Patents by Inventor Marc Robert
Marc Robert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250113433Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.Type: ApplicationFiled: December 12, 2024Publication date: April 3, 2025Applicant: Amphenol CorporationInventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
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Patent number: 12247306Abstract: The present invention describes an electrochemical system (1) to electrochemically reduce carbon monoxide (CO) into liquid methanol and gaseous H2, comprising an electrochemical cell with an anodic compartment with an anode (2) with a current collector (2A), at least a catalyst to electrochemically oxidize H2O, and a cathodic compartment with a cathodic electrolyte solution comprising the solvent (3), and a cathodic supporting electrolyte, the solvent (3) being water at basic pH of between 10.5 and 13.5, the reagent CO; a cathode (4) which comprises, on a current collector (4A) which is electrochemically inert, at least a cobalt molecular catalyst (4B) to electrochemically reduce CO into liquid methanol and the gas H2, a power supply (5) providing the energy necessary to trigger the electrochemical reactions involving the reagent.Type: GrantFiled: April 24, 2020Date of Patent: March 11, 2025Assignees: UNIVERSITÉ PARIS CITÉ, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUEInventors: Marc Robert, Etienne Boutin
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Publication number: 20250057521Abstract: Provided are tissue repair and sealing devices, and methods for the use of tissue repair and sealing devices, for use in both minimally invasive surgical (MIS) procedures and open, non-MIS procedures to rapidly repair tissue fenestrations and create a pressure-resistant, watertight seal in a tissue barrier. Tissue repair and sealing devices disclosed herein comprise an integrated graft and deployable clasp assembly and an applicator assembly having a clasp retain and release member that is slidably connected to a folded, deployable clasp. The applicator assembly places a graft on a tissue inner surface and a deployable clasp on a tissue outer surface to secure the graft to the tissue inner surface to, thereby, repair a tissue fenestration and create a watertight barrier.Type: ApplicationFiled: August 1, 2024Publication date: February 20, 2025Applicant: PatchClamp MedTech, IncInventor: Marc Robert Mayberg
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Patent number: 12226086Abstract: Provided are tissue repair and sealing devices, and methods for the use of tissue repair and sealing devices, for use in both minimally invasive surgical (MIS) procedures and open, non-MIS procedures to rapidly repair tissue fenestrations and create a pressure-resistant, watertight seal in a tissue barrier. Tissue repair and sealing devices disclosed herein comprise an integrated graft and deployable clasp assembly and an applicator assembly having a clasp retain and release member that is slidably connected to a folded, deployable clasp. The applicator assembly places a graft on a tissue inner surface and a deployable clasp on a tissue outer surface to secure the graft to the tissue inner surface to, thereby, repair a tissue fenestration and create a watertight barrier.Type: GrantFiled: November 18, 2021Date of Patent: February 18, 2025Inventor: Marc Robert Mayberg
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Patent number: 12207395Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.Type: GrantFiled: September 27, 2023Date of Patent: January 21, 2025Assignee: Amphenol CorporationInventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
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Publication number: 20240286027Abstract: A non-transitory computer-readable storage medium comprising executable instructions, which when executed by a processor cause a first mobile device to receive a GPS location of the first mobile device. The system further receives a GPS location of one or more discoverable mobile devices. A distance is determined between the first mobile device and the one or more discoverable mobile devices based on the location information provided by a location system such as GPS or cellular triangulation. A display on the first mobile device provides the location information of the first mobile device and the one or more discoverable mobile devices. Movement of the first mobile device and the one or more discoverable devices based on location information is provided to the first mobile device. When the first mobile device is close to the one or more discoverable devices a proximity system may establish a leash. If the digital leash is maintained for a predetermined period of time, the two systems are notified.Type: ApplicationFiled: February 24, 2023Publication date: August 29, 2024Inventors: Sean Harris Nissenbaum, Marc Robert Ilgen, Ian Dricot Andolsek, Scott David Nissenbaum
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Publication number: 20240286028Abstract: A non-transitory computer-readable storage medium comprising executable instructions, which when executed by a processor cause a first mobile device to receive a GPS location of the first mobile device. The system further receives a GPS location of one or more discoverable mobile devices. A distance is determined between the first mobile device and the one or more discoverable mobile devices based on the location information provided by a location system such as GPS or cellular triangulation. A display on the first mobile device provides the location information of the first mobile device and the one or more discoverable mobile devices. Movement of the first mobile device and the one or more discoverable devices based on location information is provided to the first mobile device. When the first mobile device is close to the one or more discoverable devices a user may capture a image or video of the user of the one or more discoverable devices.Type: ApplicationFiled: February 24, 2023Publication date: August 29, 2024Inventors: Scott David Nissenbaum, Marc Robert Ilgen, Ian Dricot Andolsek, Sean Harris Nissenbaum
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Publication number: 20240086214Abstract: A method for electronic device virtualization and management includes transmitting a signal to a server from a client. The signal is initiated by a user of a user interface of the client. The user interface of the client presents at least two devices to the user, which the user may interact with. The signal may include a power cycling instruction directed to at least one of the devices. When the server receives a communication back from the at least one device, it may send the information to the client, where the user interface may be updated in response to the communication. The devices may be controlled with other instructions, such as scheduling instructions, firmware update instructions, and configuration backup instructions. If a power device is virtualized, it may be controlled on a port-by-port basis.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Jaber Jaber, Simon Liu, Victor Pak, Ricardo A. Guerrero, Eric S. Park, Mina Farah, Marc Robert Ilgen, Dusan Jankov
