Patents by Inventor Marc Papageorge
Marc Papageorge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200355643Abstract: Some embodiments include an electrochemical sensor. The electrochemical sensor has a lid element comprising a substrate, multiple electrodes, multiple interior contacts electrically coupled to the multiple electrodes, a base element configured to be coupled to the lid element, and an electrolyte element. The base element includes a sensor cavity, multiple exterior contacts located at an exterior surface of the base element, and multiple signal communication channels comprising multiple signal communication lines, and the electrolyte element is located in the sensor cavity. When the lid element is coupled to the base element, the multiple electrodes are located in the sensor cavity, the multiple electrodes are in electrolytic communication with the electrolyte element, the multiple interior contacts are located in the sensor cavity, and the multiple interior contacts are electrically coupled to the multiple exterior contacts by the multiple signal communication lines.Type: ApplicationFiled: July 31, 2020Publication date: November 12, 2020Applicant: SENSIRION AGInventors: Marc Papageorge, Joseph R. Stetter, Vinay Patel, William Escobar
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Patent number: 10761046Abstract: Some embodiments include an electrochemical sensor. The electrochemical sensor has a lid element comprising a substrate, multiple electrodes, multiple interior contacts electrically coupled to the multiple electrodes, a base element configured to be coupled to the lid element, and an electrolyte element. The base element includes a sensor cavity, multiple exterior contacts located at an exterior surface of the base element, and multiple signal communication channels comprising multiple signal communication lines, and the electrolyte element is located in the sensor cavity. When the lid element is coupled to the base element, the multiple electrodes are located in the sensor cavity, the multiple electrodes are in electrolytic communication with the electrolyte element, the multiple interior contacts are located in the sensor cavity, and the multiple interior contacts are electrically coupled to the multiple exterior contacts by the multiple signal communication lines.Type: GrantFiled: January 23, 2017Date of Patent: September 1, 2020Assignee: SENSIRION AGInventors: Marc Papageorge, Joseph R. Stetter, Vinay Patel, William Escobar
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Publication number: 20170131230Abstract: Some embodiments include an electrochemical sensor. The electrochemical sensor has a lid element comprising a substrate, multiple electrodes, multiple interior contacts electrically coupled to the multiple electrodes, a base element configured to be coupled to the lid element, and an electrolyte element. The base element includes a sensor cavity, multiple exterior contacts located at an exterior surface of the base element, and multiple signal communication channels comprising multiple signal communication lines, and the electrolyte element is located in the sensor cavity. When the lid element is coupled to the base element, the multiple electrodes are located in the sensor cavity, the multiple electrodes are in electrolytic communication with the electrolyte element, the multiple interior contacts are located in the sensor cavity, and the multiple interior contacts are electrically coupled to the multiple exterior contacts by the multiple signal communication lines.Type: ApplicationFiled: January 23, 2017Publication date: May 11, 2017Applicant: Spec Sensors, LLCInventors: Marc Papageorge, Joseph R. Stetter, Vinay Patel, William Escobar
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Publication number: 20160189520Abstract: An electronic device cover system that includes an electronic device cover engageable with an electronic device, a gas sensor coupled to the electronic device cover, and a control circuit communicatively coupled to the gas sensor and communicatively engageable with an electronic device. When the gas sensor detects a presence of a target gas, the control circuit receives a signal output by the gas sensor and outputs a signal receivable by an electronic device.Type: ApplicationFiled: December 31, 2015Publication date: June 30, 2016Applicant: SPEC Sensors, LLCInventors: Marc Papageorge, Bennett Meulendyk, Joseph R. Stetter, Vinay Patel, David Peaslee, Gavin O'Toole
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Publication number: 20140210083Abstract: In one embodiment, a device package is provided. The device package can include a substrate having first and second opposing surfaces, an opening being formed through the first and second surfaces of the substrate; a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate; and an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate.Type: ApplicationFiled: March 28, 2014Publication date: July 31, 2014Applicant: Broadcom CorporationInventors: Sam Ziqun Zhao, Reza-ur Rahman Khan, Edward Law, Marc Papageorge
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Patent number: 8686558Abstract: In one embodiment, a method for assembling a ball grid array (BGA) package is provided. The method includes providing a stiffener that has opposing first and second surfaces, wherein the first surface is capable of mounting an integrated circuit (IC) die in a central area and forming a pattern in at least a portion of the first surface to enhance the adhesiveness of an encapsulant material to the first surface.Type: GrantFiled: September 2, 2011Date of Patent: April 1, 2014Assignee: Broadcom CorporationInventors: Sam Ziqun Zhao, Reza-ur Rahman Khan, Edward Law, Marc Papageorge
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Publication number: 20110318885Abstract: In one embodiment, a method for assembling a ball grid array (BGA) package is provided. The method includes providing a stiffener that has opposing first and second surfaces, wherein the first surface is capable of mounting an integrated circuit (IC) die in a central area and forming a pattern in at least a portion of the first surface to enhance the adhesiveness of an encapsulant material to the first surface.Type: ApplicationFiled: September 2, 2011Publication date: December 29, 2011Applicant: Broadcom CorporationInventors: Sam Ziqun Zhao, Reaz-ur Rahman Khan, Edward Law, Marc Papageorge
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Patent number: 8039949Abstract: Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.Type: GrantFiled: November 16, 2009Date of Patent: October 18, 2011Assignee: Broadcom CorporationInventors: Sam Ziqun Zhao, Rezaur Rahman Khan, Edward Law, Marc Papageorge
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Publication number: 20100052151Abstract: Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.Type: ApplicationFiled: November 16, 2009Publication date: March 4, 2010Applicant: Broadcom CorporationInventors: Sam Ziqun ZHAO, Reza-ur Rahman Khan, Edward Law, Marc Papageorge
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Patent number: 7629681Abstract: Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.Type: GrantFiled: October 14, 2004Date of Patent: December 8, 2009Assignee: Broadcom CorporationInventors: Sam Ziqun Zhao, Reza-ur Rahman Khan, Edward Law, Marc Papageorge
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Patent number: 6882042Abstract: Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.Type: GrantFiled: November 30, 2001Date of Patent: April 19, 2005Assignee: Broadcom CorporationInventors: Sam Ziqun Zhao, Reaz-ur Rahman Khan, Edward Law, Marc Papageorge
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Publication number: 20050077545Abstract: Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.Type: ApplicationFiled: October 14, 2004Publication date: April 14, 2005Applicant: Broadcom CorporationInventors: Sam Zhao, Reaz-ur Khan, Edward Law, Marc Papageorge
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Publication number: 20020135065Abstract: Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.Type: ApplicationFiled: November 30, 2001Publication date: September 26, 2002Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan, Edward Law, Marc Papageorge