Patents by Inventor Marc Mangrum

Marc Mangrum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080108179
    Abstract: A first packaged integrated circuit (IC) includes a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least one IC die, an encapsulant over the first surface surrounding the at least one IC die and the plurality of conductive members, wherein at least a portion of each of the plurality of conductive members is exposed by the encapsulant. A second packaged IC may be stacked onto the first packaged IC. The second packaged IC includes at least one IC die and a plurality of conductive members, each conductive member of the plurality of conductive members of the second packaged IC is in contact with a corresponding conductive member of the plurality conductive members of the first packaged IC.
    Type: Application
    Filed: January 3, 2008
    Publication date: May 8, 2008
    Applicant: Freescale Semiconductor, Inc
    Inventors: Addi Mistry, Marc Mangrum, David Patten, Jesse Phou, Ziep Tran
  • Publication number: 20070141751
    Abstract: A first packaged integrated circuit (IC) includes a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least one IC die, an encapsulant over the first surface surrounding the at least one IC die and the plurality of conductive members, wherein at least a portion of each of the plurality of conductive members is exposed by the encapsulant. A second packaged IC may be stacked onto the first packaged IC. The second packaged IC includes at least one IC die and a plurality of conductive members, each conductive member of the plurality of conductive members of the second packaged IC is in contact with a corresponding conductive member of the plurality conductive members of the first packaged IC.
    Type: Application
    Filed: December 16, 2005
    Publication date: June 21, 2007
    Inventors: Addi Mistry, Marc Mangrum, David Patten, Jesse Phou, Ziep Tran
  • Publication number: 20060231938
    Abstract: Two or more semiconductor packages are stacked with an intervening element that is positioned between within an area surrounded by conductive bumps of a bottom surface of the overlying package. Different shapes of the intervening element are used depending upon how many sides of the bottom surface have conductive bumps. In one form the intervening element extends laterally from the stack and is bent downward to contact or extend through an underlying substrate. Contact to the intervening element at the backside of the substrate may be made. In another form the intervening element is bent upward for enhancing thermal properties. The intervening element is adhesive to prevent non-destructive removal of the packages thereby adding increased security for information contained within the packages. Selective electrical shielding between packages is also provided.
    Type: Application
    Filed: April 18, 2005
    Publication date: October 19, 2006
    Inventor: Marc Mangrum
  • Publication number: 20060012036
    Abstract: A circuit device (15) is placed within an opening of a conductive layer (10) which is then partially encapsulated with an encapsulant (24) so that the active surface of the circuit device (15) is coplanar with the conductive layer (10). At least a portion of the conductive layer (10) may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device (115) may be placed on a conductive layer (100) such that an active surface of circuit device (115) is between conductive layer (100) and an opposite surface of circuit device (115). The conductive layer (100) has at least one opening (128) to expose the active surface of circuit device (115). The encapsulant (24, 126, 326) may be electrically conductive or electrically non-conductive.
    Type: Application
    Filed: July 19, 2005
    Publication date: January 19, 2006
    Inventors: George Leal, Jie-Hua Zhao, Edward Prack, Robert Wenzel, Brian Sawyer, David Wontor, Marc Mangrum