Abstract: Wafer processing furnace apparatus for providing adjustability for a door sealed to the furnace, the furnace being of the type having a door through which a wafer paddle is disposed. An alignment collar is disposed in the furnace door and having a bore through which the wafer paddle passes. The bore is offset so that when the collar is rotated, the door is moved in a plane perpendicular to the paddle axis. The door includes a seal assembly, including a bellows that is sealed with an O-ring at one end of the door, and sealed with an O-ring at another end to an alignment plate which also has an offset bore. The alignment plate and the bellows is rotated in correspondence with the alignment collar when adjusting the door to prevent tilting thereof. The alignment plate is fastened to an attachment plate which is fixed to the wafer paddle.