Abstract: Cold plate for a supercomputer compute blade, said cold plate delimiting at least one opening configured to receive at least one heat sink configured to cool at least one electronic component, said cold plate comprising a cooling circuit, comprising channels within which is configured to circulate a “cold” heat transfer fluid to supply said at least one heat sink, and a discharge circuit, comprising channels within which a “hot” heat transfer fluid is configured to circulate after heating through the at least one heat sink, said cold plate consists of an assembly of several separate elements, wherein each pair of adjacent elements fluidly connected at a portion of the cooling circuit or of the discharge circuit comprises a sealing member at the interface of said connection.

Abstract: An interlayer heat sink for a liquid cooling system for an electronic card, the interlayer heat sink including a cold inlet connector, a hot inlet connector, a hot outlet connector, and a cold outlet connector. An upper part of the cooling block divides the flow of heat transfer fluid entering through the cold inlet connector into a first flow, which is oriented towards the lower part of the cooling block so as to collect heat generated by the electronic card by being conveyed to the hot outlet connector, and a second flow, oriented directly to the cold outlet connector, to convey the flow of heated-up heat transfer fluid received on the hot inlet connector directly to the hot outlet connector where it fuses with the heated-up flow in the lower part of the cooling block.

Abstract: An outlet heat sink for a liquid cooling system for an electronic board, including a cold inlet connector, a hot inlet connector and a hot outlet connector. An upper part of a cooling block, on the one hand, conveys the flow of heat transfer fluid entering through the cold inlet connector to the lower part of the cooling block so as to collect heat generated by the electronic board by being conveyed to the hot outlet connector, and on the other hand, conveys the flow of heated-up heat transfer fluid received on the hot inlet connector directly to the hot outlet connector.

Abstract: Inlet heat sink for a liquid cooling system of an electronic board, comprising a “cold” inlet connector, a “hot” outlet connector, a “cold” outlet connector, the upper part of the cooling block being configured to divide the flow of incoming heat transfer fluid by the cold inlet connector into a first flow oriented to collect the heat generated by the electronic board by being routed to the hot outlet connector, and a second flow, oriented directly to the cold outlet connector.

Abstract: A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surface, at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, at least one contact surface, in thermal contact with the fluid cooling system of said electronic board, a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one exchange surface of each of the two memory modules, the envelope is detachably placed against the two exchange surfaces of each memory module, the envelope is mechanically detachably fastened to the board.

Abstract: A liquid cooling system for a circuit board made up of a cold plate and heat sinks connected to the cold plate by flexible connections.

Abstract: A liquid cooling system for a circuit board made up of a cold plate and heat sinks connected to the cold plate by flexible connections.

Abstract: A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surface, at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, at least one contact surface, in thermal contact with the fluid cooling system of said electronic board, a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one exchange surface of each of the two memory modules, the envelope is detachably placed against the two exchange surfaces of each memory module, the envelope is mechanically detachably fastened to the board.