Abstract: The present invention provides a method and a device for operating an electric machine for a soft changeover from a normal or free-wheel mode to an active short-circuit. To this end, a voltage with which the electric machine is actuated is first reduced in a defined manner to a predefined, preferably very low value and then the phase connections of the electric machine are short-circuited. Excessively high overcurrents, particularly overcurrents greater than the nominal current of the electric machine, can thus be avoided.

Abstract: Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece while allowing thermally-induced motion of the workpiece, which may include thermal bowing or thermal bending. The system may include a support member having a moveable engagement portion engageable with the workpiece, the engagement portion being moveable to allow the thermally-induced motion of the workpiece while supporting the workpiece. The moveable engagement portion may include a plurality of moveable engagement portions of a plurality of respective support members, which may be resiliently engageable with the workpiece. The support members may include flexible support members each having an unconstrained portion and a constrained portion, and the moveable engagement portions may include the unconstrained portions.

Abstract: The present invention provides a method and a device for operating an electric machine for a soft changeover from a normal or free-wheel mode to an active short-circuit. To this end, a voltage with which the electric machine is actuated is first reduced in a defined manner to a predefined, preferably very low value and then the phase connections of the electric machine are short-circuited. Excessively high overcurrents, particularly overcurrents greater than the nominal current of the electric machine, can thus be avoided.

Abstract: An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.

Abstract: The present invention relates to microcapsules comprising a pesticide-containing capsule core and a capsule wall, and to a process for the preparation of these microcapsules. Furthermore, the invention relates to an agrochemical formulation comprising the microcapsules, and to the use of the microcapsules for controlling phytopathogenic fungi and/or undesired plant growth and/or undesired insect or mite infestation and/or for regulating the growth of plants.

Abstract: An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.

Abstract: Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece while allowing thermally-induced motion of the workpiece, which may include thermal bowing or thermal bending. The system may include a support member having a moveable engagement portion engageable with the workpiece, the engagement portion being moveable to allow the thermally-induced motion of the workpiece while supporting the workpiece. The moveable engagement portion may include a plurality of moveable engagement portions of a plurality of respective support members, which may be resiliently engageable with the workpiece. The support members may include flexible support members each having an unconstrained portion and a constrained portion, and the moveable engagement portions may include the unconstrained portions.