Patents by Inventor Marc REESE

Marc REESE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • GRADIENT MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) MICROPHONE
    Publication number: 20190110116
    Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.
    Type: Application
    Filed: December 10, 2018
    Publication date: April 11, 2019
    Inventors: John C. BAUMHAUER, JR., Fengyuan LI, Larry A. MARCUS, Alan D. MICHEL, Marc REESE
  • GRADIENT MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) MICROPHONE WITH VARYING HEIGHT ASSEMBLIES
    Publication number: 20180249235
    Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly comprises an enclosure, a single micro-electro-mechanical systems (MEMS) transducer, a substrate layer, and an application housing. The single MEMS transducer is positioned within the enclosure. The substrate layer supports the single MEMS transducer. The application housing supports the substrate layer and defining at least a portion of a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and at least a portion of a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.
    Type: Application
    Filed: April 23, 2018
    Publication date: August 30, 2018
    Inventors: MARC REESE, JOHN BAUMHAUER, FENGYUAN LI, SPIRO IRACLIANOS
  • GRADIENT MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) MICROPHONE
    Publication number: 20150010191
    Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.
    Type: Application
    Filed: January 3, 2014
    Publication date: January 8, 2015
    Applicant: HARMAN INTERNATIONAL INDUSTRIES, INC.
    Inventors: John C. BAUMHAUER, JR., Fengyuan LI, Larry A. MARCUS, Alan D. MICHEL, Marc REESE