Patents by Inventor Marc Robert

Marc Robert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250113433
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 3, 2025
    Applicant: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Patent number: 12247306
    Abstract: The present invention describes an electrochemical system (1) to electrochemically reduce carbon monoxide (CO) into liquid methanol and gaseous H2, comprising an electrochemical cell with an anodic compartment with an anode (2) with a current collector (2A), at least a catalyst to electrochemically oxidize H2O, and a cathodic compartment with a cathodic electrolyte solution comprising the solvent (3), and a cathodic supporting electrolyte, the solvent (3) being water at basic pH of between 10.5 and 13.5, the reagent CO; a cathode (4) which comprises, on a current collector (4A) which is electrochemically inert, at least a cobalt molecular catalyst (4B) to electrochemically reduce CO into liquid methanol and the gas H2, a power supply (5) providing the energy necessary to trigger the electrochemical reactions involving the reagent.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: March 11, 2025
    Assignees: UNIVERSITÉ PARIS CITÉ, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Marc Robert, Etienne Boutin
  • Publication number: 20250057521
    Abstract: Provided are tissue repair and sealing devices, and methods for the use of tissue repair and sealing devices, for use in both minimally invasive surgical (MIS) procedures and open, non-MIS procedures to rapidly repair tissue fenestrations and create a pressure-resistant, watertight seal in a tissue barrier. Tissue repair and sealing devices disclosed herein comprise an integrated graft and deployable clasp assembly and an applicator assembly having a clasp retain and release member that is slidably connected to a folded, deployable clasp. The applicator assembly places a graft on a tissue inner surface and a deployable clasp on a tissue outer surface to secure the graft to the tissue inner surface to, thereby, repair a tissue fenestration and create a watertight barrier.
    Type: Application
    Filed: August 1, 2024
    Publication date: February 20, 2025
    Applicant: PatchClamp MedTech, Inc
    Inventor: Marc Robert Mayberg
  • Patent number: 12226086
    Abstract: Provided are tissue repair and sealing devices, and methods for the use of tissue repair and sealing devices, for use in both minimally invasive surgical (MIS) procedures and open, non-MIS procedures to rapidly repair tissue fenestrations and create a pressure-resistant, watertight seal in a tissue barrier. Tissue repair and sealing devices disclosed herein comprise an integrated graft and deployable clasp assembly and an applicator assembly having a clasp retain and release member that is slidably connected to a folded, deployable clasp. The applicator assembly places a graft on a tissue inner surface and a deployable clasp on a tissue outer surface to secure the graft to the tissue inner surface to, thereby, repair a tissue fenestration and create a watertight barrier.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: February 18, 2025
    Inventor: Marc Robert Mayberg
  • Patent number: 12207395
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Grant
    Filed: September 27, 2023
    Date of Patent: January 21, 2025
    Assignee: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Publication number: 20240286027
    Abstract: A non-transitory computer-readable storage medium comprising executable instructions, which when executed by a processor cause a first mobile device to receive a GPS location of the first mobile device. The system further receives a GPS location of one or more discoverable mobile devices. A distance is determined between the first mobile device and the one or more discoverable mobile devices based on the location information provided by a location system such as GPS or cellular triangulation. A display on the first mobile device provides the location information of the first mobile device and the one or more discoverable mobile devices. Movement of the first mobile device and the one or more discoverable devices based on location information is provided to the first mobile device. When the first mobile device is close to the one or more discoverable devices a proximity system may establish a leash. If the digital leash is maintained for a predetermined period of time, the two systems are notified.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 29, 2024
    Inventors: Sean Harris Nissenbaum, Marc Robert Ilgen, Ian Dricot Andolsek, Scott David Nissenbaum
  • Publication number: 20240286028
    Abstract: A non-transitory computer-readable storage medium comprising executable instructions, which when executed by a processor cause a first mobile device to receive a GPS location of the first mobile device. The system further receives a GPS location of one or more discoverable mobile devices. A distance is determined between the first mobile device and the one or more discoverable mobile devices based on the location information provided by a location system such as GPS or cellular triangulation. A display on the first mobile device provides the location information of the first mobile device and the one or more discoverable mobile devices. Movement of the first mobile device and the one or more discoverable devices based on location information is provided to the first mobile device. When the first mobile device is close to the one or more discoverable devices a user may capture a image or video of the user of the one or more discoverable devices.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 29, 2024
    Inventors: Scott David Nissenbaum, Marc Robert Ilgen, Ian Dricot Andolsek, Sean Harris Nissenbaum
  • Publication number: 20240086214
    Abstract: A method for electronic device virtualization and management includes transmitting a signal to a server from a client. The signal is initiated by a user of a user interface of the client. The user interface of the client presents at least two devices to the user, which the user may interact with. The signal may include a power cycling instruction directed to at least one of the devices. When the server receives a communication back from the at least one device, it may send the information to the client, where the user interface may be updated in response to the communication. The devices may be controlled with other instructions, such as scheduling instructions, firmware update instructions, and configuration backup instructions. If a power device is virtualized, it may be controlled on a port-by-port basis.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Jaber Jaber, Simon Liu, Victor Pak, Ricardo A. Guerrero, Eric S. Park, Mina Farah, Marc Robert Ilgen, Dusan Jankov
  • Publication number: 20240081429
    Abstract: An electrically heated smoking system includes a secondary unit capable of receiving a smoking article having an aerosol-forming substrate. The secondary unit includes at least one heating element and an interface for connection to a primary power supply for supplying electrical power to the at least one heating element during a pre-heating mode, to increase the temperature of the aerosol-forming substrate to an operating temperature. The secondary unit further includes a secondary power supply arranged to supply electrical power to the at least one heating element during a smoking mode, to maintain the temperature of the aerosol-forming substrate at substantially the operating temperature. The secondary unit also includes secondary circuitry. The electrically heated smoking system optionally includes a primary unit.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: Philip Morris USA Inc.
