Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.

Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.

Abstract: Methods and devices are provided for suppressing reverberations within an ultrasound transducer with a backing whereby the backing may not sufficiently attenuate the acoustic energy by means of acoustic absorption and scattering alone. At least a portion of a surface of the backing is segmented into a plurality of levels defined by surface segments. The levels may be are spatially offset so that acoustic reflections from the segmented surface are spread out in time, thereby decreasing the net amplitude of the internally reflected waves as they interact with the piezoelectric layer. Adjacent (neighboring) levels may be spatially offset by a longitudinal distance equaling approximately an odd number multiple of a quarter of an operational wavelength of the transducer, so that destructive interference occurs from acoustic waves reflected from adjacent levels. Various example configurations of segmented surfaces are described, and methods for selecting a profile of a segmented surface are provided.

Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.

Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.

Abstract: Systems, methods, and computer readable media for high-frequency contrast imaging and image-guided therapeutics are disclosed. According to one aspect a method for high frequency contrast imaging and image-guided therapeutics includes: providing ultrasound of a first frequency bandwidth, directed toward the volume to be imaged, the volume containing a carrier having non-linear acoustical properties, wherein the ultrasound of the first frequency bandwidth causes the carrier to generate ultrasound of a second frequency bandwidth that is different from the first frequency bandwidth; receiving, from the volume to be imaged, ultrasound of the second frequency bandwidth; and using the received ultrasound of the second frequency bandwidth to generate an image of the volume to be imaged, wherein the components of the second frequency bandwidth that are detected are of a frequency greater than 20 MHz.

Abstract: Methods and devices are provided for suppressing reverberations within an ultrasound transducer with a backing whereby the backing may not sufficiently attenuate the acoustic energy by means of acoustic absorption and scattering alone. At least a portion of a surface of the backing is segmented into a plurality of levels defined by surface segments. The levels may be are spatially offset so that acoustic reflections from the segmented surface are spread out in time, thereby decreasing the net amplitude of the internally reflected waves as they interact with the piezoelectric layer. Adjacent (neighbouring) levels may be spatially offset by a longitudinal distance equaling approximately an odd number multiple of a quarter of an operational wavelength of the transducer, so that destructive interference occurs from acoustic waves reflected from adjacent levels. Various example configurations of segmented surfaces are described, and methods for selecting a profile of a segmented surface are provided.

Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.

Abstract: Systems and methods are provided for localizing and visualizing devices with the use of an intracorporeal ultrasound imaging probe during a medical procedure. A primary intracorporeal ultrasound imaging probe is employed to image a three-dimensional region via scanning, and to locate a secondary intracorporeal device having one or more ultrasonic beacon transducers. When an A-scan vector associated with the primary intracorporeal ultrasound imaging device is directed towards one or more of the ultrasound beacon transducers of the secondary intracorporeal device, a communication signal is transmitted from the secondary intracorporeal device to a control and processing system associated with the primary intracorporeal ultrasound imaging device, either through acoustic transmission or non-acoustic transmission. Example embodiments are provided in which acoustic communication may be employed within the imaging band, or in a separate communication band distinct from the communication band.

Abstract: The invention features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the inventions provides methods of patterning electrodes, e.g., in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layer for an ultrasound transducer. The invention also features ultrasound transducers produced by the methods described herein.

Abstract: Methods for the manufacture of electrical components, such as ultrasound transducers, are illustrated and described. In particular, several embodiments of the methods can include patterning electrodes, such as for the connection of an ultrasound transducer to an electrical circuit. The methods also can include depositing metal on surfaces and making an integrated matching layer for an ultrasound transducer. Ultrasound transducers produced by these methods also are illustrated and described.

Abstract: Systems, methods, and computer readable media for high-frequency contrast imaging and image-guided therapeutics are disclosed. According to one aspect a method for high frequency contrast imaging and image-guided therapeutics includes: providing ultrasound of a first frequency bandwidth, directed toward the volume to be imaged, the volume containing a carrier having non-linear acoustical properties, wherein the ultrasound of the first frequency bandwidth causes the carrier to generate ultrasound of a second frequency bandwidth that is different from the first frequency bandwidth; receiving, from the volume to be imaged, ultrasound of the second frequency bandwidth; and using the received ultrasound of the second frequency bandwidth to generate an image of the volume to be imaged, wherein the components of the second frequency bandwidth that are detected are of a frequency greater than 20 MHz.

Abstract: An ultrasonic transducer comprises a stack having a first face, an opposed second face and a longitudinal axis extending therebetween. The stack comprises a plurality of layers, each layer having a top surface and an opposed bottom surface, wherein the plurality of layers of the stack comprises a piezoelectric layer and a dielectric layer. The dielectric layer is connected to the piezoelectric layer and defines an opening extending a second predetermined length in a direction substantially parallel to the axis of the stack. A plurality of first kerf slots are defined therein the stack, each first kerf slot extending a predetermined depth therein the stack and a first predetermined length in a direction substantially parallel to the axis.

Abstract: The invention features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the inventions provides methods of patterning electrodes, e.g., in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layer for an ultrasound transducer. The invention also features ultrasound transducers produced by the methods described herein.

Abstract: An ultrasonic transducer comprises a stack having a first face, an opposed second face and a longitudinal axis extending therebetween. The stack comprises a plurality of layers, each layer having a top surface and an opposed bottom surface, wherein the plurality of layers of the stack comprises a piezoelectric layer and a dielectric layer. The dielectric layer is connected to the piezoelectric layer and defines an opening extending a second predetermined length in a direction substantially parallel to the axis of the stack. A plurality of first kerf slots are defined therein the stack, each first kerf slot extending a predetermined depth therein the stack and a first predetermined length in a direction substantially parallel to the axis.

Abstract: An ultrasonic transducer comprises a stack having a first face, an opposed second face and a longitudinal axis extending therebetween. The stack comprises a plurality of layers, each layer having a top surface and an opposed bottom surface, wherein the plurality of layers of the stack comprises a piezoelectric layer and a dielectric layer. The dielectric layer is connected to the piezoelectric layer and defines an opening extending a second predetermined length in a direction substantially parallel to the axis of the stack. A plurality of first kerf slots are defined therein the stack, each first kerf slot extending a predetermined depth therein the stack and a first predetermined length in a direction substantially parallel to the axis.

Abstract: An ultrasonic transducer comprises a stack having a first face, an opposed second face and a longitudinal axis extending therebetween. The stack comprises a plurality of layers, each layer having a top surface and an opposed bottom surface, wherein the plurality of layers of the stack comprises a piezoelectric layer and a dielectric layer. The dielectric layer is connected to the piezoelectric layer and defines an opening extending a second predetermined length in a direction substantially parallel to the axis of the stack. A plurality of first kerf slots are defined therein the stack, each first kerf slot extending a predetermined depth therein the stack and a first predetermined length in a direction substantially parallel to the axis.