Abstract: A mechanism is provided for detecting a defect in a populated sample having a thickness dimension substantially smaller than the length and width dimensions thereof, the populated sample having a first side and an opposite second side, at least said first side of said populated sample having one or more Surface Mounted Components. The mechanism exploits a standard thermographic image which may be used in a detection method comprising 1) directing a thermal wave at said second side of said populated sample 2) recording a thermographic image of the first side of said populated sample once a surface thereof reaches a predetermined transit temperature or a predetermined transit time period has elapsed; and 3) analysing the obtained thermographic image by comparing the so obtained thermographic image with a standard thermographic image.

Abstract: A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.

Abstract: A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.

Abstract: A mechanism is provided for detecting a defect in a populated sample having a thickness dimension substantially smaller than the length and width dimensions thereof, the populated sample having a first side and an opposite second side, at least said first side of said populated sample having one or more Surface Mounted Components.

Abstract: A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a heat pulse by light beam at a selected point on the object; capturing a sequence of consecutive thermal images of the object to record heat diffusion over time resulting from the heat pulse; comparing the heat diffusion over time at the point on said object to a reference; and determining whether the object comprises any defects.

Abstract: A digital system for removing, from a television signal, the electrical noise generated by faulty isolators from power lines. A thin horizontal segment noise detector locates possible noisy pixels (picture elements), and an image horizontal line verifier prevents false alarms given by the noise detector. An image corrector is provided to remove detected noise. The real time algorithm described in the invention is designed to provide a robust detector pseudo independent of noise waveforms, a memory window of three video delay lines, and a low cost digital hardware system.