include receiving an Optical Transport Network (OTN) signal; segmenting the OTN signal into one or more flows of packets; and transmitting the one or more flows of packets spread over one or more Ethernet links. The one or more flows can be transmitted over a Leaf/Spine network, and the one or more flows can be elephant and/or mice flows.

Abstract: A universal sub slot module includes a Printed Circuit Board (PCB) including circuitry for power, a data plane, and a control plane; a faceplate connected to one end of the PCB and connectors connected to another end of the PCB, wherein the connectors are configured to connect to corresponding connectors in a host module; and a form factor containing the PCB and configured to interface a sub slot in the host module configured to operate in a chassis-based or rack mounted unit network element. The host module can include a plurality of sub slots, each being a port having one of the universal sub slot module and a filler module. The data plane can be configured to implement one of Optical Transport Network (OTN), Beyond 100G, Flexible Optical (FlexO), Ethernet, and Flexible Ethernet (FlexE).

Abstract: A network element (16) includes ingress optics (22) configured to receive a client signal; egress optics (30) configured to transmit packets over one or more Ethernet links (20) in a network (12); circuitry (26, 28) interconnecting the ingress optics (22) and the egress optics (30), wherein the circuitry is configured to segment an Optical Transport Network (OTN) signal from the client signal into one or more flows; and provide the one or more flows to the egress optics for transmission over the one or more of Ethernet links (20) to a second network element (18) that is configured to provide the one or more flows into the OTN signal.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A network element (16) includes ingress optics (22) configured to receive a client signal; egress optics (30) configured to transmit packets over one or more Ethernet links (20) in a network (12); circuitry (26, 28) interconnecting the ingress optics (22) and the egress optics (30), wherein the circuitry is configured to segment an Optical Transport Network (OTN) signal from the client signal into one or more flows; and provide the one or more flows to the egress optics for transmission over the one or more of Ethernet links (20) to a second network element (18) that is configured to provide the one or more flows into the OTN signal.

Abstract: Time transfer systems and methods implemented in a first node steps of communicating a stream of encoded blocks with a second node; and communicating synchronization messages with the second node via a synchronization message channel in overhead associated with the stream of encoded blocks, wherein the synchronization messages are utilized for synchronization of a clock at the second node. Each block in the stream of encoded blocks can be one of a data block and an overhead block.

Abstract: A universal sub slot module includes a Printed Circuit Board (PCB) including circuitry for power, a data plane, and a control plane; a faceplate connected to one end of the PCB and connectors connected to another end of the PCB, wherein the connectors are configured to connect to corresponding connectors in a host module; and a form factor containing the PCB and configured to interface a sub slot in the host module configured to operate in a chassis-based or rack mounted unit network element. The host module can include a plurality of sub slots, each being a port having one of the universal sub slot module and a filler module. The data plane can be configured to implement one of Optical Transport Network (OTN), Beyond 100G, Flexible Optical (FlexO), Ethernet, and Flexible Ethernet (FlexE).

Abstract: A universal sub slot module is configured to be inserted in a slot in a hardware module that is configured to be inserted in one of a chassis and rack mounted unit. The universal sub slot module includes a printed circuit board; an optics component on the printed circuit board; a data plane and a control plane on the printed circuit board and communicatively coupled to the optics components; and connectors on the printed circuit board and communicatively coupled to the data plane and the control plane, wherein the connectors are configured to connect to corresponding connectors in the one or more hardware modules.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A universal sub slot module is configured to be inserted in a slot in a hardware module that is configured to be inserted in one of a chassis and rack mounted unit. The universal sub slot module includes a printed circuit board; an optics component on the printed circuit board; a data plane and a control plane on the printed circuit board and communicatively coupled to the optics components; and connectors on the printed circuit board and communicatively coupled to the data plane and the control plane, wherein the connectors are configured to connect to corresponding connectors in the one or more hardware modules.