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Publication number: 20240081429Abstract: An electrically heated smoking system includes a secondary unit capable of receiving a smoking article having an aerosol-forming substrate. The secondary unit includes at least one heating element and an interface for connection to a primary power supply for supplying electrical power to the at least one heating element during a pre-heating mode, to increase the temperature of the aerosol-forming substrate to an operating temperature. The secondary unit further includes a secondary power supply arranged to supply electrical power to the at least one heating element during a smoking mode, to maintain the temperature of the aerosol-forming substrate at substantially the operating temperature. The secondary unit also includes secondary circuitry. The electrically heated smoking system optionally includes a primary unit.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Applicant: Philip Morris USA Inc.Inventors: Felix FERNANDO, Marc-Robert CHEMLA, Fredrik STAHLE
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Publication number: 20240083963Abstract: The present invention relates to an immunocytokine comprising (a) a conjugate, and (b) an antibody or a fragment thereof directly or indirectly linked by covalence to said conjugate, wherein said conjugate comprises (i) a polypeptide comprising the amino acid sequence of the interleukin 15 or derivatives thereof, and (ii) a polypeptide comprising the amino acid sequence of the sushi domain of the interleukin 15R alpha (IL-15R?) or derivatives thereof; and uses thereof.Type: ApplicationFiled: July 14, 2023Publication date: March 14, 2024Inventors: Sebastien Daniel Morisseau, Geraldine Teppaz, Yannick Laurent Joseph Jacques, Bruno Gilbert Marc Robert, Guy Luc Michel De Martynoff, David Béchard
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Publication number: 20240023232Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.Type: ApplicationFiled: September 27, 2023Publication date: January 18, 2024Applicant: Amphenol CorporationInventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
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Patent number: 11861385Abstract: A method for electronic device virtualization and management includes transmitting a signal to a server from a client. The signal is initiated by a user of a user interface of the client. The user interface of the client presents at least two devices to the user, which the user may interact with. The signal may include a power cycling instruction directed to at least one of the devices. When the server receives a communication back from the at least one device, it may send the information to the client, where the user interface may be updated in response to the communication. The devices may be controlled with other instructions, such as scheduling instructions, firmware update instructions, and configuration backup instructions. If a power device is virtualized, it may be controlled on a port-by-port basis.Type: GrantFiled: February 6, 2020Date of Patent: January 2, 2024Inventors: Jaber Jaber, Simon Liu, Victor Pak, Ricardo A. Guerrero, Eric S. Park, Mina Farah, Marc Robert Ilgen, Dusan Jankov
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Patent number: 11819063Abstract: An electrically heated smoking system includes a secondary unit capable of receiving a smoking article having an aerosol-forming substrate. The secondary unit includes at least one heating element and an interface for connection to a primary power supply for supplying electrical power to the at least one heating element during a pre-heating mode, to increase the temperature of the aerosol-forming substrate to an operating temperature. The secondary unit further includes a secondary power supply arranged to supply electrical power to the at least one heating element during a smoking mode, to maintain the temperature of the aerosol-forming substrate at substantially the operating temperature. The secondary unit also includes secondary circuitry. The electrically heated smoking system optionally includes a primary unit.Type: GrantFiled: December 13, 2021Date of Patent: November 21, 2023Assignee: PHILIP MORRIS USA INC.Inventors: Felix Fernando, Marc-Robert Chemla, Fredrik Stahle
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Patent number: 11805595Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.Type: GrantFiled: July 25, 2022Date of Patent: October 31, 2023Assignee: Amphenol CorporationInventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
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Patent number: 11765813Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements.Type: GrantFiled: June 28, 2021Date of Patent: September 19, 2023Assignee: Amphenol CorporationInventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
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Patent number: 11753454Abstract: The present invention relates to an immunocytokine comprising (a) a conjugate, and (b) an antibody or a fragment thereof directly or indirectly linked by covalence to said conjugate, wherein said conjugate comprises (i) a polypeptide comprising the amino acid sequence of the interleukin 15 or derivatives thereof, and (ii) a polypeptide comprising the amino acid sequence of the sushi domain of the interleukin 15R alpha (IL-15R?) or derivatives thereof; and uses thereof.Type: GrantFiled: October 12, 2020Date of Patent: September 12, 2023Assignees: Cytune Pharma, INSERM (Institut National de la Santé et de la Recherche Médicale)Inventors: Sebastien Daniel Morisseau, Geraldine Teppaz, Yannick Laurent Joseph Jacques, Bruno Gilbert Marc Robert, Guy Luc Michel De Martynoff, David Bechard
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Patent number: 11553589Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.Type: GrantFiled: March 31, 2021Date of Patent: January 10, 2023Assignee: Amphenol CorporationInventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
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Publication number: 20220361320Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.Type: ApplicationFiled: July 25, 2022Publication date: November 10, 2022Applicant: Amphenol CorporationInventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
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Patent number: D969964Type: GrantFiled: March 6, 2020Date of Patent: November 15, 2022Inventors: Marc Robert, Richard Reckin, Hannah Christensen, Howard Tanner, Dan Olken, Matthew Schneider, Tedd Schneidewend
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Patent number: D1018771Type: GrantFiled: November 15, 2022Date of Patent: March 19, 2024Assignee: PENTAIR RESIDENTIAL FILTRATION, LLCInventors: Marc Robert, Richard Reckin, Hannah Christensen, Howard Tanner, Dan Olken, Matthew Schneider, Tedd Schneidewend