Abstract: An apparatus for wet cleaning or etching of flat substrates comprising a tank with an inlet opening and outlet opening for said substrates. Said tank contains a cleaning liquid and is installed in a gaseous environment. At least one of the openings is a slice in a sidewall of the tank and is present below the liquid-surface. In the tank there may be a portion above the liquid filled with a gas with a pressure being lower than the pressure within said environment. The method comprises the step of transferring a substrate through the cleaning or etching liquid at a level underneath the surface of said liquid making use of said apparatus.

Abstract: An apparatus for wet cleaning or etching of flat substrates comprising a tank with an inlet opening and outlet opening for said substrates. Said tank contains a cleaning liquid and is installed in a gaseous environment. At least one of the openings is a slice in a sidewall of the tank and is present below the liquid-surface. In the tank there may be a portion above the liquid filled with a gas with a pressure being lower than the pressure within said environment. The method comprises the step of transferring a substrate through the cleaning or etching liquid at a level underneath the surface of said liquid making use of said apparatus.

Abstract: A device for treatment of substrates in a fluid container includes a container containing a treatment fluid and a substrate transport device moveable into a position above the container. The substrate transport device has at least one substrate holding device for securing the substrates in a first position and releasing the substrates in a second position. A third position may be provided in which a first set of substrates is secured and a second set of substrates is released. The substrate holding device is preferably at least one rotatable securing rod.

Abstract: A method for measuring the resistance or conductivity between two or more conductors which are placed against a semiconductor element, wherein in order to bring the contact resistance between the conductors and the element to, to hold it at,a predetermined value during measuring, the conductors are held at a constant distance and/or under constant pressure relative to the semiconductor element.