    Inventors: Felix FERNANDO, Marc-Robert CHEMLA, Fredrik STAHLE
  • Publication number: 20240083963
    Abstract: The present invention relates to an immunocytokine comprising (a) a conjugate, and (b) an antibody or a fragment thereof directly or indirectly linked by covalence to said conjugate, wherein said conjugate comprises (i) a polypeptide comprising the amino acid sequence of the interleukin 15 or derivatives thereof, and (ii) a polypeptide comprising the amino acid sequence of the sushi domain of the interleukin 15R alpha (IL-15R?) or derivatives thereof; and uses thereof.
    Type: Application
    Filed: July 14, 2023
    Publication date: March 14, 2024
    Inventors: Sebastien Daniel Morisseau, Geraldine Teppaz, Yannick Laurent Joseph Jacques, Bruno Gilbert Marc Robert, Guy Luc Michel De Martynoff, David Béchard
  • Publication number: 20240023232
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Applicant: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Patent number: 11861385
    Abstract: A method for electronic device virtualization and management includes transmitting a signal to a server from a client. The signal is initiated by a user of a user interface of the client. The user interface of the client presents at least two devices to the user, which the user may interact with. The signal may include a power cycling instruction directed to at least one of the devices. When the server receives a communication back from the at least one device, it may send the information to the client, where the user interface may be updated in response to the communication. The devices may be controlled with other instructions, such as scheduling instructions, firmware update instructions, and configuration backup instructions. If a power device is virtualized, it may be controlled on a port-by-port basis.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: January 2, 2024
    Inventors: Jaber Jaber, Simon Liu, Victor Pak, Ricardo A. Guerrero, Eric S. Park, Mina Farah, Marc Robert Ilgen, Dusan Jankov
  • Patent number: 11819063
    Abstract: An electrically heated smoking system includes a secondary unit capable of receiving a smoking article having an aerosol-forming substrate. The secondary unit includes at least one heating element and an interface for connection to a primary power supply for supplying electrical power to the at least one heating element during a pre-heating mode, to increase the temperature of the aerosol-forming substrate to an operating temperature. The secondary unit further includes a secondary power supply arranged to supply electrical power to the at least one heating element during a smoking mode, to maintain the temperature of the aerosol-forming substrate at substantially the operating temperature. The secondary unit also includes secondary circuitry. The electrically heated smoking system optionally includes a primary unit.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: November 21, 2023
    Assignee: PHILIP MORRIS USA INC.
    Inventors: Felix Fernando, Marc-Robert Chemla, Fredrik Stahle
  • Patent number: 11805595
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: October 31, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Patent number: 11765813
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: September 19, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Patent number: 11753454
    Abstract: The present invention relates to an immunocytokine comprising (a) a conjugate, and (b) an antibody or a fragment thereof directly or indirectly linked by covalence to said conjugate, wherein said conjugate comprises (i) a polypeptide comprising the amino acid sequence of the interleukin 15 or derivatives thereof, and (ii) a polypeptide comprising the amino acid sequence of the sushi domain of the interleukin 15R alpha (IL-15R?) or derivatives thereof; and uses thereof.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: September 12, 2023
    Assignees: Cytune Pharma, INSERM (Institut National de la Santé et de la Recherche Médicale)
    Inventors: Sebastien Daniel Morisseau, Geraldine Teppaz, Yannick Laurent Joseph Jacques, Bruno Gilbert Marc Robert, Guy Luc Michel De Martynoff, David Bechard
  • Patent number: 11553589
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: January 10, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Publication number: 20220361320
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Applicant: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Patent number: D969964
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: November 15, 2022
    Inventors: Marc Robert, Richard Reckin, Hannah Christensen, Howard Tanner, Dan Olken, Matthew Schneider, Tedd Schneidewend
  • Patent number: D1018771
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: March 19, 2024
    Assignee: PENTAIR RESIDENTIAL FILTRATION, LLC
    Inventors: Marc Robert, Richard Reckin, Hannah Christensen, Howard Tanner, Dan Olken, Matthew Schneider, Tedd Schneidewend